Semiconductor package

Semiconductor chip package and method

Electronic device with reduced entrapment of material between die and substrate electrical connections

Methods and apparatus for packaging integrated circuit devices

Semiconductor device

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Compliant interconnect assembly

Integrated circuit device and the manufacturing method thereof

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Techniques for joining an opto-electronic module to a semiconductor package

Mounting method for a semiconductor component

Inductor formed in an integrated circuit

Semiconductor device having a bond pad and method therefor

Bonding structure with compliant bumps

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor package

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Lead frame and semiconductor package with the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Design of an insulated cavity

Apparatus and method for mounting electronic components

Ball mounting method

Apparatus and method for low pressure wirebond

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Fabrication method of semiconductor package with heat sink

Semiconductor device and manufacturing method thereof

Bond pad scheme for Cu process

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Fabrication method of semiconductor integrated circuit device

Wire loop height measurement apparatus and method

Semiconductor device

Bonding pad structure

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Multi-surface contact IC packaging structures and assemblies

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Semiconductor device having metal plates and semiconductor chip

Multi-surface IC packaging structures and methods for their manufacture

Flip-chip sub-assembly, methods of making same and device including same

Power semiconductor device and power semiconductor module

Semiconductor device

Plastic package and method of fabricating the same

Method of mounting a circuit component and joint structure therefor

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Technique for attaching die to leads

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Circuit device

No-flow underfill composition and method

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Flip chip package using no-flow underfill and method of fabrication

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Circuit device

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Electronic module having plug contacts and method for producing it

Electronic substrate, power module and motor driver

Method for fabricating a semiconductor package with multi layered leadframe

Semiconductor device and fabrication method for the same

Vertical removal of excess solder from a circuit substrate

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Device for processing a wire

Method for forming metal contacts on a substrate

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

System and method for reducing or eliminating semiconductor device wire sweep

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device manufacturing method

Output circuit for a semiconductor amplifier element

RF amplifier

Rectifier diode device

Method for producing semiconductor device and semiconductor device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor component and production method suitable therefor

Semiconductor device

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Methods of coating and singulating wafers

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Semiconductor device using insulating film of low dielectric constant as interlayer insulating film

Methods for forming patterns on a filled dielectric material on substrates

Self-locking wire bond structure and method of making the same

Deposition of diffusion barrier

Gold bonding wires for semiconductor devices and method of producing the wires

Method for producing a multichip module and multichip module

Die pillar structures and a method of their formation

Semiconductor radiation emitter package

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Semiconductor device having heat radiation plate and bonding member

Integrated circuit package

Package type semiconductor device

Bonding tool with polymer coating

Tin deposition

Printed circuit board unit with detachment mechanism for electronic component

Method of fabricating a wire bond pad with Ni/Au metallization

Method of manufacturing a semiconductor device including a bump forming process

Process for producing resin-sealed type electronic device

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Pad structure for stress relief

Method for manufacturing solid-state imaging devices

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

Semiconductor device with electrode pad having probe mark

Semiconductor device and method of fabricating the same

Sealing and protecting integrated circuit bonding pads

Wireless coupling of staked dies within system in package

Semiconductor device having heat conducting plate

Semiconductor device and method of fabricating the same

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Transistor having multiple gate pads

Electrical circuit assembly with micro-socket

Substrate for pre-soldering material and fabrication method thereof

Method of mounting wafer on printed wiring substrate

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

Modified chip attach process and apparatus

Electronic parts built-in substrate and method of manufacturing the same

Reinforced bond pad

Semiconductor device with multilayered metal pattern

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Method of forming a semiconductor package and structure thereof

Pressure-contactable power semiconductor module

Fluxes for flip chip assembly using water soluble polymers

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

Hybrid integrated circuit device and method of manufacturing the same

Circuit carrier and production thereof

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

System having semiconductor component with encapsulated, bonded, interconnect contacts

Multi-chip semiconductor package and fabrication method thereof

Electrical or electronic component and method of producing same

Method for manufacturing an electronic circuit device and electronic circuit device

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Resin composition for encapsulating semiconductor device

Microelectronic devices and methods for packaging microelectronic devices

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

Designs and methods for conductive bumps

Package assembly for electronic device

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks

Manufacturing a bump electrode with roughened face

Substrate with terminal pads having respective single solder bumps formed thereon

Integrating chip scale packaging metallization into integrated circuit die structures

Window ball grid array semiconductor package and method for fabricating the same

Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor package

Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device and method for fabricating the same

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Method for the lateral contacting of a semiconductor chip

Methods of forming backside connections on a wafer stack

Semiconductor apparatus and method for fabricating the same

Image sensor packages

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device capable of detecting an open bonding wire using weak current

Discrete semiconductor component

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Apparatus and method for mounting or wiring semiconductor chips

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Lead frame with flag support structure

Semiconductor package with through-hole

Stress sensitive microchip with premolded-type package

Process for precise arrangement of micro-bodies

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Thermal interface adhesive

Method for manufacturing a piezoelectric oscillator

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Wire bonding method, semiconductor chip, and semiconductor package

Solder bump structure and method for forming the same

Semiconductor component arrangement with a reduced oscillation tendency

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Method for producing display device

Integrated circuit package

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Flip chip substrate design

Semiconductor device having transferred integrated circuit

Method for chemical etch control of noble metals in the presence of less noble metals

Bond pad techniques for integrated circuits

Method for fabricating thermally enhanced semiconductor device

Diffusion solder position, and process for producing it

Ball film for integrated circuit fabrication and testing

Method of forming a bond pad

Method of making a circuitized substrate

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Self-assembled nanometer conductive bumps and method for fabricating

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit

Electronic part mounting substrate and method for producing same

Semiconductor device with staggered electrodes and increased wiring width

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Multi-dice chip scale semiconductor components

Buried solder bumps for AC-coupled microelectronic interconnects

Flip-chip interconnect with increased current-carrying capability

Adhesive sheet for producing a semiconductor device

Leadless semiconductor package

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Circuit board and method of manufacturing the same

Process for forming lead-free bump on electronic component

Active area bonding compatible high current structures

Fluxless assembly of chip size semiconductor packages

Process for making contact with and housing integrated circuits

Device transfer method and panel

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

[CHIP STRUCTURE]

Package module for an IC device and method of forming the same

Encasing arrangement for a semiconductor component

Coolant cooled type semiconductor device

Circuit device

Semiconductor device

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Interconnections

Wirebonded assemblage method and apparatus

Method of fabricating a light emitting device

Aqueous based metal etchant

Singulation method used in leadless packaging process

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Flip chip on lead frame

Method for manufacturing semiconductor devices

Semiconductor packaging structure and method for forming the same

Electronic component and method for manufacturing the same

Semiconductor electronic device and method of manufacturing thereof

Semiconductor package using flexible film and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Power semiconductor module with deflection-resistant base plate

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Semiconductor package having light sensitive chips

Probe card assembly

Package substrate and process thereof

Encapsulated component which is small in terms of height and method for producing the same

Asymmetric plating

Low fabrication cost, fine pitch and high reliability solder bump

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Fabrication method of semiconductor device

Structure and method for fine pitch flip chip substrate

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials