212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
Electronic module with layer of adhesive and process for producing it
#11402Damascene patterning of barrier layer metal for C4 solder bumps
#11403Mounting method and mounting device
#11404Vibratable die attachment tool
#11405Manufacturing method of a semiconductor device, and paste applicator
#11406Circuit-connecting material and circuit terminal connected structure and connecting method
#11407Method of manufacturing semiconductor device
#11408Castellation wafer level packaging of integrated circuit chips
#11409Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts
#11410Semiconductor package including rivet for bonding of lead posts
#11411Top layers of metal for high performance IC's
#11412Design of beol patterns to reduce the stresses on structures below chip bondpads
#11413Connection between a semiconductor chip and a circuit component with a large contact area
#11414Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#11415Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#11416Methods of bonding two semiconductor devices
#11417Circuit device with at least partial packaging and method for forming
#11418Semiconductor device and manufacturing method therefor
#11419Wafer-level assembly method for semiconductor devices
#11420Semiconductor device and method of manufacturing the same
#11421Radiofrequency power semiconductor module with cavity housing, and method for producing it
#11422IMPROVED DECAL SOLDER TRANSFER METHOD
#11423Method of fabricating a semiconductor device and mounting equipment
#11424Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#11425Multi-layered circuit board assembly with improved thermal dissipation
#11426Method of manufacturing a wiring board
#11427High thermal cycle conductor system
#11428Methods of forming electronic structures including conductive shunt layers and related structures
#11429Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#11430Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
#11431Electronic package having a folded flexible substrate and method of manufacturing the same
#11432Castellation wafer level packaging of integrated circuit chips
#11433Substrate having built-in semiconductor apparatus and manufacturing method thereof
#11434Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
#11435Manufacturing method for magnetic sensor and lead frame therefor
#11436Electronic device package
#11437Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration
#11438Substrate based unmolded package
#11439Method of forming a micro solder ball for use in C4 bonding process
#11440BGA package with concave shaped bonding pads
#11441Microelectronic devices
#11442Flip-chip without bumps and polymer for board assembly
#11443Thermal interposer for cooled electrical packages
#11444Semiconductor component and assembly having female conductive members
#11445Castellation wafer level packaging of integrated circuit chips
#11446Stacked semiconductor device and semiconductor memory module
#11447Plastic encapsulated semiconductor device with reliable down bonds
#11448Semiconductor device and method of manufacturing same
#11449Semiconductor integrated circuit device
#11450Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
#11451Under bump metallurgy process on passivation opening
#11452Method for ultra thinning bumped wafers for flip chip
#11453Highly compliant plate for wafer bonding
#11454Modified chip attach process and apparatus
#11455Method for fabricating an electronic component embedded substrate
#11456Stacked package electronic device
#11457Substrate based unmolded package
#11458Technique for protecting photonic devices in optoelectronic packages with clear overmolding
#11459In-line wire bonding on a package, and method of assembling same
#11460Electronic assembly having multi-material interconnects
#11461Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
#11462Chip-to-chip trench circuit structure
#11463Direct connection multi-chip semiconductor element structure
#11464Low inductance semiconductor device having half-bridge configuration
#11465Wafer level mounting frame with passive components integration for ball grid array packaging
#11466Castellation wafer level packaging of integrated circuit chips
#11467Castellation wafer level packaging of integrated circuit chips
#11468Multi-component integrated circuit contacts
#11469Package Structure
#11470Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#11471Semiconductor device, optoelectronic board, and production methods therefor
#11472Circular wire-bond pad, package made therewith, and method of assembling same
#11473Co-curable compositions
#11474Modular board device, high frequency module, and method of manufacturing same
#11475Heat sink formed of multiple metal layers on backside of integrated circuit die
#11476Method of stacking wafers with anisotropic conductive adhesive
#11477Method for fabricating semiconductor packages
#11478Semiconductor chip package manufacturing method including screen printing process
#11479Electronic device package
#11480Electrical package employing segmented connector and solder joint
#11481Electrostatic discharge (ESD) protection for integrated circuit packages
#11482Method and structure for manufacturing improved yield semiconductor packaged devices
#11483Lead solder indicator and method
#11484Semiconductor device with wire bond inductor and method
#11485Encapsulated device with heat isolating structure
#11486Multi-chip semiconductor connector assemblies
#11487Method of embedding semiconductor element in carrier and embedded structure thereof
#11488Semiconductor package including a semiconductor device, and method of manufacturing the same
#11489Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#11490Methods of forming vias in multilayer substrates
#11491Circuit apparatus provided with asperities on substrate surface
#11492Electronic assembly with carbon nanotube contact formations or interconnections
#11493Method of soldering electronic component having solder bumps to substrate
#11494In-situ alloyed solders, articles made thereby, and processes of making same
#11495Die attach area cut-on-fly method and apparatus
#11496Apparatus and method for indexing of substrates and lead frames
#11497Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
#11498Stud bump socket
#11499High density bonding of electrical devices
#11500High-reliability solder joint for printed circuit board and semiconductor package module using the same
#11501Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
#11502FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF
#11503Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#11504Prefabricated semiconductor chip carrier
#11505Interposer containing bypass capacitors for reducing voltage noise in an IC device
#11506Semiconductor die package with internal bypass capacitors
#11507Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#11508Apparatus for providing capacitive decoupling between on-die power and ground conductors
#11509Printed wiring board
#11510Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#11511Co-packaged control circuit, transistor and inverted diode
#11512Semiconductor assembly having substrate with electroplated contact pads
#11513Semiconductor, electrooptic apparatus and electronic apparatus
#11514Semiconductor device, manufacturing method and apparatus for the same
#11515Method of forming a lead-free bump and a plating apparatus therefor
#11516Compliant spring contact structures
#11517Flexible scrub ring contact
#11518Fabrication method of wafer level chip scale packages
#11519Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
#11520Method for fabricating chip structure
#11521Microfeature devices and methods for manufacturing microfeature devices
#11522Method for forming bump on electrode pad with use of double-layered film
#11523Chip scale package with open substrate
#11524High density flip chip interconnections
#11525Heat-decaying materials, transfer sheet using the same, and patterning method
#11526Semiconductor device and semiconductor apparatus
#11527Semiconductor apparatus and method of manufacturing semiconductor apparatus
#11528Lead-free conductive jointing bump
#11529Method of forming a solder bump and the structure thereof
#11530Pre-doped reflow interconnections for copper pads
#11531Stress mitigation layer to reduce under bump stress concentration
#11532Semiconductor device mounted on and electrically connected to circuit board
#11533Package and method for packaging an integrated circuit die
#11534High density chip scale leadframe package and method of manufacturing the package
#11535Method and stencil for extruding material on a substrate
#11536Lead-free bonding systems
#11537Semiconductor device with reduced contact resistance
#11538Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#11539Formation method for conductive bump
#11540Method for forming interconnects on thin wafers
#11541Methods of making microelectronic packages
#11542Method of making photolithographically-patterned out-of-plane coil structures
#11543Crack protection for silicon die
#11544Optimized driver layout for integrated circuits with staggered bond pads
#11545Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#11546Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#11547Semiconductor device
#11548Semiconductor component and system having thinned, encapsulated dice
#11549Semiconductor device having adhesion increasing film to prevent peeling
#11550Semiconductor device with slanting side surface for external connection
#11551Ribbon bonding in an electronic package
#11552Stacked semiconductor package having adhesive/spacer structure and insulation
#11553Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
#11554Semiconductor package including redistribution pattern and method of manufacturing the same
#11555Component built-in module and method for producing the same
#11556Preparation of front contact for surface mounting
#11557Adhesive/spacer island structure for stacking over wire bonded die
#11558Flip chip FET device
#11559Soldering method and solder joints formed therein
#11560Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#11561Method and stencil for extruding material on a substrate
#11562Novel aqueous based metal etchant
#11563Screen printing method of forming conductive bumps
#11564Manufacturing method of semiconductor device
#11565Process of bonding circuitry components
#11566Semiconductor device and method of manufacturing the same
#11567Integrated circuit packages with reduced stress on die and associated methods
#11568Top layers of metal for high performance IC's
#11569Package warpage control
#11570Refractory solid, adhesive composition, and device, and associated method
#11571Method of manufacturing semiconductor device and support structure for semiconductor substrate
#11572Asymmetric bump structure
#11573Semiconductor device and method of manufacturing the same
#11574Semiconductor device and manufacturing process therefor
#11575IC chip package
#11576Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#11577Semiconductor device and a method of manufacturing the same
#11578Integrated circuit leadframe and fabrication method therefor
#11579Semiconductor device and method for manufacturing the same
#11580Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#11581Wire bonding method and apparatus for integrated circuit
#11582Selective packaging of tested semiconductor devices
#11583Moisture-resistant electronic device package and methods of assembly
#11584Multi-band tunable resonant circuit
#11585Top layers of metal for high performance IC's
#11586Circuit device, manufacturing method thereof, and sheet-like board member
#11587Method for fabrication of wafer level package incorporating dual compliant layers
#11588Integrated ball and via package and formation process
#11589Dual row leadframe and fabrication method
#11590Semiconductor device and interposer
#11591Fine-pitch packaging substrate and a method of forming the same
#11592Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#11593Substrate for solder joint
#11594Semiconductor device
#11595Bump structure
#11596Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#11597Semiconductor device and method of manufacturing the same
