212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
Semiconductor device having a refractory metal containing film and method for manufacturing the same
#11702Power semiconductor switching devices and power semiconductor devices
#11703Thermally conductive compositions and methods of making thereof
#11704Programmable radio transceiver
#11705Method of migrating and fixing particles in a solution to bumps on a chip
#11706Method of connecting base materials
#11707Electronic component mounting method and apparatus and ultrasonic bonding head
#11708Packaging assembly utilizing flip chip and conductive plastic traces
#11709Method for fabricating encapsulated semiconductor components
#11710Method for depositing a solder material on a substrate
#11711Methods for fabricating electronic components to include supports for conductive structures
#11712Manufacture of microelectronic fold packages
#11713Amplification of HIV-1 gag sequences for detection of sequences associated with drug-resistance mutations
#11714Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#11715Method for embedding a component in a base
#11716Heat curable adhesive composition, article, semiconductor apparatus and method
#11717Method of fabricating electrical connection terminal of embedded chip
#11718High density nanostructured interconnection
#11719Electronic component mounting method and apparatus
#11720Extension of fatigue life for C4 solder ball to chip connection
#11721Circuit device and method of manufacturing the circuit device
#11722Circuit board, device mounting structure, device mounting method, and electronic apparatus
#11723Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#11724Integrated circuit package and method having wire-bonded intra-die electrical connections
#11725Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#11726Electronic package with optimized lamination process
#11727Semiconductor device and method of fabricating the same
#11728Method for maintaining solder thickness in flipchip attach packaging processes
#11729Semiconductor device and method for manufacturing same
#11730Circuit device
#11731Integrated circuit device having flexible leadframe
#11732Leadless semiconductor package and manufacturing method thereof
#11733Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#11734Semiconductor device comprising through-electrode interconnect
#11735Wafer support and release in wafer processing
#11736Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#11737Self-coplanarity bumping shape for flip-chip
#11738Carrier substrates and conductive elements thereof
#11739Circuitry module
#11740Semiconductor device
#11741Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#11742Semiconductor flip-chip package and method for the fabrication thereof
#11743Self-coplanarity bumping shape for flip chip
#11744Die down semiconductor package
#11745Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#11746Use of palladium in IC manufacturing with conductive polymer bump
#11747Semiconductor device
#11748Microelectronic assembly having encapsulated wire bonding leads
#11749Semiconductor device, a method of manufacturing the same and an electronic device
#11750Semiconductor device with non-overlapping chip mounting sections
#11751Semiconductor BGA package having a segmented voltage plane and method of making
#11752Top finger having a groove and semiconductor device having the same
#11753Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#11754Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#11755Power semiconductor module
#11756Underfill fluxing curative
#11757Fabrication method and structure of PCB assembly, and tool for assembly thereof
#11758Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#11759Methods of forming bumps using barrier layers as etch masks
#11760METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME
#11761Low fabrication cost, high performance, high reliability chip scale package
#11762Method of wafer/substrate bonding
#11763BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#11764Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#11765Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#11766Programmable radio transceiver
#11767Motor driving system having power semiconductor module life detection function
#11768Adhesion by plasma conditioning of semiconductor chip surfaces
#11769Semiconductor device and manufacturing metthod thereof
#11770Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#11771Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#11772Under bump metallization layer to enable use of high tin content solder bumps
#11773Chip package and process thereof
#11774Electric wave readable data carrier manufacturing method, substrate, and electronic component module
#11775Semiconductor device and method of manufacturing the same
#11776Semiconductor device
#11777Semiconductor device with plate-shaped component
#11778Semiconductor chip package
#11779Method for attaching shields on substrates
#11780Semiconductor device and method of manufacturing the same
#11781Solid state imaging device having electromagnetic wave absorber attached to a mounting board
#11782Bumpless die and heat spreader lid module bonded to bumped die carrier
#11783Electronic parts packaging structure and method of manufacturing the same
#11784High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#11785Top layers of metal for high performance IC's
#11786Solder bump structure and method for forming a solder bump
#11787Methods for forming electrical connections and resulting devices
#11788Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#11789Method of routing an electrical connection on a semiconductor device and structure therefor
#11790Semiconductor device and manufacturing method of the same
#11791Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
#11792Method of producing an electronic component with flexible bonding
#11793Manufacturing method of semiconductor device
#11794Microelectronic device interconnects
#11795Semiconductor device and method of manufacturing the same
#11796Stress and force management techniques for a semiconductor die
#11797Method for manufacturing wiring board and semiconductor device
