212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Semiconductor device
#2102Electrode pad having a recessed portion
#2103Semiconductor device and manufacturing method thereof
#2104Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#2105Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#2106Multi-chip stack package structure
#2107Multi-chip stack package structure
#2108Multi-chip stack package structure
#2109Method of manufacturing an electronic device with a package locking system
#2110Plasma treatment for semiconductor devices
#2111Semiconductor device and method of forming dam material around periphery of die to reduce warpage
#2112Semiconductor device, a method of manufacturing the same and an electronic device
#2113Etched surface mount islands in a leadframe package
#2114Semiconductor Device
#2115SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2116Combined packaged power semiconductor device
#2117Power semiconductor device
#2118Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
#2119Die bonder, pickup method, and pickup device
#2120Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion
#2121Thermally enhanced electronic package
#2122Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
#2123Semiconductor integrated circuit device and method of manufacturing the same
#2124Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#2125Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#2126STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD
#2127SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#2128ELECTRICALLY CONNECTING ROUTES OF SEMICONDUCTOR CHIP PACKAGE CONSOLIDATED IN DIE-ATTACHMENT
#2129NO LEAD PACKAGE WITH HEAT SPREADER
#2130Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
#2131Semiconductor device and manufacturing method thereof
#2132SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS
#2133WAFER LEVEL DIODE PACKAGE STRUCTURE
#2134Wafer level processing method and structure to manufacture semiconductor chip
#2135SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE
#2136MULTILAYER PRINTED WIRING BOARD
#2137Method for the miniaturizable contacting of insulated wires
#2138Fabrication method of leadframe-based semiconductor package
#2139Use of device assembly for a generalization of three-dimensional metal interconnect technologies
#2140Method of repairing a display assembled on a substrate
#2141Method for producing a matrix of individual electronic components and matrix produced thereby
#2142Interconnect structure
#2143Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#2144Surface mountable device
#2145High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
#2146Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
#2147Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#2148Cu pillar bump with non-metal sidewall spacer and metal top cap
#2149Apparatus for thermally enhanced semiconductor package
#2150SEMICONDUCTOR DEVICE
#2151Pad configurations for an electronic package assembly
#2152Semiconductor device and production method thereof
#2153Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#2154Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#2155Integrated circuit packaging system with magnetic film and method of manufacture thereof
#2156Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#2157SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2158Semiconductor chip
#2159Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#2160Semiconductor device
#2161AC switch having compound semiconductor MOSFETs
#2162Solder bump formation on a circuit board using a transfer sheet
#2163SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPS
#2164Semiconductor device and manufacturing method of the same
#2165Semiconductor wafer with electrically connected contact and test areas
#2166Method for manufacturing a semiconductor component and structure therefor
#2167Reception circuit and signal reception method
#2168Inductive circuit arrangement
#2169Semiconductor device, substrate for producing semiconductor device and method of producing them
#2170Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
#2171Chip package including multiple sections for reducing chip package interaction
#2172Microelectronic packages having cavities for receiving microelectronic elements
#2173Method for manufacturing an electronic module and an electronic module
#2174Electronic device and method for connecting a die to a connection terminal
#2175Integrated circuit package system with embedded die superstructure and method of manufacture thereof
#2176Junction body, semiconductor module, and manufacturing method for junction body
#2177Chip package having a chip combined with a substrate via a copper pillar
#2178METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#2179Chip bump structure and method for forming the same
#2180Chip structure
#2181Manufacturing method of semiconductor device, and mounting structure thereof
#2182Three dimensional stacked package structure
#2183LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF
#2184Method and system for forming a thin semiconductor device
#2185Semiconductor chip package including a lead frame
#2186Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#2187Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
#2188Power semiconductor device
#2189Sintering silver paste material and method for bonding semiconductor chip
#2190Wire bonding apparatus and method thereof
#2191RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
#2192Manufacturing method for semiconductor integrated device
#2193Method of manufacturing printed wiring board with built-in electronic component
#2194Activation treatments in plating processes
#2195Semiconductor integrated circuit device
#2196Semiconductor device including semiconductor elements mounted on base plate
#2197CONVEX DIE ATTACHMENT METHOD
#2198Method for device packaging
