212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Barrier for interconnect and method
#10502Top layers of metal for high performance IC's
#10503Methods of forming solder bumps on exposed metal pads
#10504Single row bond pad arrangement
#10505Semiconductor device and manufacturing method thereof
#10506Implementation of protection layer for bond pad protection
#10507Method of fabricating a semiconductor device
#10508Shielded laminated structure with embedded chips
#10509Microelectronic connection components having bondable wires
#10510INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
#10511Display device and manufacturing method of the same
#10512Integrated circuit die for wire bonding and flip-chip mounting
#10513FCBGA package structure
#10514Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#10515Semiconductor device with a protected active die region and method therefor
#10516Structure of package
#10517Semiconductor chip package and method for manufacturing the same
#10518Semiconductor device
#10519Semiconductor structure integrated under a pad
#10520Test circuit under pad
#10521Method for low loop wire bonding
#10522Flip chip bonding tool and ball placement capillary
#10523Method of fabricating a rat's nest RFID antenna
#10524Mounting machine and controller for the mounting machine
#10525Method for manufacturing an interconnect
#10526Method for producing a semiconductor element
#10527Method for releasing stress of embedded chip and chip embedded structure
#10528Method for producing a BGA chip module and BGA chip module
#10529Semiconductor assembly using dual-cure die attach adhesive
#10530Power module comprising at least two substrates and method for producing the same
#10531Method for testing using a universal wafer carrier for wafer level die burn-in
#10532Method for testing using a universal wafer carrier for wafer level die burn-in
#10533Method for testing using a universal wafer carrier for wafer level die burn-in
#10534Multiple chip semiconductor package
#10535Process for fabricating chip package structure
#10536Semiconductor package for a large die
#10537Semiconductor device in which semiconductor chip is mounted on lead frame
#10538Semiconductor device having improved solder joint and internal lead lifetimes
#10539Fan out type wafer level package structure and method of the same
#10540High-frequency amplification device
#10541Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#10542Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#10543Compliant interconnect assembly
#10544Method for making an anisotropic conductive film pointed conductive inserts
#10545Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
#10546Method and apparatus for improved power routing
#10547Bump structure for a semiconductor device and method of manufacture
#10548Method for manufacturing semiconductor device having solder layer
#10549Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
#10550Semiconductor device and a method of manufacturing the same
#10551Semiconductor device and manufacturing method of the same
#10552Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#10553Semiconductor device
#10554Semiconductor device
#10555Functional printed circuit board module with an embedded chip
#10556High power Doherty amplifier
#10557Led chip mounting structure and image reader having same
#10558Flip-chip type semiconductor devices and conductive elements thereof
#10559Semiconductor device and multilayer substrate therefor
#10560Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#10561NANO IC packaging
#10562Power semiconductor arrangement
#10563In-process semiconductor packages with leadframe grid arrays
#10564Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#10565Semiconductor device with stacked semiconductor chips of the same type
#10566Semiconductor integrated circuit
#10567Semiconductor device
#10568High performance system-on-chip discrete components using post passivation process
#10569Electronic component, mounted structure, electro-optical device, and electronic device
#10570Power semiconductor switching devices and power semiconductor devices
#10571Thermally conductive compositions and methods of making thereof
#10572Programmable radio transceiver
#10573Method of migrating and fixing particles in a solution to bumps on a chip
#10574Method of connecting base materials
#10575Electronic component mounting method and apparatus and ultrasonic bonding head
#10576Packaging assembly utilizing flip chip and conductive plastic traces
#10577Electronic device and method of manufacture the same
#10578Packaging method for integrated circuits
#10579Method for depositing a solder material on a substrate
#10580Methods for fabricating electronic components to include supports for conductive structures
#10581Manufacture of microelectronic fold packages
#10582Method for manufacturing semiconductor device
#10583Dicing die bonding film
#10584Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#10585Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#10586Method for embedding a component in a base
#10587Method of fabricating electrical connection terminal of embedded chip
#10588Electronic component mounting method and apparatus
#10589Extension of fatigue life for C4 solder ball to chip connection
#10590Circuit device and method of manufacturing the circuit device
#10591Wafer level mounting frame for ball grid array packaging, and method of making and using the same
#10592Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#10593Integrated circuit package and method having wire-bonded intra-die electrical connections
#10594Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#10595Electronic package with optimized lamination process
#10596Surface mounted package with die bottom spaced from support board
#10597Power semiconductor device package
#10598Method for maintaining solder thickness in flipchip attach packaging processes
#10599Semiconductor device and method for manufacturing same
#10600Circuit device
#10601System for reducing or eliminating semiconductor device wire sweep
#10602Multi-part lead frame
#10603Chip fixed structure
#10604Integrated circuit device having flexible leadframe
#10605Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
#10606Leadless semiconductor package and manufacturing method thereof
#10607Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#10608Power semiconductor switching-device and semiconductor power module using the device
#10609Integrated circuit with intergrated capacitor and methods for making same
#10610Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#10611Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#10612Component mounting substrate and structure
#10613Semiconductor device comprising through-electrode interconnect
#10614Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#10615Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
#10616Jig for a semiconductor substrate
#10617Vacuum fixing jig for semiconductor device
#10618Self-coplanarity bumping shape for flip-chip
#10619Carrier substrates and conductive elements thereof
#10620Semiconductor device with electrode pads for test probe
#10621Capillary underfill channel
#10622Semiconductor device
#10623Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#10624Semiconductor flip-chip package and method for the fabrication thereof
#10625Self-coplanarity bumping shape for flip chip
#10626Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#10627Use of palladium in IC manufacturing with conductive polymer bump
#10628Method for manufacturing leadless semiconductor packages
#10629Semiconductor device
#10630Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#10631Microelectronic assembly having encapsulated wire bonding leads
#10632Semiconductor device, a method of manufacturing the same and an electronic device
#10633Semiconductor device with non-overlapping chip mounting sections
#10634Semiconductor BGA package having a segmented voltage plane and method of making
#10635Top finger having a groove and semiconductor device having the same
#10636Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#10637Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#10638Power semiconductor module
#10639Underfill fluxing curative
#10640Wire bonding apparatus
#10641Wire bond capillary tip
#10642Fabrication method and structure of PCB assembly, and tool for assembly thereof
#10643Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#10644Methods of forming bumps using barrier layers as etch masks
#10645METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME
#10646Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#10647Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10648BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#10649Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#10650Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#10651Programmable radio transceiver
#10652Motor driving system having power semiconductor module life detection function
#10653Adhesion by plasma conditioning of semiconductor chip surfaces
#10654Semiconductor device and manufacturing metthod thereof
#10655Semiconductor apparatus with improved yield
#10656Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#10657Under bump metallization layer to enable use of high tin content solder bumps
#10658Chip package and process thereof
#10659Electric wave readable data carrier manufacturing method, substrate, and electronic component module
#10660Semiconductor package with build-up structure and method for fabricating the same
#10661Semiconductor device and method of manufacturing the same
#10662Electrical component
#10663Semiconductor device
#10664Semiconductor device with plate-shaped component
#10665HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#10666Circuit device
#10667Vertically stacked semiconductor device
#10668Semiconductor chip package
#10669Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device
#10670Lead on chip semiconductor package
#10671Surface-mountable semiconductor component and method for producing it
#10672Electronic parts packaging structure and method of manufacturing the same
#10673High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#10674Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
#10675Top layers of metal for high performance IC's
#10676Solder bump structure and method for forming a solder bump
#10677Methods for forming electrical connections and resulting devices
#10678Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#10679Method of routing an electrical connection on a semiconductor device and structure therefor
#10680Dicing die-bonding film
#10681Semiconductor device and manufacturing method of the same
#10682Thin flip-chip method
#10683Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
#10684Method of producing an electronic component with flexible bonding
#10685Microelectronic device interconnects
#10686Manufacturing method for semiconductor device and determination method for position of semiconductor element
#10687Stress and force management techniques for a semiconductor die
#10688Multi-flip chip on lead frame on over molded IC package and method of assembly
#10689Wire bonding method and semiconductor device
#10690Semiconductor device with recessed post electrode
#10691Method of manufacturing substrate joint body, substrate joint body and electrooptical device
#10692Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#10693Stacked electronic part
#10694Methods and apparatus for packaging integrated circuit devices
#10695Circuit device and manufacturing method thereof
#10696Semiconductor package having step type die and method for manufacturing the same
#10697Semiconductor chip and display device using the same
#10698Ultrasonic tool and ultrasonic bonder
#10699Method of fabricating a wire bond with multiple stitch bonds
#10700Process for producing optical semiconductor device
#10701Semiconductor chip capable of implementing wire bonding over active circuits
#10702Memory component with asymmetrical contact row
#10703Top layers of metal for high performance IC's
#10704Semiconductor device and manufacturing method thereof
#10705Semiconductor device and method for manufacturing the same
#10706Bump and fabricating process thereof
#10707Method and apparatus for bonding a wire
#10708Semiconductor component assemblies having interconnects
#10709Semiconductor package
#10710Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
#10711Semiconductor device and manufacturing method thereof
#10712Semiconductor device and electronic device
#10713Semiconductor device with interlocking clip
#10714Electronic component having an integrated passive electronic component and associated production method
#10715Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#10716Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
#10717Semiconductor device and method of manufacturing the same
#10718Device mounting method and device transport apparatus
#10719Element arrangement method
#10720Wire bonding method and liquid-jet head
#10721Driver chip and display apparatus having the same
#10722Power amplifier module for wireless communication devices
#10723Integrated circuit package with keep-out zone overlapping undercut zone
#10724Circuit component with bump formed over chip
#10725Submount and semiconductor device
#10726Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#10727Semiconductor device and manufacturing method for the same
#10728Method for mounting semiconductor chips and corresponding semiconductor chip system
#10729Resin-molded semiconductor device having posts with bumps and method for fabricating the same
#10730Multi-chip package including at least one semiconductor device enclosed therein
#10731High frequency semiconductor device
#10732Semiconductor device and manufacturing method of the same
#10733Semiconductor package free of substrate and fabrication method thereof
#10734Semiconductor package free of substrate and fabrication method thereof
#10735Semiconductor package free of substrate and fabrication method thereof
#10736Semiconductor device
#10737Transferring semiconductor crystal from a substrate to a resin
#10738Semiconductor devices and manufacturing method therefor
#10739Titanium stripping solution
#10740Ultrasonic bonding apparatus and method
#10741Bump bonding apparatus and bump bonding method
#10742Electrical contact
#10743Multiple-ball wire bonds
#10744Apparatus and method for forming bump
#10745Method to prevent passivation layer peeling in a solder bump formation process
#10746Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10747Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10748Methods of fabrication of package assemblies for optically interactive electronic devices
#10749Via structure of packages for high frequency semiconductor devices
#10750Electronic component, method of manufacturing the electronic component, and electronic apparatus
#10751Test head assembly having paired contact structures
#10752Semiconductor package free of substrate and fabrication method thereof
#10753Semiconductor device assembly process
#10754LSI package, LSI element testing method, and semiconductor device manufacturing method
#10755Semiconductor package
#10756Interconnect system without through-holes
#10757Semiconductor device and manufacturing method thereof
#10758Method of surface mounting a semiconductor device
#10759Semiconductor device support structures
#10760Spring biased socket system
#10761Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#10762Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#10763Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#10764Transferring semiconductor crystal from a substrate to a resin
#10765Method and apparatus for fabricating self-assembling microstructures
#10766Method of manufacturing semiconductor device
#10767Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#10768spliced film carrier tape
#10769Apparatus and method for die attachment
#10770Semiconductor integrated circuit device
#10771Method and structure for interfacing electronic devices
#10772Electrode package for semiconductor device
#10773Semiconductor device
#10774Optimized power delivery to high speed, high pin-count devices
#10775Semiconductor device and a memory system including a plurality of IC chips in a common package
#10776Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#10777Circuit carrier
#10778Semiconductor package free of substrate and fabrication method thereof
#10779High density lead arrangement package structure
#10780Lead frame for semiconductor package and method of fabricating semiconductor package
#10781High performance system-on-chip using post passivation process
#10782Laser cleaning system for a wire bonding machine
#10783Manufacturing method and manufacturing apparatus for semiconductor device
#10784Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
#10785Method of manufacturing a display panel
#10786Microelectronic packages and methods therefor
#10787Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10788Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10789Semiconductor device and method of manufacturing the same
#10790Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#10791Thermal head and bonding connection method therefor
#10792Semiconductor device and manufacturing method thereof
#10793Semiconductor device and method of manufacturing the same
#10794Semiconductor integrated circuit device
#10795System semiconductor device and method of manufacturing the same
#10796Method for preparing integrated circuit modules for attachment to printed circuit substrates
#10797Manufacturing method of semiconductor device
#10798BUMPING PROCESS OF LIGHT EMITTING DIODE
#10799Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#10800Bumping process of light emitting diode