#11798Semiconductor device with recessed post electrode
#11799Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#11800Stacked electronic part
#11801Methods and apparatus for packaging integrated circuit devices
#11802Circuit device and manufacturing method thereof
#11803Semiconductor package having step type die and method for manufacturing the same
#11804Ultrasonic tool and ultrasonic bonder
#11805Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#11806Manufacturing and testing of electrostatic discharge protection circuits
#11807Semiconductor chip capable of implementing wire bonding over active circuits
#11808Memory component with asymmetrical contact row
#11809Apparatus and method for attaching a heat sink to an integrated circuit module
#11810Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#11811Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#11812Top layers of metal for high performance IC's
#11813Semiconductor device and manufacturing method thereof
#11814Semiconductor device and method for manufacturing the same
#11815Bump and fabricating process thereof
#11816Package structure with two solder arrays
#11817Solderable top metalization and passivation for source mounted package
#11818Semiconductor component assemblies having interconnects
#11819Semiconductor package
#11820Multi-chip package
#11821Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
#11822Two solder array structure with two high melting solder joints
#11823Semiconductor element and wafer level chip size package therefor
#11824Multi-chip package structure
#11825Semiconductor device and manufacturing method thereof
#11826Semiconductor device and electronic device
#11827Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#11828Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
#11829Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls
#11830Underfill system for die-over-die arrangements
#11831Semiconductor device and method of manufacturing the same
#11832Device mounting method and device transport apparatus
#11833Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
#11834Circuit component with bump formed over chip
#11835Semiconductor device manufacturing method and manufacturing apparatus
#11836Submount and semiconductor device
#11837Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#11838Semiconductor device and manufacturing method for the same
#11839Method for mounting semiconductor chips and corresponding semiconductor chip system
#11840Packaged semiconductor device
#11841Bonding structure and fabrication thereof
#11842Resin-molded semiconductor device having posts with bumps and method for fabricating the same
#11843Electrical connection materials and electrical connection methods
#11844Multi-chip package including at least one semiconductor device enclosed therein
#11845Semiconductor device and manufacturing method of the same
#11846Testable electrostatic discharge protection circuits
#11847Semiconductor device
#11848Flip-chip light emitting diode device without sub-mount
#11849Light emitting device
#11850Semiconductor devices and manufacturing method therefor
#11851Titanium stripping solution
#11852Method to prevent passivation layer peeling in a solder bump formation process
#11853Methods of fabrication of package assemblies for optically interactive electronic devices
#11854Via structure of packages for high frequency semiconductor devices
#11855Manufacturing method of semiconductor device
#11856Electronic component, method of manufacturing the electronic component, and electronic apparatus
#11857Semiconductor device assembly process
#11858Low fabrication cost, high performance, high reliability chip scale package
#11859LSI package, LSI element testing method, and semiconductor device manufacturing method
#11860Packaged die on PCB with heat sink encapsulant and methods
#11861Low coefficient of thermal expansion build-up layer packaging and method thereof
#11862Apparatus for encapsulating a multi-chip substrate array
#11863Semiconductor package
#11864Interconnect system without through-holes
#11865Semiconductor device and manufacturing method thereof
#11866Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#11867Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#11868Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#11869Method and apparatus for fabricating self-assembling microstructures
#11870Method of manufacturing semiconductor device
#11871Intrinsic thermal enhancement for FBGA package
#11872Semiconductor device manufacturing method and manufacturing apparatus
#11873Apparatus and method for die attachment
#11874Semiconductor device
#11875Optimized power delivery to high speed, high pin-count devices
#11876Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#11877System in package
#11878Circuit carrier
#11879High density lead arrangement package structure
#11880High performance system-on-chip using post passivation process
#11881Laser cleaning system for a wire bonding machine
#11882Manufacturing method and manufacturing apparatus for semiconductor device
#11883Microelectronic packages and methods therefor
#11884Single mask via method and device
#11885Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#11886Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#11887Semiconductor copper bond pad surface protection
#11888Semiconductor device and method of manufacturing the same
#11889Thermal head and bonding connection method therefor
#11890Flip-chip attach structure
#11891Semiconductor device and manufacturing method thereof
#11892Lateral conduction Schottky diode with plural mesas
#11893System semiconductor device and method of manufacturing the same
#11894Systems and methods of plating via interconnects
#11895Adhesive, method of connecting wiring terminals and wiring structure
#11896Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
#11897Manufacturing method of semiconductor device
#11898BUMPING PROCESS OF LIGHT EMITTING DIODE
#11899Wafer-level chip scale package and method for fabricating and using the same
#11900Bumping process of light emitting diode
#11901Method for manufacturing semiconductor device
#11902Ball transferring method and apparatus
