Fixture to constrain laminate and method of assembly

Methods and apparatus for measuring analytes using large scale FET arrays

Tooling for coupling multiple electronic chips

Method for permanent connection of two metal surfaces

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Semiconductor package with conductive clip

Chip package and method for fabricating the same

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and method of forming wafer level ground plane and power ring

Semiconductor device and a method of manufacturing the same

Semiconductor device having electrode pads arranged between groups of external electrodes

Electronic device and method for production

Semiconductor device and a method of manufacturing the same

Semiconductor device

Methods for forming pillar bumps on semiconductor wafers

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device for preventing crack in pad region and fabricating method thereof

Systems and methods for bonding semiconductor elements

Semiconductor dies with recesses, associated leadframes, and associated systems and methods

Integrated antennas in wafer level package

Singulation method for semiconductor package with plating on side of connectors

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection

Method of producing a hybridized device including microelectronic components

Power semiconductor device with a double metal contact and related method

Package carrier, semiconductor package, and process for fabricating same

Circuit module and method of manufacturing the same

Leadless chip carrier having improved mountability

Method of producing a semiconductor package

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Three dimensional device integration method and integrated device

Laser assisted transfer welding process

Semiconductor device and production method therefor

Semiconductor device, method for manufacturing the same, and electronic device

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Resin-encapsulated semiconductor device and its manufacturing method

Method of manufacturing a semiconductor device

Method of producing an interposer with microspring contacts

Semiconductor device and method for production of semiconductor device

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor die mount by conformal die coating

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Semiconductor light-emitting device, method for producing same, and display device

Stackable molded microelectronic packages with area array unit connectors

Semiconductor device and a method of manufacturing the same

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Room temperature metal direct bonding

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and a method of manufacturing the same

Template and pattern forming method

High efficiency module

Method of manufacturing semiconductor device

Thin plastic leadless package with exposed metal die paddle

Light emitting device and method for manufacturing light emitting device

Stacked packaging improvements

Electronic component with a leadframe

Method for forming package systems having interposers

Light emitting device and method for manufacturing same

Memory device structure

Semiconductor device and lead frame used for the same

Selective die electrical insulation by additive process

Adhesive composition, adhesive sheet and production process for semiconductor device

Substrate interconnections having different sizes

Semiconductor devices with recessed interconnects

Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Four D device process and structure

Semiconductor device having low on resistance

Method of forming an integrated circuit device including a pillar capped by barrier layer

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device

Semiconductor device and a method of manufacturing the same

Three-dimensional semiconductor architecture

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and method for manufacturing the same

Circuit module and method of manufacturing the same

Microelectronic packages having cavities for receiving microelectronic elements

Power semiconductor package

3D IC method and device

Off-chip vias in stacked chips

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Method of making a stacked microelectronic package

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same

Semiconductor device

Method of forming post-passivation interconnect structure

Semiconductor chip having different conductive pad widths and method of making layout for same

Method of manufacturing a carrier tape

Semiconductor device and method of forming bump-on-lead interconnection

Integrated circuit package and method of forming the same

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Multiple die layout for facilitating the combining of an individual die into a single die

Module comprising a semiconductor chip

Manufacture of a circuit board and circuit board containing a component

Semiconductor device with output circuit and pad arrangements

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Three dimensional device integration method and integrated device

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Power semiconductor package with conductive clips

Semiconductor device structure and manufacturing method

Electronic device including soldered surface-mount component

Package structure and manufacturing method

Semiconductor device

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

Microelectronic elements with post-assembly planarization

Mixed alloy solder paste

Microelectronic packages with nanoparticle joining

RFID tags and processes for producing RFID tags

Solder paste, joining method using the same and joined structure

Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap

Mixed alloy solder paste

Impedance controlled electrical interconnection employing meta-materials

Package assembly having a semiconductor substrate

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste

Core ball, solder paste, formed-solder, flux-coated core ball and solder joint

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Semiconductor device

Semiconductor device

Method of fabricating bump structure and bump structure

Method of fabricating a bond pad structure

Wireless communication system

Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same

Optoelectronic system

Solder in cavity interconnection structures

Semiconductor device

Grid array connection device and method

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Molding method for COB-EUSB devices and metal housing package

