212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
Chip packaging structures
#902Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#903Semiconductor device and method of forming a thin wafer without a carrier
#904Fingerprint sensor and manufacturing method thereof
#905Power semiconductor device and method therefor
#906Wire bond support structure and microelectronic package including wire bonds therefrom
#907Fixture to constrain laminate and method of assembly
#908Semiconductor-mounted product and method of producing the same
#909Bonded structures for package and substrate
#910Semiconductor Package Configured for Connection to a Board
#911Through-hole electrode substrate
#912High reliability lead-free solder alloys for harsh environment electronics applications
#913Semiconductor device and manufacturing method of the same
#914Tooling for coupling multiple electronic chips
#915Moisture-resistant electronic component, notably microwave, and method for packaging such a component
#916Cooler-integrated semiconductor module
#917CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#918SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF
#919Semiconductor package
#920Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#921Semiconductor package with conductive clip
#922Lead-Free Solder Alloy and Semiconductor Device
#923Microelectronic substrate having embedded trace layers with integral attachment structures
#924Semiconductor device including a protective film
#925Chip package and method for fabricating the same
#926Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#927Semiconductor device including support pillars on solder mask
#928Semiconductor device and method of forming wafer level ground plane and power ring
#929Semiconductor device and a method of manufacturing the same
#930Semiconductor device having electrode pads arranged between groups of external electrodes
#931Electronic device and method for production
#932Metal bond pad with cobalt interconnect layer and solder thereon
#933Semiconductor device and a method of manufacturing the same
#934Method of embedding WLCSP components in e-WLB and e-PLB
#935Bumpless build-up layer package with pre-stacked microelectronic devices
#936ELECTRONIC COMPONENT
#937Semiconductor package and mobile device using the same
#938Semiconductor device and method to minimize stress on stack via
#939Methods to form high density through-mold interconnections
#940Method of manufacturing connector structures of integrated circuits
#941Methods for forming pillar bumps on semiconductor wafers
#942Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof
#943Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film
#944Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
#945HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
#946Semiconductor device
#947Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#948Packaging devices and methods of manufacture thereof
#949Method of manufacturing semiconductor device and semiconductor device
#950Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#951Integrated circuit underfill scheme
#952Electronic apparatus and method for fabricating the same
#953SOLDER ATTACH APPARATUS AND METHOD
#954Integrated antennas in wafer level package
#955Singulation method for semiconductor package with plating on side of connectors
#956Method of manufacturing a semiconductor device having scribe lines
#957Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
#958Semiconductor device and manufacturing method thereof
#959Contact bumps methods of making contact bumps
#960Power semiconductor device with a double metal contact and related method
#961ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#962Apparatus and methods for through substrate via test
#963Substrate and assembly thereof with dielectric removal for increased post height
#964Hollow metal pillar packaging scheme
#965SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME
#966Semiconductor packaging and manufacturing method thereof
#967Package carrier, semiconductor package, and process for fabricating same
#968Leadless chip carrier having improved mountability
#969Method of producing a semiconductor package
#970METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
#971Integrated circuit structure having dies with connectors
#972Bridge interconnect with air gap in package assembly
#973Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#974Embedded semiconductive chips in reconstituted wafers, and systems containing same
#975Semiconductor device and method of manufacturing same
#976Three dimensional device integration method and integrated device
#977Laser assisted transfer welding process
#978Leadframe package with pre-applied filler material
#979PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
#980Semiconductor device and method for manufacturing semiconductor device
#981Semiconductor device and production method therefor
#982Organic-inorganic hybrid structure for integrated circuit packages
#983Bonding method using bonding material
#984Semiconductor device having connection terminal of solder
#985MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT
#986Integrated millimeter-wave chip package
#987Semiconductor device, method for manufacturing the same, and electronic device
#988Mounting structure and BGA ball
#989SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS HAVING THE SAME
#990Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#991Resin-encapsulated semiconductor device and its manufacturing method
#992SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#993Semiconductor device and manufacturing method thereof
#994Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#995Ball amount process in the manufacturing of integrated circuit
#996Method of filling probe indentations in contact pads
#997Semiconductor package
#998Method of manufacturing a semiconductor device
#999Method of producing an interposer with microspring contacts
#1000Semiconductor device and method of manufacturing semiconductor device
#1001SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
#1002METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
#1003Method of making a semiconductor device having a functional capping
#1004Direct injection molded solder process for forming solder bumps on wafers
#1005Fabrication method of embedded chip substrate
#1006Method of fabricating semiconductor device
#1007Interconnect structure for wafer level package
#1008Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#1009Methods of forming 3-D circuits with integrated passive devices
#1010SEMICONDUCTOR DEVICE
#1011Package on package structure and method for forming the same
#1012Interconnect structures with intermetallic palladium joints and associated systems and methods
#1013Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#1014LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#1015Integrated circuit packaging system with under bump metallization and method of manufacture thereof
#1016Bonding material and bonding method using the same
#1017Thermocompression for semiconductor chip assembly
#1018Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#1019Semiconductor light-emitting device, method for producing same, and display device
#1020Stackable molded microelectronic packages with area array unit connectors
#1021Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#1022Chip mounting
#1023Bump-on-trace structures with high assembly yield
#1024Room temperature metal direct bonding
#1025Test probe head for full wafer testing
#1026Test probe substrate
#1027Pressure application apparatus and pressure application method
#1028ZN BASED LEAD-FREE SOLDER AND SEMICONDUCTOR POWER MODULE
#1029Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#1030Use of electrolytic plating to control solder wetting
#1031Lead-Free Solder Alloy
#1032Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#1033Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#1034Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device
#1035Fan-out wafer level package
#1036High efficiency module
#1037Method of manufacturing semiconductor device
#1038Fabricating pillar solder bump
#1039Semiconductor package
#1040Method for fabricating electronic device package
#1041Thin plastic leadless package with exposed metal die paddle
#1042Methods for solder for through-mold interconnect
#1043Preventing misshaped solder balls
#1044Light emitting device and method for manufacturing light emitting device
#1045Method for forming package structure
#1046Stacked packaging improvements
#1047Semiconductor device and method of fabricating same
#1048Semiconductor component, semiconductor-mounted product including the component, and method of producing the product
#1049Bump pad structure
#1050Electronic component mounting apparatus and method
#1051Semiconductor device having solder joint and method of forming the same
#1052Methods and apparatus for transmission lines in packages
#1053Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop
#1054Semiconductor module
#1055Integrated millimeter wave transceiver
#1056Adhesive composition, adhesive sheet and production process for semiconductor device
#1057Substrate interconnections having different sizes
#1058Package structure and fabrication method thereof
#1059Semiconductor devices with recessed interconnects
#1060Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
#1061Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#1062Integrated system and method of making the integrated system
#1063Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
#1064Semiconductor chip assembly and method for making same
#1065SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1066Four D device process and structure
#1067EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
#1068SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1069Semiconductor device having low on resistance
#1070Solder balls and semiconductor device employing the same
#1071Semiconductor device including a protective film
#1072Method of forming an integrated circuit device including a pillar capped by barrier layer
#1073METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE, AND AN INTEGRATED CIRCUIT DEVICE THEREFROM
#1074Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#1075Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#1076Semiconductor device
#1077Semiconductor device and a method of manufacturing the same
#1078Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#1079Three-dimensional semiconductor architecture
#1080Apparatus for fluid guided self-assembly of microcomponents
#1081Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#1082Apparatus and methods for high-density chip connectivity
#1083Wire bond support structure and microelectronic package including wire bonds therefrom
#1084Semiconductor module
#1085Package systems
#1086Microelectronic packages having cavities for receiving microelectronic elements
#1087Power semiconductor package
#10883D IC method and device
#1089Semiconductor device and automobile
#1090Off-chip vias in stacked chips
#1091Method of forming solder bump, and solder bump
#1092Printed circuit board having traces and ball grid array package including the same
#1093LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#1094Method of making a stacked microelectronic package
#1095Metal bump joint structure
#1096Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#1097Chip packaging structures and treatment methods thereof
#1098Semiconductor device
#1099Method of forming post-passivation interconnect structure
#1100Method of forming wafer-level molded structure for package assembly
#1101Semiconductor chip having different conductive pad widths and method of making layout for same
#1102Semiconductor device having low dielectric insulating film and manufacturing method of the same
#1103Substrate pad structure
#1104Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
#1105Chip packaging method and chip package using hydrophobic surface
#1106Method of manufacturing a carrier tape
#1107Semiconductor device and method of forming bump-on-lead interconnection
#1108Contact and solder ball interconnect
#1109Semiconductor device and method for manufacturing semiconductor device
#1110Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#1111Semiconductor device and electronic device
#1112Zero stand-off bonding system and method
#1113Connector structures of integrated circuits
#1114Metal contact for semiconductor device
#1115Single inline no-lead semiconductor package
#1116High efficiency module including a plurality of MOSFETS
#1117Semiconductor Package and Method of Manufacturing the Same
#1118Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#1119Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#1120Module comprising a semiconductor chip
#1121Semiconductor module
#1122Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#1123Three dimensional device integration method and integrated device
#1124Method of fabricating package structure
#1125Integrated circuit chip and fabrication method
#1126Power semiconductor package with a common conductive clip
#1127Semiconductor device
#1128Method and materials for warpage thermal and interconnect solutions
#1129LPS solder paste based low cost fine pitch pop interconnect solutions
#1130Wafer level device and method with cantilever pillar structure
#1131Manufacture of coated copper pillars
#1132Chip package and method thereof
#1133Semiconductor module
#1134Semiconductor device
#1135Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#1136Power semiconductor package with conductive clips
#1137SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1138Semiconductor device structure and manufacturing method
#1139BUMP STRUCTURE AND METHOD FOR FORMING THE SAME
#1140Method for Fabricating Equal Height Metal Pillars of Different Diameters
#1141SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1142Electronic device including soldered surface-mount component
#1143INTEGRATED CIRCUIT PACKAGE
#1144SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NIPDAU OR NIAU SURFACE FINISHES DURING HIGH TEMPERATURE EXPOSURE
#1145Semiconductor package with conductive clip
#1146Power semiconductor package with conductive clip and related method
#1147Semiconductor device and method of manufacturing same
#1148Light emitting apparatus, illumination apparatus and display apparatus
#1149Microelectronic elements with post-assembly planarization
#1150Mixed alloy solder paste
#1151JOINING A CHIP TO A SUBSTRATE WITH SOLDER ALLOYS HAVING DIFFERENT REFLOW TEMPERATURES
#1152Microelectronic packages with nanoparticle joining
#1153Packages with solder ball revealed through laser
#1154RFID tags and processes for producing RFID tags
#1155Method of forming surface protrusions on an article and the article with the protrusions attached
#1156Solder paste, joining method using the same and joined structure
#1157Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
#1158FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOF
#1159Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#1160LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#1161Methods for etching copper during the fabrication of integrated circuits
#1162Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#1163Semiconductor device and a method of manufacturing the same
#1164Semiconductor device
#1165Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#1166Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#1167Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#1168Mixed alloy solder paste
#1169Methods of forming ultra thin package structures including low temperature solder and structures formed therby
#1170Lead-free solder ball
#1171Impedance controlled electrical interconnection employing meta-materials
#1172Package assembly having a semiconductor substrate
#1173Silver paste composition and semiconductor device using same
#1174Core ball, solder paste, formed-solder, flux-coated core ball and solder joint
#1175Probing chips during package formation
#1176SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#1177Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#1178System and method for 3D integrated circuit stacking
#1179Semiconductor device with through silicon via and alignment mark
#1180SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING SEMICONDUCTOR DEVICE, PRODUCING METHOD AND MOUNTING METHOD OF SOLDER-CONTAINING SEMICONDUCTOR DEVICE
#1181Semiconductor device
#1182Semiconductor device
#1183Semiconductor device
#1184Semiconductor package
#1185Method of fabricating bump structure and bump structure
#1186Wireless communication system
#1187Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#1188Optoelectronic system
#1189SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
#1190Package on package structure and fabrication method thereof
#1191Solder in cavity interconnection structures
#1192SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#1193Semiconductor device
#1194SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATON AND METHOD OF FORMING SAME
#1195Apparatus, system, and method for wireless connection in integrated circuit packages
#1196Semiconductor device
#1197SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1198Grid array connection device and method
#1199Die substrate assembly and method
#1200Self-aligned under bump metal