#11903Wafer-level package and method for production thereof
#11904Microelectronic assembly having array including passive elements and interconnects
#11905Socket grid array
#11906Wire-bonding method and semiconductor package using the same
#11907Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#11908Method for assembling a ball grid array package with two substrates
#11909Anisotropic conductive film and bump, and packaging structure of semiconductor having the same
#11910Semiconductor package with passive device integration
#11911Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
#11912High performance system-on-chip discrete components using post passivation process
#11913Methods for reducing flip chip stress
#11914Conductive bond for through-wafer interconnect
#11915Flip-chip adaptor package for bare die
#11916DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#11917Semiconductor device including semiconductor element mounted on another semiconductor element
#11918Bumped IC, display device and electronic device using the same
#11919Semiconductor device and method for manufacturing the same
#11920Semiconductor device and method of fabricating the same
#11921Pre-solder structure on semiconductor package substrate and method for fabricating the same
#11922Partially etched dielectric film with conductive features
#11923Solder alloy and semiconductor device
#11924Bumpless wafer scale device and board assembly
#11925Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#11926Semiconductor device having radiation structure
#11927Method for making a socket to perform testing on integrated circuits
#11928Method of making microelectronic packages including electrically and/or thermally conductive element
#11929Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#11930Film substrate, fabrication method thereof, and image display substrate
#11931Semiconductor device and method of manufacturing same
#11932Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
#11933Die-wafer package and method of fabricating same
#11934Surface mountable hermetically sealed package
#11935High Q factor integrated circuit inductor
#11936METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#11937Selective passivation of exposed silicon
#11938Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#11939Method of fabricating a pad over active circuit I.C. with meshed support structure
#11940Method of forming solder bump with reduced surface defects
#11941Method for fabricating a chip scale package using wafer level processing
#11942Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
#11943Semiconductor device and manufacturing method of them
#11944Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#11945Adhesion by plasma conditioning of semiconductor chip
#11946Method and structure to reduce risk of gold embrittlement in solder joints
#11947Semiconductor device
#11948Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#11949WAFER-LEVEL PACKAGE STRUCTURE
#11950Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#11951Semiconductor device with a solder creep-up prevention zone
#11952Semiconductor device having conducting portion of upper and lower conductive layers
#11953Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#11954Room temperature metal direct bonding
#11955Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#11956Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#11957Semiconductor device
#11958Method for manufacturing circuit board, circuit board, and electronic equipment
#11959Method of making wireless semiconductor device, and leadframe used therefor
#11960Interconnect structure for power transistors
#11961Optical sensor module with semiconductor device for drive
#11962ULTRA-FINE CONTACT ALIGNMENT
#11963Method and apparatus for forming metal contacts on a substrate
#11964Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
#11965Method of manufacturing high performance copper inductors with bond pads
#11966Method of forming segmented ball limiting metallurgy
#11967Hermetic passivation structure with low capacitance
#11968Semiconductor device and method of fabricating the same
#11969Device transferring method
#11970Device transferring method
#11971Device transferring method
#11972Structure and method for temporarily holding integrated circuit chips in accurate alignment
#11973Electronic device and production method thereof
#11974Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#11975Colored conductive wires for a semiconductor package
#11976Die attach by temperature gradient lead free soft solder metal sheet or film
#11977Method for manufacturing connection construction
#11978Process for producing a semiconductor device
#11979Integrated device including connections on a separate wafer
#11980Support ring for use with a contact pad and semiconductor device components including the same
#11981Self-supporting connecting element for a semiconductor chip
#11982Structure of gold fingers
#11983Partially populated ball grid design to accommodate landing pads close to the die
#11984Semiconductor device including semiconductor elements mounted on base plate
#11985Integrated circuit packages with sandwiched capacitors
#11986Semiconductor device using LED chip
#11987Test assembly including a test die for testing a semiconductor product die
#11988Mounting board and electronic device using same
#11989Electronic component mounting method and apparatus
#11990Device transferring method, and device arraying method and image display unit fabricating method using the same
#11991Methods of making microelectronic assemblies
#11992Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#11993Method for manufacturing semiconductor device with plural semiconductor chips
#11994Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#11995Interconnect circuitry, multichip module, and methods for making them
#11996Stacked IC device having functions for selecting and counting IC chips
#11997Cooling devices and methods of using them
#11998Semiconductor chip package
#11999Adhesive film for circuit connection, and circuit connection structure
#12000UBM for fine pitch solder ball and flip-chip packaging method using the same