Semiconductor device

Method of forming bends in a wire loop

Oblique parts or surfaces

Methods for fabricating semiconductor components with conductive interconnects having planar surfaces

Semiconductor device with solder balls having high reliability

Method for producing chip with adhesive applied

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Method for manufacturing passive device and semiconductor package using thin metal piece

Method for fabricating flip-attached and underfilled semiconductor devices

Integrated circuit device and method of manufacturing thereof

Semiconductor device and fabrication method thereof

Die assemblies

ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION

COPPER-CLAD LAMINATE WITH CAPACITOR, PRINTED CIRCUIT BOARD HAVING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE PRINTED CIRCUIT BOARD

Method and apparatus for making a radio frequency inlay

Semiconductor device including DC-DC converter

Methods for forming an RF device with trench under bond pad feature

SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

Semiconductor chip bump connection apparatus and method

Manufacturing method of semiconductor device, and semiconductor device

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Apparatus and method for packaging circuits

Manufacturing fan-out wafer level packaging

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA

Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Leadless integrated circuit packaging system and method of manufacture thereof

Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof

Integrated circuit packaging system with stacked paddle and method of manufacture thereof

Interconnection of lead frame to die utilizing flip chip process

Alpha shielding techniques and configurations

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Stacked semiconductor component having through wire interconnect

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

High frequency semiconductor device

Semiconductor device

Package for Semiconductor Devices

Electronic device and method for manufacturing the same

Oblique parts or surfaces

Bonding tool, electronic component mounting apparatus and electronic component mounting method

Self-assembled electrical contacts

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Method for manufacturing a wiring board

Microarray package with plated contact pedestals

Flexible diode package and method of manufacturing

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Misalignment detection devices

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor integrated circuit device

Semiconductor device with solder bump formed on high topography plated Cu pads

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

Compact semiconductor package with integrated bypass capacitor and method

Flip-chip package structure and the die attach method thereof

Top-side cooled semiconductor package with stacked interconnection plates and method

Semiconductor device and manufacturing method thereof

Device including a semiconductor chip and metal foils

Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die

Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

Method for producing electronic component and electronic component

Method for producing semiconductor components and thin-film semiconductor component

Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component

Wire bonding apparatus, record medium storing bonding control program , and bonding method

Method of manufacturing semiconductor device

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Dicing die-bonding film and process for producing semiconductor device

Method of manufacturing a semiconductor package with a bump using a carrier

Electronic package structure and method

MULTI CHIP STACKING WITH RELIABLE JOINING

Method for bonding semiconductor wafers and method for manufacturing semiconductor device

Semiconductor device including a DC-DC converter having a metal plate

Interconnect System without Through-Holes

Semiconductor module with edge termination and process for its fabrication

Integrated circuit module and method of packaging same

Device including a semiconductor chip

Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation

Semiconductor device and package with bit cells and power supply electrodes

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES

Package structure

Semiconductor packages

Power semiconductor module with segmented base plate

Lead frame, method for manufacturing the same and semiconductor device

Chip package and manufacturing method thereof

Leadframe-based chip scale semiconductor packages

Very extremely thin semiconductor package

Semiconductor package having isolated inner lead

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor device and method of forming WLCSP using wafer sections containing multiple die

Method of manufacturing a semiconductor device

Light emitting diode package and manufacturing method thereof

Semiconductor module including a switch and non-central diode

High temperature, stable SiC device interconnects and packages having low thermal resistance

Bond head for heavy wire bonder

Carbon nanotubes solder composite for high performance interconnect

Method of manufacturing a semiconductor package using a carrier

ELECTRONIC PACKAGE STRUCTURE AND METHOD

Printing semiconductor elements by shear-assisted elastomeric stamp transfer

Flexible and stackable semiconductor die packages having thin patterned conductive layers

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

Electronic package structure having conductive strip and method

Base package system for integrated circuit package stacking and method of manufacture thereof

Double solid metal pad with reduced area

Semiconductor integrated circuit devices and display apparatus including the same

FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package

Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same

Semiconductor device

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Method for forming an isolated inner lead from a leadframe

SEMICONDUCTOR DEVICE

Passivation layer for a circuit device and method of manufacture

Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

Method of manufacturing semiconductor device

Integrated circuit package and a method for dissipating heat in an integrated circuit package

Method for reducing chip warpage

Method of fabricating quad flat non-leaded package

Method for manufacturing magnetic memory chip device

Spread spectrum isolator

ENHANCED TRACES OF FLEXIBLE TAB CIRCUIT FOR ATTACHMENT ON BOND PADS OF INKJET PRINTHEAD CHIP IN PRINTHEAD CARTRIDGE ASSEMBLY

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS

Semiconductor device having stacked multiple substrates and method for producing same

Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers

Top layers of metal for high performance IC's

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Structure and method for stacked wafer fabrication

Semiconductor device and a manufacturing method of the same

Chip package structure

Planar multi semiconductor chip package

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Integrated circuit package

Semiconductor device

Bond pad array for complex IC

Microarray package with plated contact pedestals

Integrated circuit package system with encapsulation lock and method of manufacture thereof

