Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Manufacturing method of a semiconductor device utilizing a flexible adhesive tape

High-frequency power amplifier module

Optically interactive device package array

Method of manufacturing a sensor device with binding material having a foaming agent

Wafer-level package and method for production thereof

Electrode pad section for external connection

Semiconductor device and method of manufacturing the same

Connector assembly

Quad flat non-leaded package comprising a semiconductor device

Wire-bonding method and semiconductor package using the same

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Semiconductor package with passive device integration

Trench-gate semiconductor devices

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device

System and method for automated wire bonding

Dies bonding apparatus and dies bonding method

High performance system-on-chip discrete components using post passivation process

Methods for reducing flip chip stress

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Fabrication method of semiconductor package with photosensitive chip

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Compliant wirebond pedestal

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Resin-encapsulation semiconductor device and method for fabricating the same

Carrier

Flip-chip adaptor package for bare die

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

Semiconductor device including semiconductor element mounted on another semiconductor element

Semiconductor device and method for manufacturing the same

Semiconductor device and method of fabricating the same

Partially etched dielectric film with conductive features

Solder alloy and semiconductor device

Bumpless wafer scale device and board assembly

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device having radiation structure

Method of making microelectronic packages including electrically and/or thermally conductive element

Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device

Enhanced adhesion strength between mold resin and polyimide

Semiconductor device

Method of fabricating wafer-level packaging with sidewall passivation and related apparatus

Die-wafer package and method of fabricating same

Integrated circuit package with transparent encapsulant and method for making thereof

Surface mountable hermetically sealed package

High Q factor integrated circuit inductor

Active matrix substrate, method of manufacturing the same, and display device

Active matrix substrate display device

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Bonding method, bonding apparatus and bonding program

Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program

Interconnection device and system

Method and system for batch forming spring elements in three dimensions

Selective passivation of exposed silicon

Methods of forming backside connections on a wafer stack

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Method of forming solder bump with reduced surface defects

Method for fabricating a chip scale package using wafer level processing

Method for processing an integrated circuit

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Driver chip and display apparatus having the same

Method and apparatus for underfilling semiconductor devices

Chip and multi-chip semiconductor device using thereof and method for manufacturing same

Semiconductor integrated circuit having connection pads over active elements

Adhesion by plasma conditioning of semiconductor chip

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

WAFER-LEVEL PACKAGE STRUCTURE

Semiconductor device having conducting portion of upper and lower conductive layers

Room temperature metal direct bonding

Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device

Junction member comprising junction pads arranged in matrix and multichip package using same

Integrated circuit arrangement

Hermetic surface mounted power package

Semiconductor device

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Method of making wireless semiconductor device, and leadframe used therefor

Interconnect structure for power transistors

Optical sensor module with semiconductor device for drive

ULTRA-FINE CONTACT ALIGNMENT

Method and apparatus for forming metal contacts on a substrate

System for reducing oxidation of electronic devices

Method and resulting structure for manufacturing semiconductor substrates

Method of forming segmented ball limiting metallurgy

Manufacturing method for resin sealed semiconductor device

Semiconductor device and method of fabricating the same

Resin composition for encapsulating semiconductor

Driver chip and display apparatus including the same

Display unit

Colored conductive wires for a semiconductor package

Die attach by temperature gradient lead free soft solder metal sheet or film

Method for manufacturing connection construction

Process for producing a semiconductor device

Integrated device including connections on a separate wafer

Support ring for use with a contact pad and semiconductor device components including the same

Self-supporting connecting element for a semiconductor chip

Semiconductor device including semiconductor elements mounted on base plate

Reduced size semiconductor package with stacked dies

Flipchip QFN package

Integrated circuit packages with sandwiched capacitors

Semiconductor device

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Semiconductor device using LED chip

Test assembly including a test die for testing a semiconductor product die

Electronic component mounting method and apparatus

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Wafer level chip stack method

Carrier, method of manufacturing a carrier and an electronic device

Cooling devices and methods of using them

Semiconductor chip package

Adhesive film for circuit connection, and circuit connection structure

Materials for electronic devices

UBM for fine pitch solder ball and flip-chip packaging method using the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Mounting substrate and electronic component using the same

Semiconductor device and manufacturing method thereof

Low profile package having multiple die

Semiconductor device and manufacturing method for the same

Electronic device having wiring substrate and lead frame

LED substrate

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Arrangement for wire bonding and method for producing a bonding connection

Method for producing an electronic device connected to a printed circuit board

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

Lithographic contact elements

Method of manufacturing an electronic device, and electronic device

Capacitor device and method of manufacturing the same

Method of manufacturing semiconductor device

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Wafer stacking with anisotropic conductive adhesive

Method for fabricating a semiconductor interconnect having conductive spring contacts