Insulated gate semiconductor device and method

Method and apparatus for multi-chip structure semiconductor package

Method for manufacturing semiconductor apparatus

Formation of alpha particle shields in chip packaging

Electronic module with EMI protection

Method for manufacturing an electronic module and an electronic module

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Semiconductor device and a method of manufacturing the same

Semiconductor device and semiconductor device mounting structure

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

Semiconductor device with sealed semiconductor chip

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Method of producing a transponder and a transponder

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Electrochemical deposition method

Semiconductor die contact structure and method

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor element

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Processes and structures for IC fabrication

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Semiconductor device and manufacturing method thereof

Stacked packaging improvements

Semiconductor device for battery power voltage control

Semiconductor device and method of manufacturing

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

High efficiency module

Vertical LED chip package on TSV carrier

Semiconductor package

Printed wiring board and method for manufacturing the same

Multiple access over proximity communication

Method of room temperature covalent bonding

Method of forming a memory device

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor packages and methods of packaging semiconductor devices

Substrateless power device packages

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Multilayer pillar for reduced stress interconnect and method of making same

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Method for manufacturing a fan-out WLP with package

Method for fabricating multi-chip stack structure

Electronic module

Structures and methods for improving solder bump connections in semiconductor devices

Pad configurations for an electronic package assembly

Wafer scale package for high power devices

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Multi-function and shielded 3D interconnects

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device

Semiconductor device and method of forming thermal lid for balancing warpage and thermal management

Heat-transfer structure

III-Nitride device with solderable front metal

Method of forming package systems having interposers

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Methods of fluxless micro-piercing of solder balls, and resulting devices

Bonded body and semiconductor module

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

Semiconductor device and a method of manufacturing the same

Electronic devices with yielding substrates

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Apparatus for thermal melting process and method of thermal melting process

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Leadless semiconductor package and method of manufacture

Method of forming an integrated inductor by dry etching and metal filling

Dual lead frame semiconductor package and method of manufacture

Room temperature metal direct bonding

Warp compensated electronic assemblies

Semiconductor device and method for manufacturing semiconductor device

Method of making a pillar structure having a non-metal sidewall protection structure

Pillar bumps and process for making same

Semiconductor device and method for manufacturing the same

Semiconductor device including cooler

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

Semiconductor device and radio communication device

Semiconductor device

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor package with single sided substrate design and manufacturing methods thereof

Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier

Wireless communication system

Copper pillar bump with cobalt-containing sidewall protection layer

Compliant interconnects in wafers

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

Semiconductor device and method of forming insulating layer around semiconductor die

Method of making a conductive pillar bump with non-metal sidewall protection structure

Bonding structure and method

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Chip package and manufacturing method thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Semiconductor device

Resin-encapsulated semiconductor device and its manufacturing method

Dual lead frame semiconductor package and method of manufacture

Forming semiconductor chip connections

Semiconductor device including DC-DC converter

Semiconductor device

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Power semiconductor device with a double metal contact

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Wafer backside interconnect structure connected to TSVs

Stackable package by using internal stacking modules

Semiconductor device and method of forming high routing density interconnect sites on substrate

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Power semiconductor package

Integrated circuit package including embedded thin-film battery

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Wafer backside interconnect structure connected to TSVs

Semiconductor device and a method of manufacturing the same

Lead and lead frame for power package

Materials, structures and methods for microelectronic packaging

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

Resin-sealed semiconductor device and associated wiring and support structure

Chip and manufacturing method thereof

Passivated copper chip pads

Stacked semiconductor package

Solder joint flip chip interconnection

Carrier tape for tab-package and manufacturing method thereof

System and method of sensing current in a power semiconductor device

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor device and method for manufacturing the same

Semiconductor device, method for manufacturing the same, and electronic device

Pb-free solder bumps with improved mechanical properties

Method of manufacturing semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Three-dimensional semiconductor architecture

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Methods for bonding a die and a substrate

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die

Semiconductor component comprising copper metallizations

Semiconductor devices that include a die bonded to a substrate with a gold interface layer

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Leadframe, semiconductor device, and method of manufacturing the same

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV