212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
Light emitting diode package
#9002Hot press for electronic devices and hot pressing method
#9003Ball transferring method and apparatus
#9004Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#9005Semiconductor device and method of manufacturing same
#9006Structure and method of making sealed capped chips
#9007Method of manufacturing a semiconductor device
#9008Chip scale package and method for manufacturing the same
#9009Method for fabricating chip-stacked semiconductor package
#9010Method of fabricating a stacked die having a recess in a die BGA package
#9011Semiconductor device with stacked chips and method for manufacturing thereof
#9012Method of fabricating microelectronic devices
#9013Method of assembling displays on substrates
#9014Power semiconductor devices having integrated inductor
#9015Semiconductor switching module and method
#9016Integrated circuit package-in-package system
#9017Side connectors for RFID chip
#9018Carrier board structure with embedded semiconductor chip and fabrication method thereof
#9019EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP
#9020METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
#9021Solder Interconnect Joints For A Semiconductor Package
#9022Electronic device including a conductive stud over a bonding pad region
#9023METHOD FOR SEPARATING PACKAGE OF WLP
#9024Bump pattern design for flip chip semiconductor package
#9025Integrated circuit component with a surface-mount housing
#9026Interposer and semiconductor package with reduced contact area
#9027Semiconductor package device
#9028SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#9029Electrical through contact
#9030Method for placing material onto a target board by means of a transfer board
#9031Wiring substrate and manufacturing method thereof, and semiconductor device
#9032Methods of forming electronic structures including conductive shunt layers and related structures
#9033Solder Ball Pad Structure
#9034Electronic system modules and method of fabrication
#9035SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD
#9036Composite photoresist for modifying die-side bumps
#9037Substrate structure integrated with passive components
#9038Image alignment method for binocular eyewear displays
#9039Multi-die DC-DC buck power converter with efficient packaging
#9040Methods for providing and using grid array packages
#9041Microelectronic device connection structure
#9042Semiconductor device and its wiring method
#9043Semiconductor device and its wiring method
#9044Semiconductor device
#9045Semiconductor device with interface peeling preventing rewiring layer
#9046Solder bumps in flip-chip technologies
#9047Semiconductor device and manufacturing method for the same
#9048Contact structure having a compliant bump and a testing area
#9049Substrate and process for semiconductor flip chip package
#9050Semiconductor device having bumps in a same row for staggered probing
#9051Solder connector structure and method
#9052Substrate structure integrated with passive components
#9053BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME
#9054Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
#9055Array-Processed Stacked Semiconductor Packages
#9056Semiconductor device
#9057Thermal interconnect and interface materials, methods of production and uses thereof
#9058Fabrication method and structure of PCB assembly, and tool for assembly thereof
#9059ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
#9060Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#9061FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#9062Method to build robust mechanical structures on substrate surfaces
#9063Electronic component module and radio comunications equipment
#9064Flip chip mounting process and flip chip assembly
#9065Semiconductor device and method of manufacturing the same
#9066Semiconductor device with reduced contact resistance
#9067BLM structure for application to copper pad
#9068Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
#9069Semiconductor device and manufacturing method therefor
#9070Electronic circuit in a package-on-package configuration and method for producing the same
#9071Pillar Bump Package Technology
#9072Interconnect structure for semiconductor package
#9073Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
#9074Methods and apparatus for packaging integrated circuit devices
#9075Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
#9076Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
#9077Automatic level adjustment for die bonder
#9078Conductive adhesive rework method
#9079Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
#9080Integrated circuit mount system with solder mask pad
#9081Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
#9082Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region
#9083Packaging structure with protective layers and packaging method thereof
#9084Diffusion soldered semiconductor device
#9085CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME
#9086Method for producing a dielectric layer for an electronic component
#9087Component and method for producing a component
#9088Method for producing chip packages, and chip package produced in this way
#9089Chip structure with redistribution traces
#9090Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
#9091Semiconductor device and method of producing the same
#9092Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
#9093Method of manufacturing semiconductor device
#9094Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same
#9095Methods and apparatus for packaging integrated circuit devices
#9096Semiconductor device, electronic card and pad rearrangement substrate
#9097Semiconductor device
#9098EMI ABSORBING GAP FILLING MATERIAL
#9099Semiconductor Package Having Improved Adhesion and Solderability
#9100Integrated circuit package system employing an exposed thermally conductive coating
#9101Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#9102Electronic parts packaging structure and method of manufacturing the same
#9103Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film
#9104Arrangement for solder bump formation on wafers
#9105SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF
#9106Compressible films surrounding solder connectors
#9107Advanced Thin Flexible Microelectronic Assemblies and Methods for Making Same
#9108Electronic device with EMI screen and packing process thereof
#9109Multilayer printed circuit board
#9110Thermally conductive composite and uses for microelectronic packaging
#9111Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#9112Semiconductor package and method of manufacturing the same
#9113Solderability Improvement Method for Leaded Semiconductor Package
#9114Flip chip package including a non-planar heat spreader and method of making the same
#9115Semiconductor constructions and assemblies, and electronic systems
#9116SEMICONDUCTOR PACKAGE
#9117Composite multi-layer substrate and module using the substrate
#9118Electronic module with switching functions and method for producing the same
#9119Integrated circuit packaging system with ultra-thin die
#9120Multi-chip semiconductor connector assemblies
#9121Flip chip package and method of fabricating the same
#9122Method of Manufacturing a Semiconductor Device
#9123Semiconductor device
#9124Semiconductor device and method for manufacturing semiconductor device
#9125Semiconductor device with back surface electrode including a stress relaxation film
#9126Method for production of a semiconductor component
#9127Method of providing mixed size solder bumps on a substrate using a solder delivery head
#9128Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#9129Semiconductor package substrate for flip chip packaging
#9130Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method
#9131Detachable stiffener for ultra-thin die
#9132Nickel tin bonding system for semiconductor wafers and devices
#9133Method for fabricating a wafer level package with device wafer and passive component integration
#9134Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
#9135Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture
#9136Semiconductor device and method of manufacturing the semiconductor device
#9137Tapered die-side bumps
#9138Fine pitch microcontacts and method for forming thereof
#9139High density nanostructured interconnection
#9140Stack package having pattern die redistribution
#9141Stacked, interconnected semiconductor packages
#9142Multiple-dies semiconductor device with redistributed layer pads
#9143Integrated circuit (IC) chip and method for fabricating the same
#9144Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#9145Semiconductor device having an inductor
#9146Semiconductor package having embedded passive elements and method for manufacturing the same
#9147Semiconductor package having optimal interval between bond fingers for reduced substrate size
#9148Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#9149System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#9150Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#9151COMPLIANT ELECTRICAL CONTACTS
#9152Circuit-connecting material and circuit terminal connected structure and connecting method
#9153Die configurations and methods of manufacture
#9154Method for applying solder to redistribution lines
#9155Method of manufacturing a semiconductor device
#9156Manufacturing method for a leadless multi-chip electronic module
#9157BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#9158Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#9159Die package and probe card structures and fabrication methods
#9160Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
#9161Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#9162Semiconductor device having conductive adhesive layer and method of fabricating the same
#9163SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#9164Semiconductor Module Having Low Thermal Load
#9165RF power transistor having an encapsulated chip package
#9166Semiconductor apparatus with decoupling capacitor
#9167Semiconductor package including connector disposed in troughhole
#9168Integrated Circuits Having Controlled Inductances
#9169Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#9170Micro universal serial bus (USB) memory package
#9171Semiconductor device, manufacturing method and apparatus for the same
#9172Top layers of metal for high performance IC's
#9173Top layers of metal for high performance IC's
#9174Microelectronic assembly with back side metallization and method for forming the same
#9175Manufacturing method of semiconductor device
#9176METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE
#9177Interposer containing bypass capacitors for reducing voltage noise in an IC device
#9178NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
#9179Integrated circuit (IC) package stacking and IC packages formed by same
#9180SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#9181Resin Paste For Die Bonding And Its Use
#9182Top layers of metal for high performance IC's
#9183Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
#9184Top layers of metal for high performance IC's
#9185Top layers of metal for high performance IC's
#9186Top layers of metal for high performance IC's
#9187Top layers of metal for high performance IC's
#9188Top layers of metal for high performance IC's
#9189Top layers of metal for high performance IC's
#9190Top layers of metal for high performance IC's
#9191Top layers of metal for high performance IC's
#9192Top layers of metal for high performance IC's
#9193Top layers of metal for high performance IC's
#9194Top layers of metal for high performance IC's
#9195Method for manufacturing an electronic component and corresponding electronic component
#9196Structure and method for producing multiple size interconnections
#9197Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#9198Semiconductor device having semiconductor element with back electrode on insulating substrate
#9199Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#9200Electrically conductive connection, electronic component and method for their production
#9201Semiconductor package having dimpled plate interconnections
#9202DIE STACK CAPACITORS, ASSEMBLIES AND METHODS
#9203Top layers of metal for high performance IC's
#9204METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
#9205Methods of forming solder connections and structure thereof
#9206Fabrication method of semiconductor integrated circuit device
#9207Electronic device and production method thereof
#9208Semiconductor package and method of assembling the same
#9209MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#9210Method of manufacturing an integrated circuit
#9211Wiring module
#9212Computer systems having an interposer including a flexible material
#9213Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#9214Electronics package and associated method
#9215Electronic circuit arrangement
#9216Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#9217Top layers of metal for high performance IC's
#9218Top layers of metal for high performance IC's
#9219Top layers of metal for high performance IC's
#9220Top layers of metal for high performance IC's
#9221Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#9222Semiconductor device having improved contacts
#9223Top layers of metal for high performance IC's
#9224Semiconductor Device
#9225Semiconductor device package utilizing proud interconnect material
#9226Semiconductor device and method for producing the semiconductor device
#9227Power semiconductor device connected in distinct layers of plastic
#9228Semiconductor device
#9229Methods and apparatus for thermal management in a multi-layer embedded chip structure
#9230Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
#9231Semiconductor device
#9232Interconnections resistant to wicking
#9233Methods and apparatus for a semiconductor device package with improved thermal performance
#9234Semiconductor package structure
#9235Semiconductor device having a bonding pad and fuse and method for forming the same
#9236SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#9237INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#9238HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#9239Top layers of metal for high performance IC's
#9240Top layers of metal for high performance IC's
#9241Top layers of metal for high performance IC's
#9242Top layers of metal for high performance IC's
#9243Method of forming semiconductor packaged device
#9244Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
#9245Chip stack package and manufacturing method thereof
#9246Backages with buried electrical feedthroughs
#9247On-chip inductor using redistribution layer and dual-layer passivation
#9248METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#9249Encapsulated electronic device
#9250Microelectronic element chips
#9251Top layers of metal for high performance IC's
#9252Top layers of metal for high performance IC's
#9253Top layers of metal for high performance IC's
#9254Top layers of metal for high performance IC's
#9255Top layers of metal for high performance IC's
#9256Top layers of metal for high performance IC's
#9257Top layers of metal for high performance IC's
#9258Top layers of metal for high performance IC's
#9259Interlayer dielectric and pre-applied die attach adhesive materials
#9260Top layers of metal for high performance IC's
#9261Semiconductor device and method for fabricating the same
#9262System and method to reduce metal series resistance of bumped chip
#9263Semiconductor package substrate and semiconductor package having the same
#9264Chip stack, method of fabrication thereof, and semiconductor package having the same
#9265Semiconductor device having a bonding wire and method for manufacturing the same
#9266Stacked package electronic device
#9267Stack structure of circuit board with semiconductor component embedded therein
#9268Side stacking apparatus and method
#9269Semiconductor package structure
#9270Circuit Arrangement, System Carrier and Methods for Producing Same
#9271Semiconductor device and method for manufacturing the same
#9272Barrier layer for fine-pitch mask-based substrate bumping
#9273Separation method of semiconductor device
#9274Non-cyanide gold electroplating for fine-line gold traces and gold pads
#9275Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
#9276Interconnect structure and formation for package stacking of molded plastic area array package
#9277Semiconductor component with connecting elements and method for producing the same
#9278Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#9279Top layers of metal for high performance IC's
#9280Top layers of metal for high performance IC's
#9281Top layers of metal for high performance IC's
#9282Top layers of metal for high performance IC's
#9283Top layers of metal for high performance IC's
#9284Top layers of metal for high performance IC's
#9285Top layers of metal for high performance IC's
#9286Top layers of metal for high performance IC's
#9287Top layers of metal for high performance IC's
#9288Top layers of metal for high performance IC's
#9289Method of wire bonding over active area of a semiconductor circuit
#9290Device Comprising Circuit Elements Connected By Bonding Bump Structure
#9291Semiconductor device
#9292METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#9293Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#9294System and Method for Low Temperature Plasma Enhanced Bonding
#9295Conductive adhesive composition
#9296Method of providing solder bumps using reflow in a forming gas atmosphere
#9297Temporary chip attach using injection molded solder
#9298Apparatus For Aligning Microchips On Substrate And Method For The Same
#9299Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#9300Metallization layer for a power semiconductor device