Chip package structure

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor device with signal line having decreased characteristic impedance

Front-end processing of nickel plated bond pads

Semiconductor device and method for manufacturing the same, package for LCD driver

Electrical conducting structure and liquid crystal display device comprising the same

Semiconductor component having a CSP housing

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Interposer with flexible solder pad elements and methods of manufacturing the same

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Semiconductor package with flip chip on leadless leadframe

LOC semiconductor assembled with room temperature adhesive

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

Semiconductor package having a grid array of pin-attached balls

Die bonding apparatus

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method for forming microelectronic spring structures on a substrate

Substrates including alignment fences

Collars, support structures, and forms for protruding conductive structures

Semiconductor device

Formation method and structure of conductive bumps

Semiconductor device and method of manufacturing a semiconductor device

Method for mounting a chip on a base and arrangement produced by this method

Substrate-based BGA package, in particular FBGA package

Semiconductor package and method for its manufacture

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Electronic module with layer of adhesive and process for producing it

Damascene patterning of barrier layer metal for C4 solder bumps

Wirebonding method and apparatus

Strap bonding machine and method of manufacturing a semiconductor device

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods and apparatuses relating to block configurations and fluidic self-assembly processes

Method of manufacturing semiconductor device

Castellation wafer level packaging of integrated circuit chips

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Substrate for mounting IC chip

Method for manufacturing surface acoustic wave device

Semiconductor package including rivet for bonding of lead posts

Top layers of metal for high performance IC's

Connection between a semiconductor chip and a circuit component with a large contact area

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Circuit device with at least partial packaging and method for forming

Semiconductor chip assembly with metal containment wall and solder terminal

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

IMPROVED DECAL SOLDER TRANSFER METHOD

Bonding method and bonding apparatus

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

Method of manufacturing a wiring board

High thermal cycle conductor system

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Electronic package having a folded flexible substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Mounting semiconductor chips

Method for manufacturing surface acoustic wave device

Electronic device package

Bond pad structure for copper metallization having increased reliability and method for fabricating same

Substrate based unmolded package

BGA package with concave shaped bonding pads

Microelectronic devices

Flip-chip without bumps and polymer for board assembly

Bonding pad and chip structure

Thermal interposer for cooled electrical packages

Castellation wafer level packaging of integrated circuit chips

Semiconductor component having stacked, encapsulated dice and method of fabrication

Stacked semiconductor device and semiconductor memory module

Plastic encapsulated semiconductor device with reliable down bonds

Semiconductor device and method of manufacturing same

Lead frame for improving molding reliability and semiconductor package with the lead frame

Image sensor package and method of manufacturing the same

Semiconductor integrated circuit device

Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

Under bump metallurgy process on passivation opening

Highly compliant plate for wafer bonding

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Modified chip attach process and apparatus

Substrate based unmolded package

Electrode contact structure

Electronic assembly having multi-material interconnects

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Chip-to-chip trench circuit structure

Packaging stacked chips with finger structure

Low inductance semiconductor device having half-bridge configuration

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multi-component integrated circuit contacts

Integrated circuit package including embedded thin-film battery

Package Structure

Taped lead frames and methods of making and using the same in semiconductor packaging

Circular wire-bond pad, package made therewith, and method of assembling same

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Method of stacking wafers with anisotropic conductive adhesive

Leadless semiconductor package and method for manufacturing the same

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Semiconductor chip package manufacturing method including screen printing process

Electronic device package

Electrical package employing segmented connector and solder joint

Method and apparatus for mapping a position of a capillary tool tip using a prism

Pad-limited integrated circuit

Electrostatic discharge (ESD) protection for integrated circuit packages

Circuit film with bump, film package using the same, and related fabrication methods

Lead solder indicator and method

Semiconductor device with wire bond inductor and method

Multi-chip semiconductor connector assemblies

Method of embedding semiconductor element in carrier and embedded structure thereof

Semiconductor package including a semiconductor device, and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates

Method of soldering electronic component having solder bumps to substrate

In-situ alloyed solders, articles made thereby, and processes of making same

Die attach area cut-on-fly method and apparatus

Ball bonding method and ball bonding apparatus

Apparatus and method for indexing of substrates and lead frames

Capillary for wire bonding

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Stud bump socket

High density bonding of electrical devices

High-reliability solder joint for printed circuit board and semiconductor package module using the same

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Semiconductor device and manufacturing method thereof

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Semiconductor die package with internal bypass capacitors

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Apparatus for providing capacitive decoupling between on-die power and ground conductors

Multiple device package

Printed wiring board

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Semiconductor assembly having substrate with electroplated contact pads

Semiconductor, electrooptic apparatus and electronic apparatus

Semiconductor device

Semiconductor device, manufacturing method and apparatus for the same

Wire bonding wedge

Bondhead for wire bonding apparatus

Method of forming a lead-free bump and a plating apparatus therefor

Compliant spring contact structures

Flexible scrub ring contact

Stackable semiconductor chip layer comprising prefabricated trench interconnect vias

Method for fabricating chip structure

Compound semiconductor device and manufacturing method thereof

Method for forming bump on electrode pad with use of double-layered film

Chip scale package with open substrate

High density flip chip interconnections

Heat-decaying materials, transfer sheet using the same, and patterning method

Manufacturing method of semiconductor device

Reconstructed semiconductor wafers including alignment droplets contacting alignment vias