Semiconductor body and method for the design of a semiconductor body with a connecting line

Semiconductor device

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Electrical microfilament to circuit interface

Adhesive film, connecting method, and joined structure

Component with Mechanically Loadable Connecting Surface

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Method for producing semiconductor chips using thin film technology

Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

Plating method, semiconductor device fabrication method and circuit board fabrication method

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Manufacturing method for semiconductor device embedded substrate

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

Inner-connecting structure of lead frame and its connecting method

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES

Method for manufacturing an electronic device

TCP-type semiconductor device and method of testing thereof

Semiconductor body and method for voltage regulation

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

Semiconductor device in which a semiconductor chip is sealed

Stacked integrated circuit packages that include monolithic conductive vias

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor device including a reduced stress configuration for metal pillars

Chip structure and chip package structure

SEMICONDUCTOR DEVICE

Flip chip with interposer

SEMICONDUCTOR DEVICE

Less expensive high power plastic surface mount package

Semiconductor device

Semiconductor packing having offset stack structure

Semiconductor memory device and semiconductor memory card

Semiconductor device including semiconductor chip mounted on lead frame

Semiconductor die package including lead with end portion

Pre-molded, clip-bonded multi-die semiconductor package

SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT

Semiconductor device and manufacturing method thereof

OVER THE MOLD PHOSPHOR LENS FOR AN LED

POWER SEMICONDUCTOR MODULE

Semiconductor device

Closed loop wire bonding methods and bonding force calibration

Connecting wire and method for manufacturing same

Combined diode, lead assembly incorporating an expansion joint

Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING SEMICONDUCTOR DEVICE PROVIDED WITH FLIP-CHIP MOUNTED SEMICONDUCTOR ELEMENT

Direct die attach utilizing heated bond head

Single-layer component package

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

Anisotropic conductive material, connected structure, and production method thereof

Semiconductor device

Electronic circuit for controlling a power field effect transistor

Semiconductor device and manufacturing method thereof

Hybrid Semiconductor Chip Package

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

Semiconductor package and manufacturing method thereof

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

POWER MODULE AND INVERTER FOR VEHICLES

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Semiconductor device

Electronic component built-in substrate and method of manufacturing the same

Electronic component embedded printed circuit board and manufacturing method thereof

APPLICATION OF A SELF-ASSEMBLED MONOLAYER AS AN OXIDE INHIBITOR

Optoelectronic device having a multi-layer solder and manufacturing method thereof

Manufacturing method for protection circuit module of secondary battery

DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Solder joint flip chip interconnection having relief structure

Process for spontaneous deposition from an organic solution

Assembling stacked substrates that can form 3-D structures

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Semiconductor device and method of manufacturing the same

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Stackable semiconductor assemblies and methods of manufacturing such assemblies

CLAMPING ASSEMBLY

Thermally improved semiconductor QFN/SON package

Semiconductor integrated circuit device

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Wire bonding method

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Dicing/die bonding film

Bonding apparatus and bonding method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device and method of manufacturing the same

Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module

Packaging systems and methods

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Forming solder balls on substrates

Bonding apparatus and bonding method

Arrangement for hermetically sealing components, and method for the production thereof

Semiconductor power conversion apparatus and method of manufacturing the same

LITHOGRAPHIC CONTACT ELEMENTS

METHOD FOR PACKAGING SEMICONDUCTOR

Module having a stacked passive element and method of forming the same

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

Semiconductor package having bump ball

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Die rearrangement package structure using layout process to form a compliant configuration

Dual or multiple row package

Module having a stacked passive element and method of forming the same

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

Twin-chip-mounting type diode

Transfer tape strap process

Double-sided connector with protrusions

Method for manufacturing semiconductor device having electrode for external connection

Thermosetting die-bonding film

Circuit device and method of manufacturing the same

Adhesive tape and semiconductor device using the same

Electronic device and method of manufacturing same

Window BGA semiconductor package

Method of forming a semiconductor package including two devices

Chip package structure and fabricating method thereof

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Low cost flexible substrate

Microelectronic package with carbon nanotubes interconnect and method of making same

System and method for pre-patterned embedded chip build-up

Semiconductor package system with through silicon via interposer

Lead frame and method of manufacturing the same

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

On-chip RF shields with front side redistribution lines

Packaging technology

Lock and key through-via method for wafer level 3 D integration and structures produced

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

SEMICONDUCTOR DEVICE

Wire bonding apparatus and ball forming method

Device and method for making a semiconductor device including bonding two bonding partners

Printed circuit board including electronic component embedded therein and method of manufacturing the same

ADHESIVE FOR ELECTRONIC COMPONENTS

Method of forming assymetrical encapsulant bead

METHOD OF REDUCING VOIDS IN ENCAPSULANT

Method and apparatus for fabricating self-assembling microstructures

Method of controlling satellite drops from an encapsulant jetter

Part mounting device

Connection by fitting together two soldered inserts

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

Semiconductor device including a sintered insulation material

Wire bonding structure and manufacturing method thereof