Method for creating adhesion during fabrication of electronic devices

Under bump metallurgic layer

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Apparatus and method for packaging circuits

Multi-functional solder and articles made therewith, such as microelectronic components

Integrated circuit package with overlapping bond fingers

Module with embedded semiconductor IC and method of fabricating the module

Leadframe and semiconductor package made using the leadframe

Topless semiconductor package

Semiconductor device and method of manufacturing the same

Light-emitting diode array

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Process for the production of improved metallized films

Multi-functional solder and articles made therewith, such as microelectronic components

Contact structures and methods for making same

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Inhibition of tin oxide formation in lead free interconnect formation

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Packaged microelectronic components

Method of manufacturing a semiconductor device

Power supply device

Low-inductance circuit arrangement for power semiconductor modules

Voltage protection device

Semiconductor device with strain relieving bump design

Solder pads and method of making a solder pad

Multi-chip module having bonding wires and method of fabricating the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Multi-chips module package and manufacturing method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Semiconductor device and its manufacturing method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Stacked chip-packaging structure

Packaged microelectronic devices and methods of forming same

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Electronic device package

Standoffs for centralizing internals in packaging process

Semiconductor device and manufacturing method thereof

Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Stable electroless fine pitch interconnect plating

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming bump protective collars on a bumped wafer

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Multiple substrate microelectronic devices and methods of manufacture

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Module part

IC chip with improved pillar bumps

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Structure of multi-tier wire bonding for high frequency integrated circuit

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Semiconductor device and switching element

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Process for fabricating a semiconductor package and semiconductor package with leadframe

Light-emitting semiconductor component

Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Forming tool for forming a contoured microelectronic spring mold

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Substrate holder and plating apparatus

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Stencil mask design method and under bump metallurgy for C4 solder bump

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Electronic component-built-in module

Chip package structure

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Chip structure

Semiconductor interconnect having compliant conductive contacts

Semiconductor device including a diffusion layer

Reconnectable chip interface and chip package

Under-bump metallugical structure

Semiconductor device having chip size package with improved strength

Method of surface-mounting semiconductor chip on PCB

Semiconductor unit with cooling system

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Cutting method and method of manufacturing semiconductor device

Reconnectable chip interface and chip package

Semiconductor device including inclined cut surface and manufacturing method thereof

Semiconductor packaging structure

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device

Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET

Method of fabricating an electronic device

Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Wafer level bumping process

Electronic semiconductor device having a thermal spreader

Aluminum cap with electroless nickel/immersion gold

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Packaging method for thin integrated circuits

Process for producing semiconductor device and semiconductor device

Manufacturing method of semiconductor device, including differently spaced bump electrode arrays

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Laminated sheet

Interlayer dielectric and pre-applied die attach adhesive materials

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

[BONDING PAD STRUCTURE]

Packaging assembly and method of assembling the same

Semiconductor device and method of fabricating the same

Manufacturing method for multichip module

Semiconductor device and manufacturing method thereof

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Bump electrodes having multiple under ball metallurgy (UBM) layers

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Semiconductor device and method for manufacturing the same

Multiple chip semiconductor package

Fabrication method for stacked multi-chip package

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor packages for enhanced number of terminals, speed and power performance

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Bonding pad for a packaged integrated circuit

Surface mount multichip devices

Circuit board with built-in electronic component and method for manufacturing the same

Method and apparatus for low temperature copper to copper bonding

Method and apparatus for low temperature copper to copper bonding

Process of forming bonding columns

Three-dimensional stacked substrate arrangements

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

Manufacturing method of a semiconductor device

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Micro lead frame package

Semiconductor device manufacturing method

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method and apparatus for non-conductively interconnecting integrated circuits

System and method for controlling integrated circuit die height and planarity

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Corrosion-resistant copper bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Semiconductor device

Semiconductor device with under bump metallurgy and method for fabricating the same

Chip scale package and method of fabricating the same

Ultra wideband BGA

Method for forming semiconductor device including stacked dies

Semiconductor device and lead frame

Method of mounting electronic part and flux-fill

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Transfer assembly for manufacturing electronic devices

Superconducting bump bonds for quantum computing systems

Method for minimizing average surface roughness of soft metal layer for bonding

Method for minimizing average surface roughness of soft metal layer for bonding

Semiconductor apparatus and method for preparing the same

Semiconductor device with leadframe configured to facilitate reduced burr formation

Flip chip cavity package

Molded leadframe substrate semiconductor package