Capping of metal interconnects in integrated circuit electronic devices

Lead-free conductive jointing bump

Method of forming a solder bump and the structure thereof

Pre-doped reflow interconnections for copper pads

Package and method for packaging an integrated circuit die

High density multilayer circuit module

Vertical conduction power electronic device package and corresponding assembling method

Semiconductor device having inductor

Separately strained N-channel and P-channel transistors

Compound semiconductor device and manufacturing method thereof

Lead-free bonding systems

Spread spectrum isolator

Method and apparatus for cleaning mounting nozzle, and mounting machine

Semiconductor device with reduced contact resistance

Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus

Method of manufacturing semiconductor device

Method for forming interconnects on thin wafers

Methods of making microelectronic packages

RF isolator for isolating voltage sensing and gate drivers

RF isolator with differential input/output

Methods for making electronic devices with small functional elements supported on a carriers

Electronic devices with small functional elements supported on a carrier

Method of making photolithographically-patterned out-of-plane coil structures

Optimized driver layout for integrated circuits with staggered bond pads

Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Apparatus and method for wire bonding and die attaching

Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell

Semiconductor device and method capable of scribing chips with high yield

Semiconductor device

Semiconductor device having adhesion increasing film to prevent peeling

Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing

Semiconductor package including redistribution pattern and method of manufacturing the same

Component built-in module and method for producing the same

System-in-package (SIP) structure and fabrication thereof

Semiconductor equipment having multiple semiconductor devices and multiple lead frames

On chip transformer isolator

Soldering method and solder joints formed therein

Novel aqueous based metal etchant

Wire-bonding method for chips with copper interconnects by introducing a thin layer

Manufacturing method of semiconductor device

Process of bonding circuitry components

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Semiconductor device and method of manufacturing the same

Plasma processing method and method for fabricating electronic component module using the same

Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units

Integrated circuit packages with reduced stress on die and associated methods

Top layers of metal for high performance IC's

Package warpage control

Refractory solid, adhesive composition, and device, and associated method

Integrated power amplifier module with power sensor

Circuit device and manufacturing method thereof

Method for manufacturing circuit device

Semiconductor device

Asymmetric bump structure

Circuit device and manufacturing method thereof

Cold weld hermetic MEMS package and method of manufacture

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and a method of manufacturing the same

Integrated circuit leadframe and fabrication method therefor

Semiconductor device and method for manufacturing the same

Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof

Wire bonding method and apparatus for integrated circuit

Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of manufacturing circuit device

Multi-band tunable resonant circuit

Top layers of metal for high performance IC's

Method for fabricating leadless packages with mold locking characteristics

Method for fabrication of wafer level package incorporating dual compliant layers

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method and system for applying an adhesive substance on an electronic device

Dual row leadframe and fabrication method

Semiconductor device and interposer

Semiconductor molding method and structure

Substrate for solder joint

Semiconductor device

Bump structure

Double density method for wirebond interconnect

Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package

Semiconductor device and method of manufacturing the same

Leadless leadframe with an improved die pad for mold locking

Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement

Semiconductor die attachment for high vacuum tubes

Packaging of a microchip device

Thermal interface adhesive and rework

Method of manufacturing semiconductor device

Void free solder arrangement for screen printing semiconductor wafers

Method and resulting structure for manufacturing semiconductor substrates

Method for assembling semiconductor die packages with standard ball grid array footprint

Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material

Chemical-enhanced package singulation process

Methods for producing an electronic device having microscopically small contact areas

Microelectronic devices and methods for packaging microelectronic devices

Method of attaching a leadframe to singulated semiconductor dice

Method to build robust mechanical structures on substrate surfaces

Multilayer substrate including components therein

Method for testing using a universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level die burn-in

Semiconductor package and method for fabricating the same

Vibration-assisted method for underfilling flip-chip electronic devices

Universal interconnect die

Method for integrating pre-fabricated chip structures into functional electronic systems

Semiconductor device

Semiconductor device and method of manufacturing the semiconductor device

Electronic device package structures

Integrated circuit packaging method and structure for redistributing configuration thereof

Solder flow stops for semiconductor die substrates

High electrical performance semiconductor package

Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate

Semiconductor device and manufacturing method therefor

Package design and method for electrically connecting die to package

Semiconductor die attachment for high vacuum tubes

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor device and manufacturing method of same

Wireless coupling of semiconductor dies

Semiconductor micro device

Semiconductor (LED) chip attachment

Lead wire bonding method

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Microelectronic assembly having variable thickness solder joint

Under bump metallization layer to enable use of high tin content solder bumps

Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating

Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Method for internal electrical insulation of a substrate for a power semiconductor module

Semiconductor chip arrangement and method

Method of magnetic field assisted self-assembly

Electronic device including chip parts and a method for manufacturing the same

Semiconductor device

Chip scale package with heat spreader

High data rate chip mounting

Chip-packaging with bonding options having a plurality of package substrates

Flip chip semiconductor package for testing bump and method of fabricating the same

Surface mount multichip devices

Selectable decoupling capacitors for integrated circuits and associated methods

Linear split axis wire bonder

Sealing and protecting integrated circuit bonding pads