Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Microcomputer chip with function capable of supporting emulation

Multi-chip package

Structured semiconductor element for reducing charging effects

Neo-wafer device comprised of multiple singulated integrated circuit die

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Bumping process

Bumping process and structure thereof

Fabrication method of a wafer structure

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Methods of manufacturing interposers with flexible solder pad elements

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Electronic component comprising external surface contacts and a method for producing the same

Method of mounting an electronic part to a substrate

Wiring board and method for producing same

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device, circuit board, electro-optic device, electronic device

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Fine pitch bonding pad layout and method of manufacturing same

Semiconductor device and a method for manufacturing of the same

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Fan out type wafer level package structure and method of the same

Semiconductor device and manufacturing process thereof

Flip chip package including a non-planar heat spreader and method of making the same

Low cost power MOSFET with current monitoring

Film circuit substrate having Sn-In alloy layer

Manufacturing method of solid-state image sensing device

Bumping process and structure thereof

Method for manufacturing a semiconductor device

Method for fabricating semiconductor package with short-prevented lead frame

Chip package, chip packaging, chip carrier and process thereof

Method for flip chip bonding by utilizing an interposer with embedded bumps

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Using an interposer to facilate capacitive communication between face-to-face chips

Oblique parts or surfaces

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Semiconductor device and manufacturing method of the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Packaged device and method of forming same

Chip-size package structure and method of the same

Bumping process and structure thereof

Compliant interconnects for semiconductors and micromachines

Semiconductor device capsule

Audio amplifier assembly

IC substrate and manufacturing method thereof and semiconductor element package thereby

Solderable top metal for SiC device

Rfid tag

Method and apparatus for placing conductive balls

Thermal management of systems having localized regions of elevated heat flux

Circuit carrier and production thereof

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Plating method, semiconductor device fabrication method and circuit board fabrication method

Method for fabricating packaged die

Processing method during a package process

Packaging method for an electronic element

Connection structure for connecting semiconductor element and wiring board, and semiconductor device

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Heat dissipating package structure and method for fabricating the same

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Package structure module of bump posited type lead frame

Multichip leadframe package

Chip-scale packages

Method and process of contact to a heat softened solder ball array

Plating apparatus and plating method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Method for manufacturing wafer level chip scale package using redistribution substrate

Method for temporarily engaging electronic component for test

Inspection method of bonded status of ball in wire bonding

Bonding structure of device packaging

Transparent member, optical device using transparent member and method of manufacturing optical device

Bonding structure, actuator device and liquid-jet head

Semiconductor package using flip-chip mounting technique

Stacked die module

Method for manufacturing an electronic module, and an electronic module

Non-Circular via holes for bumping pads and related structures

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Resist sidewall spacer for C4 BLM undercut control

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Die attach paddle for mounting integrated circuit die

Flip chip bonding tool

Joining method and apparatus

Electronic flame-off electrode with ball-shaped tip

Contour structures to highlight inspection regions

Method for forming an electrode

Semiconductor electrical connection structure and method of fabricating the same

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Method for producing microsystems

Inverter and vehicle drive unit using the same

Structure and method for fabricating a bond pad structure

Semiconductor device and fabrication method thereof

Semiconductor device

Multi-chip package and method for manufacturing the same

Semiconductor lead frame, semiconductor package having the same, and method of plating the same

Semiconductor device

Film substrate of a semiconductor package and a manufacturing method

Semiconductor device having power semiconductor elements

Integrated circuit with at least one bump

Wire bonder and method of operating the same

Chip interconnect and packaging deposition methods and structures

Underfill compositions and methods for use thereof

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Method for fabricating carrier structure integrated with semiconductor element

Nano-sized metals and alloys, and methods of assembling packages containing same

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

Production method of anisotropic conductive sheet

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Semiconductor device

Semiconductor element including a wet prevention film

Method for manufacturing wafer level chip scale package structure

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

COF flexible printed wiring board and method of producing the wiring board

Bonding tool for ultrasonic bonding and method of ultrasonic bonding

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Bonding apparatus

Top layers of metal for integrated circuits

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Solder foil, semiconductor device and electronic device

High performance amine based no-flow underfill materials for flip chip applications

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Radiant energy heating for die attach

Electronic circuit including circuit-connecting material

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Chip structure

Semiconductor device

Assembly for stacked BGA packages

Materials, structures and methods for microelectronic packaging

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Semiconductor device and semiconductor device unit

Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device

Redistributed solder pads using etched lead frame

Motion control device for wire bonder bondhead

Semiconductor device and fabrication process thereof

Wafer level packages and methods of fabrication

Wire bond pads

Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Wafer stacking package method

Method for forming a redistribution layer in a wafer structure

Method of forming a surface mountable IC and its assembly

Thermally controlled fluidic self-assembly

Flexible device, flexible pressure sensor, and fabrication method thereof

Semiconductor module

Semiconductor package having flash-free contacts and techniques for manufacturing the same

Semiconductor device and a method of assembling a semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Method of making a solder ball

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Bump structure

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Robust power semiconductor package

Integrated circuit package with open substrate

Light emitting device and method of producing same

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

Conductive particle and adhesive agent

Non-contact ID card and the like and method for manufacturing same

Method for supplying solder

Method of measuring thickness of bonded ball in wire bonding

Joining apparatus

Surface mount saw device manufacturing method

Top layers of metal for high performance IC's

Bump structure of semiconductor package and method for fabricating the same

Module assembly and method for stacked BGA packages

Microprobe tips and methods for making

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Technique for attaching die to leads

Method for bonding flip chip on leadframe

Chip assembly reinforcement

Thermally controlled fluidic self-assembly method and support

Chip module

Method of embedding semiconductor chip in support plate and embedded structure thereof

Flip chip metal bonding to plastic leadframe

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device having tin-based solder layer and method for manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Flat chip semiconductor device and manufacturing method thereof

Semiconductor device with reduced contact resistance

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, lead frame, and methods for manufacturing the same

Semiconductor device and wire bonding chip size package therefor

High density interconnect power and ground strap and method therefor

Module assembly for stacked BGA packages

Method of manufacturing a semiconductor device

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor device

Lead frame and semiconductor device having the lead frame

Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Method for reducing lead precipitation during wafer processing

Method of manufacturing semiconductor device

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Semiconductor chip, electrically connections therefor

Surface-mounting semiconductor device and method of making the same

Wire sweep resistant semiconductor package and manufacturing method thereof

Integrated circuit with substantially perpendicular wire bonds

Low stress conductive polymer bump

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Semiconductor device having laminated structure

High-reliable semiconductor device using hermetic sealing of electrodes

Low temperature PB-free processing for semiconductor devices

Top layers of metal for high performance IC's

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Structures and methods for heat dissipation of semiconductor integrated circuits

Semiconductor and method for producing a semiconductor

Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

Micro-electronic package structure and method for fabricating the same

SMT three phase inverter package and lead frame

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor device with simplified constitution

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Electronic device with a warped spring connector

Method of manufacturing printed wiring board

Compressible films surrounding solder connectors

Method of electrically connecting a microelectronic component

Method for transferring a semiconductor body from a growth substrate to a support material

Conductive adhesive agent with ultrafine particles

Thermal fatigue resistant tin-lead-silver solder

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Integrated inductors and compliant interconnects for semiconductor packaging

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

QFN package and method therefor

Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body

High frequency module and manufacturing method thereof

Semiconductor element

Fluxless solder transfer and reflow process

Process and lead frame for making leadless semiconductor packages

Thermal protection for electronic components during processing

Semiconductor attachment method

Probe for semiconductor devices

Stacked packages

Semiconductor device and manufacturing method of the same

Wafer level package, multi-package stack, and method of manufacturing the same

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Systems and methods for wafer bonding by localized induction heating

Semiconductor device with sidewall wiring

Methods and systems for attaching die in stacked-die packages

Process and lead frame for making leadless semiconductor packages

Metal-metal bonding of compliant interconnect

Half-bridge package

Wire bond with improved shear strength

Concave face wire bond capillary and method

Serial thermal processor arrangement

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Programmable radio transceiver

Packaged microelectronic devices and methods for packaging microelectronic devices

Methods of forming lead free solder bumps

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method for processing a base that includes connecting a first base to a second base with an insulating film

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Method for processing base

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Pressure-contact type semiconductor device

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Method and apparatus for stacked die packaging

Stacked chip package with exposed lead-frame bottom surface

Structure with spherical contact pins

Snap lid camera module

Method and apparatus for forming metal contacts on a substrate

Method for forming metal contacts on a substrate

Bonding structure, wire bonding method, actuator device and liquid jet head

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Manufacture of RFID tags and intermediate products therefor

No-flow underfill composition and method

Interconnect assemblies and methods

Method of manufacturing semiconductor device with two-step etching of layer

Metal pad of semiconductor device and method for bonding the metal pad

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present