Method of packaging a device having a tangible element and device thereof

WIRE BOND AND METHOD OF FORMING SAME

Packaged semiconductor chips

System and method for solder bump plating

Solder joint reliability in microelectronic packaging

Method of making lithographic contact elements

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Low fabrication cost, high performance, high reliability chip scale package

Method of chip manufacturing

Method for manufacturing electronic component, and electronic component

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Module with carrier element

Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuit

Structure and method for enhancing resistance to fracture of bonding pads

High performance system-on-chip using post passivation process

Integrated circuit chips with fine-line metal and over-passivation metal

Low fabrication cost, high performance, high reliability chip scale package

Electronic assembly with hot spot cooling

Semiconductor package with embedded die

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

Semiconductor package

Radiation hardened lateral MOSFET structure

Electronic assembly and circuit board

Method of sealing or welding two elements to one another

Precision high-frequency capacitor formed on semiconductor substrate

Wiring board and method of manufacturing the same

Circuit device and method of manufacturing the same

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Semiconductor device and manufacturing method of the same

Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

Semiconductor module including components in plastic casing

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Semiconductor element and process of manufacturing semiconductor element

Semiconductor chip, semiconductor device and methods for producing the same

Power semiconductor module

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Solder ball mounting method and solder ball mounting substrate manufacturing method

Technique for forming a passivation layer without a terminal metal

Bonding structure and fabrication thereof

Base plate for a power semiconductor module

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor device

Solder pillar bumping and a method of making the same

Semiconductor device and a method of manufacturing the same

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Packaging with base layers comprising alloy 42

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Method and apparatus of power ring positioning to minimize crosstalk

Embedded chip package

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor device and a method of manufacturing the same

Semiconductor device, method of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Semiconductor integrated circuit and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

Flip chip metallization method and devices

Electronic assemblies having a low processing temperature

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Stacked die with a recess in a die BGA package

Low profile ball grid array (BGA) package with exposed die and method of making same

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

Semiconductor module arrangement

Metallised film for sheet contacting

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor device with recess portion over pad electrode

Probe arrays and method for making

Wire bonding and wire bonding method

Terminal pad structures and methods of fabricating same

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Semiconductor device manufacturing method and manufacturing apparatus

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Semiconductor package and method for manufacturing the same

Dicing die-bonding film

Circuit board assembly

Semiconductor device and method for manufacturing the same

Semiconductor device with bonding pad support structure

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

I/O Architecture for integrated circuit package

Device having several contact areas

Semiconductor integrated circuit device having reduced terminals and I/O area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor apparatus

Semiconductor device having recessed connector portions

Semiconductor package preventing generation of static electricity therein

Materials, structures and methods for microelectronic packaging

Bumping electronic components using transfer substrates

Method of providing solder bumps on a substrate using localized heating

Method for producing a semiconductor component and substrate for carrying out the method

Gold-Tin Solder Joints Having Reduced Embrittlement

Bonding and probing pad structures

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

Wiring board

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Semiconductor device

Edge connect wafer level stacking with leads extending along edges

Light emitting device

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Electronic device including a nickel-palladium alloy layer

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Method of making a light emitting device having a molded encapsulant

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

LAYER FOR CHIP CONTACT ELEMENT

Substrate slot design for die stack packaging

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Die arrangement and method for producing a die arrangement

Semiconductor-embedded substrate and manufacturing method thereof

Power semiconductor arrangement

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Plastic surface mount large area power device

INTERDIGITATED LEADFINGERS

Process of forming an electronic device including an inductor

Method of assembling carbon nanotube reinforced solder caps

Copper bonding or superfine wire with improved bonding and corrosion properties

Method of forming metal lines and bumps for semiconductor devices

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Methods of connecting an antenna to a transponder chip

Semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic device and method for production

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Semiconductor device and method of manufacturing the same

Semiconductor device having sealing film and manufacturing method thereof

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

SEMICONDUCTOR PACKAGE COMPRISING ALIGNMENT MEMBERS

ELECTRONIC DEVICE AND PRODUCTION METHOD

Electromagnetic shielding using through-silicon vias

Modified gold-tin system with increased melting temperature for wafer bonding

Method of forming an inlay substrate having an antenna wire

Method of actuating implanted medical device

FIXING APPARATUS FOR SEMICONDUCTOR WAFER

Method for fabricating resin-molded semiconductor device having posts with bumps

Removing dry film resist residues using hydrolyzable membranes

Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Semiconductor assembly with component attached on die back side

Pad over active circuit system and method with meshed support structure

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Electrical interconnection structure formation

Castellation wafer level packaging of integrated circuit chips

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Via structure

Wafer level chip package and a method of fabricating thereof

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

Packaged microelectronic components with terminals exposed through encapsulant

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Electronic packages with fine particle wetting and non-wetting zones

Printed circuit board for package and manufacturing method thereof

Process for manufacturing semiconductor devices

Process of fabricating a semiconductor package

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

Methods using die attach paddle for mounting integrated circuit die

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Pad over active circuit system and method with frame support structure

Bonding wire and bond using a bonding wire

Wafer level chip scale package and method for manufacturing the same

Structure of mounting electronic component

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Power semiconductor module

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Mounting structure for IC tag and IC chip for mounting

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Electronic device having wiring substrate and lead frame

Stacked dual MOSFET package

Semiconductor device

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

Circuit-connecting material and circuit terminal connected structure and connecting method

Method for manufacturing SIP semiconductor device

Modified chip attach process

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET

Lead pin for mounting semiconductor and printed wiring board

Component embedded printed circuit board

IC package with a protective encapsulant and a stiffening encapsulant

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

Semiconductor device and method of producing the same

Semiconductor apparatus and manufacturing method of semiconductor apparatus

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Carrier board structure with semiconductor chip embedded therein

Chip package and method for fabricating the same

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Apparatus and method for packaging circuits

Semiconductor device

POWER MODULE WITH LAMINAR INTERCONNECT

Circuit-connecting material and circuit terminal connected structure and connecting method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Microball placement solutions

Method of manufacturing a component-embedded printed circuit board

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Methods for attaching microfeature dies to external devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Method for producing semiconductor device

Au Alloy Bonding Wire

HIGH PERFORMANCE IC PACKAGE AND METHOD

Semiconductor device including through electrode and method of manufacturing the same

Top layers of metal for high performance IC's

Stacked structure of chips and water structure for making the same

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Electric component with a flip-chip construction

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor package and method for manufacturing the same

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stackable packages for three-dimensional packaging of semiconductor dice

LED with phosphor tile and overmolded phosphor in lens

Process of forming an electronic device including a barrier layer

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Top layers of metal for integrated circuits

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device and method for manufacturing same

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Semiconductor die package using leadframe and clip and method of manufacturing

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Electronic module

Circuit substrate and semiconductor device

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process

Semiconductor chip structure

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Structure for bumped wafer test

High performance system-on-chip using post passivation process

Semiconductor device

Trace design to minimize electromigration damage to solder bumps

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Power semiconductor component

Component-embedded multilayer printed wiring board and manufacturing method thereof

Diamond heat sink

Interconnect for improved die to substrate electrical coupling

Chip package and method for fabricating the same

Multipath soldered thermal interface between a chip and its heat sink

Thermal method to control underfill flow in semiconductor devices

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Solder elements with columnar structures and methods of making the same

Method for embedding a component in a base

Semiconductor device and method for manufacturing the same

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Interconnection structure of integrated circuit chip

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

Bond Wireless Package

Method of packaging and interconnection of integrated circuits

Electronic device and method for producing a device

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Chip scale package for power devices and method for making the same