Semiconductor device and method of manufacturing the same

Semiconductor device

Bonding wire and an integrated circuit device using the same

Semiconductor device having capacitors for reducing power source noise

Semiconductor device and manufacturing method thereof

Low profile package having multiple die

Semiconductor device and manufacturing method for the same

Electronic device having wiring substrate and lead frame

Semiconductor device, optoelectronic board, and production methods therefor

Bumping electronic components using transfer substrates

Method for producing an electronic device connected to a printed circuit board

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

Lithographic contact elements

Semiconductor device and manufacturing method thereof

Encapsulated semiconductor components and methods of fabrication

Method of manufacturing an electronic device, and electronic device

Capacitor device and method of manufacturing the same

Method of manufacturing semiconductor device

Wafer stacking with anisotropic conductive adhesive

Semiconductor device and semiconductor module

Low profile stacking system and method

Solder ball pad structure

Semiconductor element having protruded bump electrodes

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Method of fabricating a pad over active circuit I.C. with frame support structure

Semiconductor device

Surface mount package

I/O architecture for integrated circuit package

Strobe light control circuit and IGBT device

Apparatus and methods for an underfilled integrated circuit package

Method of forming bump pad of flip chip and structure thereof

Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed

Induction-based heating for chip attach

Semiconductor device with intermediate connector

Electrical connection of components

Forming a chip package having a no-flow underfill

Method and device for manufacturing bonding pads for chip scale packaging

Fabrication methods for electronic system modules

Semiconductor device, manufacturing method thereof and electronic equipment

Method of manufacturing a semiconductor device

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device and method of fabricating the same

Method and apparatus for applying body bias to integrated circuit die

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor chip package and multichip package

High-frequency device

Dicing die-bonding film

Leadless semiconductor package

Semiconductor package with increased number of input and output pins

Nanotube modified solder thermal intermediate structure, systems, and methods

Wire bonder for ball bonding insulated wire and method of using same

Methods of providing solder structures for out plane connections

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Plastic lead frames utilizing reel-to-reel processing

Stacked semiconductor device assembly and method for forming

Chip packaging compositions, packages and systems made therewith, and methods of making same

Various structure/height bumps for wafer level-chip scale package

Wire loop grid array package

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Wire bonding package

Metal article intended for at least partially coating with a substance and a method for producing the same

Method of assembling a ball grid array package with patterned stiffener layer

Dual semiconductor die package with reverse lead form

Microelectronic assemblies with composite conductive elements

Semiconductor package with a flip chip on a solder-resist leadframe

Manufacturing method of a semiconductor device

Method and apparatus for improved power routing

Lead frame structure with aperture or groove for flip chip in a leaded molded package

System and method for increasing the ball pitch of an electronic circuit package

Opto-electronic assembly having an encapsulant with at least two different functional zones

Methods of forming solder areas on electronic components and electronic components having solder areas

Flip-chip solder bump formation using a wirebonder apparatus

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Electronic parts built-in substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Power module with heat exchange

Inverted J-lead for power devices

Structure and method for reinforcing a bond pad on a chip

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and the method of producing the same

Solder bump structure for flip chip package and method for manufacturing the same

Power semiconductor module and method for producing it

Ball grid array package substrates with a modified central opening and method for making the same

Copper-based chip attach for chip-scale semiconductor packages

Multi-die processor

Microelectronic device signal transmission by way of a lid

Semiconductor package with improved solder joint reliability

Chip-scale package and carrier for use therewith

Method for manufacturing thin GaAs die with copper-back metal structures

[METHOD OF FORMING BOND MICROSTRUCTURE]

Nano-metal composite made by deposition from colloidal suspensions

Combination back grind tape and underfill for flip chips

Method of incorporating interconnect systems into an integrated circuit process flow

Semiconductor packaging

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Module board having embedded chips and components and method of forming the same

Semiconductor device and a method of manufacturing the same

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Component

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Semiconductor device package utilizing proud interconnect material

Semiconductor device manufacturing method and manufacturing apparatus

Thinned die integrated circuit package

Semiconductor device

Multi-chips bumpless assembly package and manufacturing method thereof

Semiconductor device and method for fabricating the same

Method for making dual gauge leadframe

Chip and wafer integration process using vertical connections

Capillary with contained inner chamfer

Method of manufacturing circuits

Electroplating method for a semiconductor device

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Methods of reducing bleed-out of underfill and adhesive materials

Electronic device and method of manufacturing same

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Packages for image sensitive electronic devices

Support structure for low-k dielectrics

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Method of making multichip wafer level packages and computing systems incorporating same

Method of interconnecting die and substrate

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Formation of circuitry with modification of feature height

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Vertical integrated circuits

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Electronics circuit manufacture

Wiring base with wiring extending inside and outside of a mounting region

Light source apparatus with light-emitting chip which generates light and heat

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Wafer level packages for chips with sawn edge protection

Customized microelectronic device and method for making customized electrical interconnections

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Opto-electronic element with a metallized carrier

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Wire bonding process for copper-metallized integrated circuits

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Techniques for packaging multiple device components

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Wafer level chip scale packaging structure and method of fabricating the same

Bond pad for flip chip package

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

Use of palladium in IC manufacturing with conductive polymer bump

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Corrosion-resistant bond pad and integrated device

Circuit device and manufacturing method thereof

Semiconductor package

Semiconductor chip package and method

Wafer level stack structure for system-in-package and method thereof

Electronic device with reduced entrapment of material between die and substrate electrical connections

Methods and apparatus for packaging integrated circuit devices

Integrated circuit carrier apparatus method and system

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Test system with interconnect having conductive members and contacts on opposing sides

Hyperbga buildup laminate

Mounting method for a semiconductor component

Inductor formed in an integrated circuit

Bonding structure with compliant bumps

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor package board using a metal base

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Design of an insulated cavity

Apparatus and method for mounting electronic components

Ball mounting method

Apparatus and method for low pressure wirebond

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Method and system for integrated circuit bonding

Method, apparatus, and computer program of searching for clustering faults in semiconductor device manufacturing

Semiconductor device and manufacturing method thereof

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Wafer level transparent packaging

System to couple integrated circuit die to substrate

Wire loop height measurement apparatus and method

Stacked semiconductor device including improved lead frame arrangement

Fabrication method of semiconductor integrated circuit device

Semiconductor device

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Integrated interconnect package

Multi-surface contact IC packaging structures and assemblies

Semiconductor circuit with multiple contact sizes

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device having metal plates and semiconductor chip

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Power semiconductor device and power semiconductor module

Modular power semiconductor module

Semiconductor device

Plastic package and method of fabricating the same

Method of mounting a circuit component and joint structure therefor

Chip package with die and substrate

Semiconductor package capable of absorbing electromagnetic wave

Technique for attaching die to leads

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Chip package with die and substrate

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Circuit device

No-flow underfill composition and method

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Electronic device

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Circuit device

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Electronic substrate, power module and motor driver

Chip scale package and method of fabricating the same

Vertical removal of excess solder from a circuit substrate

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Method for forming metal contacts on a substrate

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device manufacturing method

Semiconductor test board having laser patterned conductors

RF amplifier

Method for producing semiconductor device and semiconductor device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Electronic circuit device and porduction method therefor

Semiconductor device

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Large bumps for optical flip chips

Large bumps for optical flip chips

Method of fabricating multi layer devices on buried oxide layer substrates

Gold bonding wires for semiconductor devices and method of producing the wires

Method for producing a multichip module and multichip module

Methods of plating via interconnects

Die pillar structures and a method of their formation

Semiconductor radiation emitter package

Semiconductor device having heat radiation plate and bonding member

Ball grid array package with patterned stiffener surface and method of assembling the same

Anisotropic conductive film

Printed circuit board unit with detachment mechanism for electronic component

Method of fabricating a wire bond pad with Ni/Au metallization

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Integrated circuit with dual electrical attachment PAD configuration

Integrated circuit package bond pad having plurality of conductive members

Semiconductor electronic device and method of manufacturing thereof

Semiconductor device and method of fabricating the same

Multichip wafer level packages and computing systems incorporating same

Semiconductor device protection cover, and semiconductor device unit including the cover

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Wafer-level moat structures

Method of mounting wafer on printed wiring substrate

Method for fabricating wafer-level chip scale packages

Devices and methods employing high thermal conductivity heat dissipation substrates

Modified chip attach process and apparatus

Method of producing an electronic component and a panel with a plurality of electronic components

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Electronic parts built-in substrate and method of manufacturing the same

Reinforced bond pad

Semiconductor device and method of manufacturing the same

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Fluxes for flip chip assembly using water soluble polymers

Method of manufacturing a module

Circuit carrier and production thereof

Manufacturing method of electronic components embedded substrate

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies