212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
High-powered light emitting device with improved thermal properties
#11102Interconnect including a pliable surface and use thereof
#11103Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#11104Bumping process
#11105Bumping process and structure thereof
#11106Fabrication method of a wafer structure
#11107Method for fabricating semiconductor components
#11108Thermal enhance package and manufacturing method thereof
#11109Methods of manufacturing interposers with flexible solder pad elements
#11110Structure of mounting electronic component
#11111Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
#11112Cavity-down Package and Method for Fabricating the same
#11113Bond pad structure for integrated circuit chip
#11114Method of mounting an electronic part to a substrate
#11115Wiring board and method for producing same
#11116Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#11117Semiconductor device, circuit board, electro-optic device, electronic device
#11118Fine pitch bonding pad layout and method of manufacturing same
#11119Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module
#11120Flip chip package including a non-planar heat spreader and method of making the same
#11121Film circuit substrate having Sn-In alloy layer
#11122Manufacturing method of solid-state image sensing device
#11123Method of mounting electronic component
#11124Method of ultrasonic-mounting electronic component and ultrasonic mounting machine
#11125Bumping process and structure thereof
#11126Method for flip chip bonding by utilizing an interposer with embedded bumps
#11127Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#11128Oblique parts or surfaces
#11129Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
#11130Semiconductor device and manufacturing method of the same
#11131Semiconductor device and method of manufacturing the same
#11132UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE
#11133Bumping process and structure thereof
#11134IC substrate and manufacturing method thereof and semiconductor element package thereby
#11135Solderable top metal for SiC device
#11136Method and apparatus for placing conductive balls
#11137Device for bonding a metal on a surface of a substrate
#11138Circuit carrier and production thereof
#11139Method for making electronic packages
#11140Plating method, semiconductor device fabrication method and circuit board fabrication method
#11141Methods of making microelectronic packages with conductive elastomeric posts
#11142Method for fabricating packaged die
#11143Processing method during a package process
#11144Packaging method for an electronic element
#11145Connection structure for connecting semiconductor element and wiring board, and semiconductor device
#11146Semiconductor device having aluminum electrode and metallic electrode
#11147Structure of polymer-matrix conductive film and method for fabricating the same
#11148Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
#11149Multichip leadframe package
#11150Method and process of contact to a heat softened solder ball array
#11151Plating apparatus and plating method
#11152Method of manufacturing electric device
#11153Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
#11154Semiconductor device and manufacturing method for the same
#11155Method for manufacturing wafer level chip scale package using redistribution substrate
#11156Method for temporarily engaging electronic component for test
#11157Semiconductor package using flip-chip mounting technique
#11158Non-Circular via holes for bumping pads and related structures
#11159Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#11160Resist sidewall spacer for C4 BLM undercut control
#111613D interconnect with protruding contacts
#11162Power transistor including a leadframe and a semiconductor chip arranged on the leadframe
#11163Die attach paddle for mounting integrated circuit die
#11164Joining method and apparatus
#11165Contour structures to highlight inspection regions
#11166Method of forming bump that may reduce possibility of losing contact pad material
#11167Redistribution layer of wafer and the fabricating method thereof
#11168Electronic parts packaging structure and method of manufacturing the same
#11169Semiconductor electrical connection structure and method of fabricating the same
#11170Method for manufacturing semiconductor device and semiconductor device
#11171Fabrication of stacked die and structures formed thereby
#11172Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
#11173Method for producing microsystems
#11174Inverter and vehicle drive unit using the same
#11175Semiconductor device and fabrication method thereof
#11176Semiconductor device and manufacturing method thereof
#11177Copper interposer for reducing warping of integrated circuit packages and method of making IC packages
#11178Semiconductor device and method of manufacturing semiconductor device
#11179Methods to deposit metal alloy barrier layers
#11180Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices
#11181Method of forming a stacked semiconductor package
#11182Film substrate of a semiconductor package and a manufacturing method
#11183Integrated circuit with at least one bump
#11184Chip interconnect and packaging deposition methods and structures
#11185Underfill compositions and methods for use thereof
#11186Semiconductor substrate thinning method for manufacturing thinned die
#11187Method of forming electrode for semiconductor device
#11188Semiconductor device manufacturing method
#11189Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method
#11190Method for fabricating carrier structure integrated with semiconductor element
#11191Nano-sized metals and alloys, and methods of assembling packages containing same
#11192Low melting-point solders, articles made thereby, and processes of making same
#11193Thermally conductive composite and uses for microelectronic packaging
#11194Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
#11195Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits
#11196Semiconductor device
#11197Semiconductor element including a wet prevention film
#11198Reliable printed wiring board assembly employing packages with solder joints
#11199Die down ball grid array package
#11200Reinforced bond pad for a semiconductor device
#11201Apparatus for singulating and bonding semiconductor chips, and method for the same
#11202Chip package
#11203Top layers of metal for integrated circuits
#11204Circuit-connecting material and circuit terminal connected structure and connecting method
#11205Wafer scale integration packaging and method of making and using the same
#11206PROCESS OF FABRICATING FLIP-CHIP PACKAGES
#11207Structural design for flip-chip assembly
#11208Stacked die module and techniques for forming a stacked die module
#11209Solder foil, semiconductor device and electronic device
#11210Semiconductor device packaged into chip size and manufacturing method thereof
#11211Radiant energy heating for die attach
#11212Interconnection structure of integrated circuit chip
#11213Electronic circuit including circuit-connecting material
#11214Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#11215Semiconductor device having a switch circuit
#11216Chip structure
#11217Semiconductor device
#11218Assembly for stacked BGA packages
#11219Materials, structures and methods for microelectronic packaging
#11220Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
#11221Semiconductor device and semiconductor device unit
#11222Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
#11223Semiconductor device and fabrication process thereof
#11224Wafer level packages and methods of fabrication
#11225Wire bond pads
#11226Method for producing bumps on an electrical component
#11227Wafer stacking package method
#11228Method of forming a wafer backside interconnecting wire
#11229Method for producing a stack of chips, a stack of chips and method for producing a chip for a multi-chip stack
#11230Method for forming a redistribution layer in a wafer structure
#11231Semiconductor module
#11232Sensor device having stopper for limitting displacement
#11233Semiconductor device and a method of assembling a semiconductor device
#11234Semiconductor equipment having a pair of heat radiation plates
#11235Method of making a solder ball
#11236Semiconductor packages
#11237Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
#11238Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#11239Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
#11240Bump structure
#11241Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#11242Methods of forming semiconductor packages
#11243Packaging with metal studs formed on solder pads
#11244Robust power semiconductor package
#11245Semiconductor packages
#11246Integrated circuit package with open substrate
#11247Method for supplying solder
#11248Method of measuring thickness of bonded ball in wire bonding
#11249Top layers of metal for high performance IC's
#11250Bump structure of semiconductor package and method for fabricating the same
#11251Module assembly and method for stacked BGA packages
#11252Semiconductor device manufacturing method and electronic equipment using same
#11253Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
#11254Method of manufacturing a semiconductor device
#11255Electronic assemblies having a low processing temperature
#11256Technique for attaching die to leads
#11257Method for manufacturing electronic component-mounted board
#11258Method for bonding flip chip on leadframe
#11259Methods for packaging image sensitive electronic devices
#11260Methods for packaging image sensitive electronic devices
#11261Methods for packaging image sensitive electronic devices
#11262Method of embedding semiconductor chip in support plate and embedded structure thereof
#11263Flip chip metal bonding to plastic leadframe
#11264Electronic device and method of manufacturing the same
#11265Post passivation interconnection structures
#11266Post passivation interconnection process and structures
#11267Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby
#11268Semiconductor device having tin-based solder layer and method for manufacturing the same
#11269Semiconductor device mounting structure for reducing thermal stress and warpage
#11270Semiconductor device and method for manufacturing semiconductor device
#11271Semiconductor device and method for manufacturing the same
#11272Flat chip semiconductor device and manufacturing method thereof
#11273Semiconductor device with reduced contact resistance
#11274Semiconductor device, lead frame, and methods for manufacturing the same
#11275High density interconnect power and ground strap and method therefor
#11276Module assembly for stacked BGA packages
#11277Method of manufacturing a semiconductor device
#11278Methods of making microelectronic assemblies including compliant interfaces
#11279Semiconductor device
#11280Lead frame and semiconductor device having the lead frame
#11281Semiconductor device and method for fabricating the same
#11282Post passivation interconnection process and structures
#11283Method for connecting a chip and a substrate
#11284Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#11285Manufacturing method of stack-type semiconductor device
#11286Method for reducing lead precipitation during wafer processing
#11287Methods for packaging image sensitive electronic devices
#11288Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#11289Semiconductor chip packages and methods for fabricating the same
#11290Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
#11291Low stress conductive polymer bump
#11292Semiconductor device having laminated structure
#11293Semiconductor device
#11294High-reliable semiconductor device using hermetic sealing of electrodes
#11295Low temperature PB-free processing for semiconductor devices
#11296Top layers of metal for high performance IC's
#11297Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages
#11298Semiconductor device having a heat-dissipation member
#11299Semiconductor and method for producing a semiconductor