#11598Power composite integrated semiconductor device and manufacturing method thereof
#11599Method of manufacturing electronic part packaging structure
#11600Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#11601Semiconductor die attachment for high vacuum tubes
#11602Structure for mounting electronic component on wiring board
#11603Thermal interface adhesive and rework
#11604Method of manufacturing semiconductor device
#11605Void free solder arrangement for screen printing semiconductor wafers
#11606Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#11607Methods for producing an electronic device having microscopically small contact areas
#11608Method to build robust mechanical structures on substrate surfaces
#11609Light emitting diodes for high AC voltage operation and general lighting
#11610Semiconductor package and method for fabricating the same
#11611Vibration-assisted method for underfilling flip-chip electronic devices
#11612Semiconductor chip package and method for fabricating the same
#11613Flip chip package and process of forming the same
#11614Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#11615Semiconductor device and method of manufacturing the semiconductor device
#11616Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#11617Electronic device package structures
#11618Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#11619Solder flow stops for semiconductor die substrates
#11620High electrical performance semiconductor package
#11621Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
#11622Semiconductor device and manufacturing method therefor
#11623Package design and method for electrically connecting die to package
#11624Semiconductor die attachment for high vacuum tubes
#11625Semiconductor package and method of fabricating the same
#11626Die package
#11627Microelectronic assembly having a perimeter around a MEMS device
#11628Semiconductor (LED) chip attachment
#11629Method of bumping die pads for wafer testing
#11630Lead wire bonding method
#11631Microelectronic assembly having variable thickness solder joint
#11632Multiple selectable function integrated circuit module
#11633Under bump metallization layer to enable use of high tin content solder bumps
#11634Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#11635Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#11636Method for internal electrical insulation of a substrate for a power semiconductor module
#11637Semiconductor chip arrangement and method
#11638Electronic device including chip parts and a method for manufacturing the same
#11639Semiconductor device
#11640Chip scale package with heat spreader
#11641Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#11642Electronic circuit package
#11643Array capacitors in interposers, and methods of using same
#11644Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
#11645Flip chip semiconductor package for testing bump and method of fabricating the same
#11646Fill for large volume vias
#11647Selectable decoupling capacitors for integrated circuits and associated methods
#11648Method of manufacturing an electronic parts packaging structure
#11649Barrier for interconnect and method
#11650Top layers of metal for high performance IC's
#11651Methods of forming solder bumps on exposed metal pads
#11652Single row bond pad arrangement
#11653Semiconductor device and manufacturing method thereof
#11654Method for making an interconnect pad
#11655Method of fabricating a semiconductor device
#11656Microelectronic connection components having bondable wires
#11657Method and apparatus for synthesizing high-frequency signals for wireless communications
#11658Semiconductor chip having pads with plural junctions for different assembly methods
#11659Integrated circuit die for wire bonding and flip-chip mounting
#11660FCBGA package structure
#11661Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#11662Semiconductor component having multiple stacked dice
#11663Structure of package
#11664Flip chip bonding tool and ball placement capillary
#11665Method of fabricating a rat's nest RFID antenna
#11666Method of making a semiconductor device using bump material including a liquid
#11667Method for producing a semiconductor element
#11668Semiconductor assembly using dual-cure die attach adhesive
#11669Semiconductor chip having pads with plural junctions for different assembly methods
#11670Multiple chip semiconductor package
#11671Wire bonding system and method of use
#11672Process for fabricating chip package structure
#11673Semiconductor package for a large die
#11674High-frequency amplification device
#11675Semiconductor device
#11676Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#11677Method for manufacturing semiconductor device
#11678Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
#11679Method and apparatus for improved power routing
#11680Bump structure for a semiconductor device and method of manufacture
#11681Method for manufacturing semiconductor device having solder layer
#11682Lead frame and method of manufacturing the same
#11683Semiconductor device and manufacturing method of the same
#11684Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#11685Semiconductor device
#11686Semiconductor device
#11687Microelectronic assembly having a redistribution conductor over a microelectronic die
#11688Wafer level chip scale packaging structure and method of fabricating the same
#11689Flip-chip type semiconductor devices and conductive elements thereof
#11690Semiconductor device
#11691Semiconductor device, magnetic sensor, and magnetic sensor unit
#11692Semiconductor device and multilayer substrate therefor
#11693Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#11694Semiconductor packages, and methods of forming semiconductor packages
#11695Power semiconductor arrangement
#11696Display device
#11697In-process semiconductor packages with leadframe grid arrays
#11698Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#11699Semiconductor device with stacked semiconductor chips of the same type
#11700High performance system-on-chip discrete components using post passivation process