#2199ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#2200Method of fabricating wiring board and method of fabricating semiconductor device
#2201Semiconductor module device and driving apparatus having the same
#2202Electrical connections for multichip modules
#2203Chip carrier
#2204Chip package and method for forming the same
#2205Method for producing chip packages, and chip package produced in this way
#2206Substrate interconnections having different sizes
#2207Microelectronic assembly with joined bond elements having lowered inductance
#2208Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
#2209Substrate contact opening
#2210Cu pillar bump with L-shaped non-metal sidewall protection structure
#2211Integrated circuit packaging system with dual side connection and method of manufacture thereof
#2212Semiconductor apparatus and semiconductor apparatus unit
#2213Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#2214Package systems having interposers with interconnection structures
#2215Leadless package system having external contacts
#2216Leadless integrated circuit packaging system and method of manufacture thereof
#2217Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#2218Integrated circuit packaging system with isolated pads and method of manufacture thereof
#2219Chip-exposed semiconductor device and its packaging method
#2220Semiconductor apparatus and power supply circuit
#2221Semiconductor device including external connection pads and test pads
#2222Etch isolation LPCC/QFN strip
#2223Components joining method and components joining structure
#2224Semiconductor chip, and semiconductor package and system each including the semiconductor chip
#2225Method of fabricating a semiconductor device with encapsulant
#2226Semiconductor device manufacturing method
#2227Near chip scale semiconductor packages
#2228ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE
#2229THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS
#2230Method for manufacturing a semiconductor component
#2231Magnetic microelectronic device attachment
#2232Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#2233Semiconductor assembly and multilayer wiring board
#2234Semiconductor device, method for manufacturing the same, and electronic device
#2235Circuitry and Method for Encapsulating the Same
#2236Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
#2237Scalable transfer-join bonding lock-and-key structures
#2238Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2239Semiconductor device
#2240Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
#2241Assembly of multi-chip modules with proximity connectors using reflowable features
#2242Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#2243Method of fabricating bump structure
#2244Semiconductor device
#2245Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material
#2246Stacked-die package for battery power management
#2247Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#2248Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#2249Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#2250Semiconductor Device with Circuit for Reduced Parasitic Inductance
#2251Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
#2252WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS
#2253MAGNETIC PARTICLE ATTACHMENT MATERIAL
#2254Method for interconnecting electrical device to a module
#2255Wire bonding apparatus and wire bonding method
#2256Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#2257Magnetic attachment structure
#2258Method for disposing a microstructure
#2259Ventilating apparatus
#2260Ventilating apparatus
#2261Method of manufacturing a printed circuit board (PCB)
#2262CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
#2263PATTERNED CONTACT
#2264ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS
#2265Semiconductor device
#2266Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material
#2267Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation
#2268Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors
#2269Stacked semiconductor package and method for manufacturing the same
#2270Wafer level package and methods of fabricating the same
#2271Semiconductor device for preventing crack in pad region and fabricating method thereof
#2272Semiconductor device and method for fabricating semiconductor device
#2273Semiconductor package and method of manufacturing same
#2274Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture
#2275Pre-molded clip structure
#2276Die backside standoff structures for semiconductor devices
#2277IC package with capacitors disposed on an interposal layer
#2278Interdigitated conductive support for GaN semiconductor die
#2279Apparatus for applying solder to semiconductor chips using decals with aperatures present therein
#2280Dual capillary IC wirebonding
#2281Hermetic wafer-to-wafer bonding with electrical interconnection
#2282HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
#2283Biocompatible Bonding Method
#2284Gold-tin etch using combination of halogen plasma and wet etch
#2285Method of manufacturing an electronic component
#2286SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2287LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS
#2288Semiconductor device and a manufacturing method of the same
#2289Mixed alloy solder paste
#2290NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2291CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL
#2292Semiconductor device and manufacturing method thereof
#2293Etch-back type semiconductor package, substrate and manufacturing method thereof
#2294Circuit board including a heat radiating plate
#2295Wire bond interconnection and method of manufacture thereof
#2296Semiconductor device packages including a semiconductor device and a redistribution element
#2297Electronic elements and devices with trench under bond pad feature
#2298Semiconductor device and method of manufacturing the same
#2299Selective die electrical insulation by additive process
#2300Stackable power MOSFET, power MOSFET stack, and process of manufacture
#2301Laser etch via formation
#2302INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD
#2303WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#2304Semiconductor chip with post-passivation scheme formed over passivation layer
#2305MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY
#2306Cu pillar bump with non-metal sidewall protection structure
#2307Circuit board with built-in semiconductor chip and method of manufacturing the same
#2308Lead frame based semiconductor package and a method of manufacturing the same
#2309LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#2310Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
#2311Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof
#2312SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
#2313Semiconductor device
#2314Cutting blade for a wire bonding system
#2315Bonding device, ultrasonic transducer, and bonding method
#2316Method for embedding a component in a base
#2317Magnetic intermetallic compound interconnect
#2318Method for manufacturing interposer
#2319Method for forming an adhesive layer and adhesive composition
#2320Method for manufacturing semiconductor device
#2321METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION
#2322Photosensitive composition
#2323Electromagnetic interference shielding on semiconductor devices
#2324Die package
#2325Power switch component having improved temperature distribution
#2326CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING THE SAME
#2327Semiconductor device
#2328Semiconductor device having double side electrode structure
#2329Electronic device package and method of manufacture
#2330Flip chip interconnection structure
#2331Three-dimensional stacked substrate arrangements
#2332Cu pillar bump with electrolytic metal sidewall protection
#2333Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
#2334Power block and power semiconductor module using same
#2335DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE
#2336Semiconductor device and lead frame used for the same
#2337Integrated circuit including bond wire directly bonded to pad
#2338Power semiconductor device packaging
#2339Semiconductor device packages with electromagnetic interference shielding
#2340THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF
#2341APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING
#2342TRANSDUCER OF AN ULTRASONIC BONDER
#2343Reaction absorber and semiconductor assembling system
#2344Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
#2345Method of manufacturing semiconductor apparatus
#2346THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#2347Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
#2348Chip embedded substrate and method of producing the same
#2349Method for manufacturing LED package and substrate thereof
#2350Semiconductor device and method of forming conductive vias with trench in saw street
#2351Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
#2352Semiconductor device and method of wafer level package integration
#2353Wafer level die integration and method therefor
#2354Routing layer for mitigating stress in a semiconductor die
#2355Die structure and die connecting method
#2356Method for fabricating bump structure without UBM undercut
#2357Semiconductor device having multiple semiconductor elements
#2358Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
#2359Stacked semiconductor package
#2360Chip package structure and method of making the same
#2361Manufacturing method for electronic devices
#2362Semiconductor device capable of switching operation modes
#2363Apparatus with a multi-layer coating and method of forming the same
#2364Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#2365Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#2366Inverse chip connector
#2367Thru silicon enabled die stacking scheme
#2368Package substrate and fabricating method thereof
#2369Method of manufacturing semiconductor device
#2370Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
#2371Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#2372Semiconductor device
#2373Leadframe package for high-speed data rate applications
#2374Lead frame for semiconductor device
#2375SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2376Methods and apparatus for measuring analytes using large scale FET arrays
#2377Methods and apparatus for measuring analytes using large scale FET arrays
#2378Adhesive for bonding circuit members, circuit board and process for its production
#2379Adhesive for bonding circuit members, circuit board and process for its production
#2380Adhesive for bonding circuit members, circuit board and process for its production
#2381Process for the wafer-scale fabrication of electronic modules for surface mounting
#2382Structure and method of forming pillar bumps with controllable shape and size
#2383MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE
#2384Method for manufacture of inline integrated circuit system
#2385SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
#2386PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#2387Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime
#2388Packaging process to create wettable lead flank during board assembly
#2389THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE
#2390Mount board and electronic device
#2391APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM
#2392EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
#2393LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#2394Wire bonding structure of semiconductor device and wire bonding method
#2395Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
#2396Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
#2397Semiconductor device
#2398Virtually substrate-less composite power semiconductor device and method
#2399Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
#2400SEMICONDUCTOR DEVICE