#11300Apparatus for improved power distribution in wirebond semiconductor packages
#11301Semiconductor device and process for manufacturing the same
#11302SMT three phase inverter package and lead frame
#11303Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same
#11304Electronic component with multilayered rewiring plate and method for producing the same
#11305Semiconductor device with simplified constitution
#11306Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#11307Dense intermetallic compound layer
#11308Compressible films surrounding solder connectors
#11309Method of electrically connecting a microelectronic component
#11310Manufacturing method of an electronic part built-in substrate
#11311Semiconductor device substrate, semiconductor device, and manufacturing method thereof
#11312Methods for forming molds
#11313Conductive adhesive agent with ultrafine particles
#11314Thermal fatigue resistant tin-lead-silver solder
#11315Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#11316Electrode structure of a semiconductor device and method of manufacturing the same
#11317Submember mounted on a chip of electrical device for electrical connection
#11318Semiconductor device and resin structure therefor
#11319Fluxless solder transfer and reflow process
#11320Thermal protection for electronic components during processing
#11321Semiconductor attachment method
#11322Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components
#11323Probe for semiconductor devices
#11324Stacked packages
#11325Semiconductor device and manufacturing method of the same
#11326Wafer level package, multi-package stack, and method of manufacturing the same
#11327Power gridding scheme
#11328Fine pitch low-cost flip chip substrate
#11329Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication
#11330Systems and methods for wafer bonding by localized induction heating
#11331Semiconductor device with sidewall wiring
#11332Power gridding scheme
#11333Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#11334Electronic component packaging
#11335Metal-metal bonding of compliant interconnect
#11336Apparatus and method for printing micro metal structures
#11337System and method for low temperature plasma-enhanced bonding
#11338Serial thermal processor arrangement
#11339Programmable radio transceiver
#11340Selectively coating bond pads
#11341Methods of forming lead free solder bumps
#11342Method for fabricating semiconductor package with circuit side polymer layer
#11343Semiconductor device
#11344Manufacturing method of semiconductor device
#11345Method for processing a base that includes connecting a first base to a second base with an insulating film
#11346Method of creating electrostatic discharge protection in a microelectronic module
#11347Method for processing base
#11348Semiconductor device with semiconductor components connected to one another
#11349Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#11350Design of BEOL patterns to reduce the stresses on structures below chip bondpads
#11351Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
#11352Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
#11353Structure with spherical contact pins
#11354Method and apparatus for forming metal contacts on a substrate
#11355Method for forming metal contacts on a substrate
#11356Manufacture of RFID tags and intermediate products therefor
#11357No-flow underfill composition and method
#11358Interconnect assemblies and methods
#11359Manufacturing method of semiconductor device
#11360Method of manufacturing semiconductor device with two-step etching of layer
#11361Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
#11362Chip package structure
#11363Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#11364Semiconductor device with signal line having decreased characteristic impedance
#11365Semiconductor component having a CSP housing
#11366Hermetic chip in wafer form
#11367Semiconductor chip-embedded substrate and method of manufacturing same
#11368Semiconductor device and method of manufacturing same
#11369Interposer with flexible solder pad elements and methods of manufacturing the same
#11370Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#11371Semiconductor device and manufacturing method thereof
#11372Semiconductor package with flip chip on leadless leadframe
#11373Chip structure with redistribution traces
#11374Semiconductor package
#11375Semiconductor device and a manufacturing method of the same
#11376Image sensor packaging structure
#11377Apparatus and method for printing micro metal structures
#11378Electronic component embedded substrate and method for manufacturing the same
#11379Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
#11380Wafer-leveled chip packaging structure and method thereof
#11381GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF
#11382Method for fabricating pad redistribution layer
#11383Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#11384Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#11385Active plate-connector device with built-in semiconductor dies
#11386Microelectronic component assemblies with recessed wire bonds and methods of making same
#11387Collars, support structures, and forms for protruding conductive structures
#11388Semiconductor device
#11389Formation method and structure of conductive bumps
#11390Device having contact pad with a conductive layer and a conductive passivation layer
#11391Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#11392Structure and formation method of conductive bumps
#11393Semiconductor device and method of manufacturing a semiconductor device
#11394Method for mounting a chip on a base and arrangement produced by this method
#11395BGA package board and method for manufacturing the same
#11396Substrate-based BGA package, in particular FBGA package
#11397Semiconductor device and its manufacturing method
#11398Bonding configurations for lead-frame-based and substrate-based semiconductor packages
#11399Power semiconductor package
#11400Electronic part-containing elements, electronic devices and production methods