Semiconductor device and method of forming stress relief layer between die and interconnect structure

Molding method for COB-EUSB devices and metal housing package

Formation of alpha particle shields in chip packaging

Method for manufacturing an electronic module and an electronic module

Laser ashing of polyimide for semiconductor manufacturing

Method for handling very thin device wafers

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Semiconductor packages including a multi-layered dielectric layer and methods of manufacturing the same

Fabricating pillar solder bump

Semiconductor device and semiconductor device mounting structure

Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

POWER/GROUND LAYOUT FOR CHIPS

Lead free solder bumps

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Semiconductor packaging and manufacturing method thereof

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Passivation process to prevent TiW corrosion

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Method of producing a transponder and a transponder

Wafer level semiconductor package and manufacturing methods thereof

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Electrochemical deposition method

Method of fabricating packaging substrate having embedded through-via interposer

Fabrication methods of chip device packages

Semiconductor die contact structure and method

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor package substrate, package system using the same and method for manufacturing thereof

Post passivation interconnect structures and methods for forming the same

Semiconductor device and method of manufacturing semiconductor device

Chip-on-wafer structures and methods for forming the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor packaging and manufacturing method thereof

Method of forming conductive bumps for cooling device connection

Method for singulating packaged integrated circuits and resulting structures

Chip device packages and fabrication methods thereof

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Thermocompression for semiconductor chip assembly

Semiconductor devices and methods of forming thereof

Semiconductor device and method for manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

Mounting structure and method for manufacturing same

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Semiconductor structure and manufacturing method thereof

Processes and structures for IC fabrication

Wafer Level Chip Scale Package Device with One or More Pre-solder Layers and Manufacturing Method Thereof

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Copper bump structures having sidewall protection layers

Method of forming an integrated crackstop

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Treating copper surfaces for packaging

Stacked packaging improvements

Semiconductor device for battery power voltage control

Semiconductor device and method of manufacturing

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Solder bump joining structure with low resistance joining member

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Multi-chip package and method of formation

Multi-chip package structure and method of forming same

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

High efficiency module

Vertical LED chip package on TSV carrier

Packaging DRAM and SOC in an IC package

Semiconductor module and method for manufacturing the same

Power semiconductor device

Reducing formation of oxide on solder

Printed wiring board and method for manufacturing the same

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Methods and apparatus for package on package devices

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Multichip power semiconductor device

Image sensor integrated circuit package with reduced thickness

ESD protection device

Integrated circuit package including in-situ formed cavity

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor packages and methods of packaging semiconductor devices

Substrateless power device packages

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Multilayer pillar for reduced stress interconnect and method of making same

Semiconductor package with embedded die and its methods of fabrication

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

SEMICONDUCTOR DEVICE

Methods to fabricate a radio frequency integrated circuit

Method for manufacturing a fan-out WLP with package

Electronic module

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device sealed in a resin section and method for manufacturing the same

Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Pad configurations for an electronic package assembly

Semiconductor package structure for improving die warpage and manufacturing method thereof

Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer

Wafer scale package for high power devices

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Bump pad structure

Copper post solder bumps on substrates

Molding composition for semiconductor package and semiconductor package using the same

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor devices with ball strength improvement

Substrate and assembly thereof with dielectric removal for increased post height

Technique for wafer-level processing of QFN packages

Semiconductor device and method for manufacturing the same

Semiconductor module

Semiconductor device, electronic device, and semiconductor device manufacturing method

Multi-function and shielded 3D interconnects

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device and method of forming thermal lid for balancing warpage and thermal management

Coreless package structure and method for manufacturing same

III-Nitride device with solderable front metal

Thin wafer handling and known good die test method

CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE CONDUCTIVE PASTE

Bridge interconnect with air gap in package assembly

Apparatus and methods for through substrate via test

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Package on-package process for applying molding compound

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Methods of fluxless micro-piercing of solder balls, and resulting devices

Bonded body and semiconductor module

High-frequency package

Semiconductor packages and electronic systems including the same

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

Semiconductor device and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Electronic devices with yielding substrates

Apparatus for thermal melting process and method of thermal melting process

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Method of forming an integrated inductor by dry etching and metal filling

Semiconductor device having an inductor

Copper post solder bumps on substrates

Dual lead frame semiconductor package and method of manufacture

Room temperature metal direct bonding

Warp compensated electronic assemblies

Packaging methods and packaged semiconductor devices

Method of making a pillar structure having a non-metal sidewall protection structure

Pillar bumps and process for making same

STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

Semiconductor device with overlapped lead terminals

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor device including cooler

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Semiconductor package and method of manufacturing the same

Semiconductor die assemblies and semiconductor devices including same

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Methods and apparatus for bump-on-trace chip packaging

Semiconductor package with single sided substrate design and manufacturing methods thereof

Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier

Wireless communication system

TSV structures and methods for forming the same

Copper pillar bump with cobalt-containing sidewall protection layer

Compliant interconnects in wafers

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Solder bump for ball grid array

Interconnect structure for wafer level package

Semiconductor device and method of forming insulating layer around semiconductor die

Method of making a conductive pillar bump with non-metal sidewall protection structure

Bonding structure and method

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Chip package and manufacturing method thereof

Methods of forming 3-D circuits with integrated passive devices

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Semiconductor device

Resin-encapsulated semiconductor device and its manufacturing method

Dual lead frame semiconductor package and method of manufacture

Forming semiconductor chip connections

Semiconductor device including DC-DC converter

Semiconductor device

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Image pickup device and method for producing the same

Power semiconductor device with a double metal contact

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Wafer backside interconnect structure connected to TSVs

Stackable package by using internal stacking modules

Semiconductor device and method of forming high routing density interconnect sites on substrate

Multi-solder techniques and configurations for integrated circuit package assembly

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Power semiconductor package

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Wafer backside interconnect structure connected to TSVs

Lead and lead frame for power package

Materials, structures and methods for microelectronic packaging

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

Semiconductor packages and methods of fabricating the same

Resin-sealed semiconductor device and associated wiring and support structure

Chip and manufacturing method thereof

Arrangement for energy conditioning

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Impedance controlled packages with metal sheet or 2-layer rdl

Stacked semiconductor package

Solder joint flip chip interconnection

Chip package and method of manufacturing the same

Carrier tape for tab-package and manufacturing method thereof

Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

System and method of sensing current in a power semiconductor device

TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Multi-chip semiconductor power device

Semiconductor device, method for manufacturing the same, and electronic device

Pb-free solder bumps with improved mechanical properties

Method of manufacturing semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Three-dimensional semiconductor architecture

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Chip package structure and manufacturing method thereof

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Solder in cavity interconnection technology

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Bumpless build-up layer package with pre-stacked microelectronic devices

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Window ball grid array (BGA) semiconductor packages

Semiconductor device

Semiconductor device including a plurality of magnetic shields

Wafer level chip scale package and process of manufacture

3D semiconductor device

Stacked type semiconductor device and printed circuit board

Apparatus for lead free solder interconnections for integrated circuits

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Front side copper post joint structure for temporary bond in TSV application

Isolation structure for stacked dies

Semiconductor module system having encapsulated through wire interconnect (TWI)

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Structure and method of forming a pad structure having enhanced reliability

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device, semiconductor package, and electronic device

Semiconductor device and method of manufacturing semiconductor device

Method for forming a thin semiconductor device

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Semiconductor device and method of forming conductive vias with trench in saw street

Wafer leveled chip packaging structure and method thereof

Flow underfill for microelectronic packages

Semiconductor device

Pre-soldered leadless package

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Method of forming wafer-level molded structure for package assembly

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device including cooler

Method for producing semiconductor device

Half-bridge package with a conductive clip

Chip package and method for forming the same

Chip package and method for forming the same

Extended redistribution layers bumped wafer

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Sensor package

Fixture to constrain laminate and method of assembly

Sonotrode with cutting mechanism

Method of manufacturing semiconductor device

External storage device and method of manufacturing external storage device

3D IC method and device

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device including passivation layer encapsulant

Three-dimensional structure in which wiring is provided on its surface

Semiconductor device with through silicon via and alignment mark

Three-dimensional structure for wiring formation

Polymer matrices for polymer solder hybrid materials

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Semiconductor device and method of manufacturing the same

Dicing tape-integrated film for semiconductor back surface

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Substrate contact opening

Package systems and manufacturing methods thereof

Microelectronic package with terminals on dielectric mass

Routing layer for mitigating stress in a semiconductor die

Semiconductor device

Semiconductor die package and method for making the same

OLED device in contact with a conductor

Methods for attachment and devices produced using the methods

Stress-resilient chip structure and dicing process

Semiconductor package and process for fabricating same

Semiconductor device

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

Semiconductor packages and electronic systems including the same

Configurable interposer