Semiconductor chip with external connecting terminal

Low profile stacking system and method

Solder ball pad structure

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method thereof

Multi-part lead frame with dissimilar materials

Semiconductor device

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

Apparatus and methods for an underfilled integrated circuit package

Method of forming bump pad of flip chip and structure thereof

Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed

Method of manufacturing a semiconductor device by using a matrix frame

Induction-based heating for chip attach

Semiconductor device with intermediate connector

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Electrical connection of components

Dual band power amplifier module for wireless communication devices

Forming a chip package having a no-flow underfill

Fabrication methods for electronic system modules

Method of manufacturing a semiconductor device

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device and method of fabricating the same

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor chip package and multichip package

Method of manufacturing a semiconductor device

High-frequency device

Dicing die-bonding film

Leadless semiconductor package

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Wire bonder for ball bonding insulated wire and method of using same

Novel process for improved hot carrier injection

Methods of providing solder structures for out plane connections

Process for producing optical semiconductor device

Plastic lead frames utilizing reel-to-reel processing

Stacked semiconductor device assembly and method for forming

Various structure/height bumps for wafer level-chip scale package

Semiconductor module with a semiconductor stack, and methods for its production

Wire loop grid array package

Wire bonding package

Metal article intended for at least partially coating with a substance and a method for producing the same

Dual semiconductor die package with reverse lead form

Microelectronic assemblies with composite conductive elements

Semiconductor package with a flip chip on a solder-resist leadframe

Manufacturing method of a semiconductor device

Method and apparatus for improved power routing

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions

System and method for increasing the ball pitch of an electronic circuit package

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Opto-electronic assembly having an encapsulant with at least two different functional zones

Methods of forming solder areas on electronic components and electronic components having solder areas

Flip-chip solder bump formation using a wirebonder apparatus

Wire bonding apparatus and method for clamping a wire

Chip orientation and attachment method

Flip clip attach and copper clip attach on MOSFET device

Electronic parts built-in substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Method of making a microelectronic assembly

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Structure and method for fabricating a bond pad structure

Structure and method for reinforcing a bond pad on a chip

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and the method of producing the same

Semiconductor device and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Power semiconductor module and method for producing it

Semiconductor packages for enhanced number of terminals, speed and power performance

Microelectronic device signal transmission by way of a lid

Thin, thermally enhanced molded package with leadframe having protruding region

Method for manufacturing thin GaAs die with copper-back metal structures

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Roller wire brake for wire bonding machine

Bonding apparatus and bonding external appearance inspection device

Nano-metal composite made by deposition from colloidal suspensions

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Connector for making electrical contact at semiconductor scales

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Fan out type wafer level package structure and method of the same

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Semiconductor device and method of manufacturing thereof

Module board having embedded chips and components and method of forming the same

Power amplifier module for wireless communication devices

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Component

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Method for the hermetic encapsulation of a component

Semiconductor device package utilizing proud interconnect material

Thinned die integrated circuit package

Semiconductor device

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Semiconductor device

Capillary with contained inner chamfer

Multi-part capillary

Electroplating method for a semiconductor device

Method for electrical interconnection of angularly disposed conductive patterns

System and method used in attaching die for ball grid arrays

Method for forming MEMS grid array connector

Methods of reducing bleed-out of underfill and adhesive materials

Techniques for joining an opto-electronic module to a semiconductor package

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Electronic device and method of manufacturing same

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Stacked semiconductor device

Semiconductor interconnect having conductive spring contacts

Support structure for low-k dielectrics

Selective deposition of solder ball contacts

Semiconductor testing device

Method of making multichip wafer level packages and computing systems incorporating same

Method of interconnecting die and substrate

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Semiconductor device and manufacturing method thereof

Semiconductor device and method for assembling the same

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Light emitting diode lamp

Method of manufacturing a solid state image sensing device

Roughened bonding pad and bonding wire surfaces for low pressure wire bonding

Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

Method for anodic bonding of wafers and device

Electronics circuit manufacture

Wiring base with wiring extending inside and outside of a mounting region

Bond pad

Wire bond integrity test system

Light source apparatus with light-emitting chip which generates light and heat

Semiconductor device and method of making the same

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Wafer level packages for chips with sawn edge protection

Customized microelectronic device and method for making customized electrical interconnections

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Opto-electronic element with a metallized carrier

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Low loop height ball bonding method and apparatus

Flip chip bonding tool tip

Bonding apparatus

Bonding tool with resistance

Film adhesives containing maleimide compounds and methods for use thereof

Method of manufacturing a semiconductor device

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Power amplifier device

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Use of palladium in IC manufacturing with conductive polymer bump

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Corrosion-resistant bond pad and integrated device

Wafer-level package and its manufacturing method

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface