Dual-sided chip attached modules

Semiconductor device including electrically conductive bump and method of manufacturing the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Dual MOSFET package

Semiconductor device and method of manufacturing the same

Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Integrated circuit package system with different mold locking features

Wafer level semiconductor chip packages and methods of making the same

Flip chip MLP with folded heat sink

Copper straps

Dual side cooling integrated power device module and methods of manufacture

Top layers of metal for high performance IC's

Methods and apparatus having an integrated circuit attached to fused silica

Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component

Method of producing an electronic component

Integrated circuit chip packaging

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Super high density module with integrated wafer level packages

Method for fabricating semiconductor package with multi-layer die contact and external contact

Semiconductor device

Semiconductor device and method of producing the same

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Electronic component built-in substrate and method of manufacturing the same

Circuit board, method for manufacturing the same, and semiconductor device

Heat sink structure for embedded chips and method for fabricating the same

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method of fabricating microelectronic devices

Integrated circuit device with semiconductor device components embedded in plastic housing composition

Devices and systems having at least one dam structure

Lead frame and semiconductor device using the same

Component mounting apparatus and component mounting method

METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER

Interconnection structure, electronic component and method of manufacturing the same

Process for fabricating chip package structure

Printed circuit board

Semiconductor module

Package structure

SEMICONDUCTOR MODULE

Increased interconnect density electronic package and method of fabrication

METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL

Process for forming bumps and solder bump

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS

Systems and methods for high density multi-component modules

Method of forming stackable package

Method of making wirebond electronic package with enhanced chip pad design

3D interconnect with protruding contacts

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Wirebond pad for semiconductor chip or wafer

CHIP PACKAGING STRUCTURE

Method for forming C4 connections on integrated circuit chips and the resulting devices

Semiconductor device having a smaller electrostatic capacitance electrode

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

Power semiconductor module as H-bridge circuit and method for producing the same

Circuit apparatus and method of fabricating the apparatus

System and method for providing a power bus in a wirebond leadframe package

Conductive ball arraying apparatus

Polymer matrices for polymer solder hybrid materials

Semiconductor device and method of manufacturing the same

Semiconductor device with via hole of uneven width

Method of manufacturing semiconductor apparatus

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor die package including multiple dies and a common node structure

Power semiconductor component, power semiconductor device as well as methods for their production

Semiconductor power module including epoxy resin coating

Semiconductor device and method for producing the same

Wafer level semiconductor module and method for manufacturing the same

Hard disk drive preamp heat dissipation methods

Utra-thin substrate package technology

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

Leadframe enhancement and method of producing a multi-row semiconductor package

Power semiconductor module having surface-mountable flat external contacts and method for producing the same

Embedded integrated circuit package system

MOSFET power package

Semiconductor device using semiconductor chip

Fill head for injection molding of solder

Universal mold for injection molding of solder

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Method for Electroplating and Contact Projection Arrangement

Fabrication method for electronic system modules

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Flip-chip mounting method and bump formation method

Method of wafer level chip size packaging

Thin semiconductor device package

Chip package

Solder joint flip chip interconnection having relief structure

Conductive structures including titanium-tungsten base layers

Direct-write wafer level chip scale package

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stacked semiconductor device

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Optical display package and the method thereof

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Etched leadframe flipchip package system

Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes

Light emitting devices suitable for flip-chip bonding

Semiconductor light emitting device with first and second leads

PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER

Semiconductor device and method of producing the same

NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING

Apparatuses and methods to enhance passivation and ILD reliability

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Semiconductor die packages using thin dies and metal substrates

Hybrid stacking package system

SEMICONDUCTOR PACKAGE STRUCTURE

High frequency IC package and method for fabricating the same

Common Assembly Substrate and Applications Thereof

Semiconductor device having an adhesion promoting layer and method for producing it

Integrated circuit package system with ground ring

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

Power semiconductor module and fabrication method

Chip scale surface mount package for semiconductor device and process of fabricating the same

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION

Multichip package system

Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device

QFN housing having optimized connecting surface geometry

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming metal bumps

Method and structure for eliminating aluminum terminal pad material in semiconductor devices

Methods and materials useful for chip stacking, chip and wafer bonding

Room temperature metal direct bonding

Semiconductor device manufacturing method

Method for making a wedge wedge wire loop

Gold/silicon eutectic die bonding method

Flexible interconnect pattern on semiconductor package

Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method

Functional blocks for assembly

Fabrication method of semiconductor integrated circuit device

Article and assembly for magnetically directed self assembly

Flip chip bonding structure

Power module

Stacked integrated circuit package system with connection protection

Carbon nanotube via interconnect

SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Isolating chip-to-chip contact

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Flip chip bonded package applicable to fine pitch technology

High-performance semiconductor package

Semiconductor device and manufacturing method thereof

Interconnect structure with stress buffering ability and the manufacturing method thereof

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Semiconductor device including a DC-DC converter

Folding chip planar stack package

Integrated-circuit chip with offset external pads and method for fabricating such a chip

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method and arrangement for forming a microelectronic package

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Connecting device for electronic components

Multilayer printed circuit board

Heat conduction from an embedded component

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB

Resin Paste for Die Bonding

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

System for making a semiconductor device using bump material including liquid

Semiconductor device and medium of fabricating the same

Method for fabricating a BGA device and BGA device

Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

INDIUM FEATURES ON MULTI-CONTACT CHIPS

Reactive foil assembly

SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS

Semiconductor integrated circuit device

Structure and method to improve current-carrying capabilities of C4 joints

Chip package

Method for precision assembly of integrated circuit chip packages

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Semiconductor components with through wire interconnects

Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions

Semiconductor devices and electrical parts manufacturing using metal coated wires

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device and manufacturing method of a semiconductor device

Semiconductor component having test pads and method and apparatus for testing same

Electronic component and its manufacturing method

Power transistor and power semiconductor device

Method for forming metal bumps

Method for manufacturing bump of wafer level package

Semiconductor wafer coat layers and methods therefor

Manufacturing method of a semiconductor device

Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument

Manufacturing method of semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor component having test pads and method and apparatus for testing same

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Flip-chip type semiconductor device

Low thermal resistance assembly for flip chip applications

Semiconductor device

Aluminum bump bonding for fine aluminum wire

Device having a contacting structure

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Multichip module with improved system carrier

Semiconductor package with heat spreader

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

Semiconductor device

Semiconductor device

Chip Package Structure

Chip package and wafer treating method for making adhesive chips

Chip packaging structure for improving reliability

Vertical semiconductor power switch, electronic component and methods of producing the same

GaAs integrated circuit device and method of attaching same

Method of self-assembly on a surface

Resin composition and semiconductor device produced by using the same

Method, system, and apparatus for gravity assisted chip attachment

Method for fabricating a semiconductor package

Method for manufacturing semiconductor device

Perforated embedded plane package and method

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Composite bump

Method of forming a bump and a connector structure having the bump

Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Semiconductor device

Semiconductor device and manufacturing method thereof

Warp compensated package and method

Integrated circuit package system

Embedded chip package structure with chip support protruding section

Semiconductor package system with substrate having different bondable heights at lead finger tips

GaAs power transistor

Electronic component with high density, low cost attachment

Method for removing residual flux

Method for forming reinforced interconnects on a substrate

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Optical device and method for manufacturing the same

Method for embedding a component in a base

Electronic substrate, semiconductor device, and electronic device

Chip package and method for fabricating the same

Layer between interfaces of different components in semiconductor devices

Solder bump structure for flip chip package and method for manufacturing the same

SEMICONDUCTOR DEVICE WITH BATTERY

Bond pad structure for wire bonding

Semiconductor device having capacitors for reducing power source noise

PACKAGE WARPAGE CONTROL

Method for diffusion soldering

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor packaging method

Semiconductor package

Method for manufacturing semiconductor device

Method for fabricating stacked semiconductor components with through wire interconnects

Semiconductor device with semiconductor device components embedded in plastic package compound

Stackable integrated circuit package system with multiple interconnect interface

System for fabricating semiconductor components with through wire interconnects

Electronic assembly and method for forming the same

METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE

Wiring board with connection electrode formed in opening and semiconductor device using the same

Semiconductor device, electronic device and fabrication method of the same

Redistribution connecting structure of solder balls

Flip-Chip Device Having Underfill in Controlled Gap

Bond pad structures with reduced coupling noise

Chip underfill in flip-chip technologies

Power semiconductor arrangement

Thermally-enhanced ball grid array package structure and method

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

No lead package with heat spreader

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE

Wafer-leveled chip packaging structure and method thereof

Manufacturing method of semiconductor module including solid-liquid diffusion joining steps

Semiconductor device and manufacturing method for the same

Processed wafer via

Manufacturing method of semiconductor device

Semiconductor device and manufacturing the same

Stacked chip-based system and method

Integrated circuit package system with bonding lands

Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package

Integrated circuit architecture for reducing interconnect parasitics

Semiconductor device and manufacturing method for the same

Single-chip and multi-chip module for proximity communication

Semiconductor package having an optical device and a method of making the same

Semiconductor apparatus containing multi-chip package structures

Apparatus and methods for high-density chip connectivity

Printed board with a pin for mounting a component

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Semiconductor chip package having an adhesive tape attached on bonding wires

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Image sensor packaging structure and method of manufacturing the same

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME