System having semiconductor component with encapsulated, bonded, interconnect contacts

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Integrated circuit die/package interconnect

Bridge connection type of chip package and fabricating method thereof

Designs and methods for conductive bumps

Bonded structure using conductive adhesives, and a manufacturing method thereof

Package assembly for electronic device

Substrate with terminal pads having respective single solder bumps formed thereon

Integrating chip scale packaging metallization into integrated circuit die structures

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor package

Semiconductor device having heat dissipation layer

Semiconductor device

Electronic package having a folded flexible substrate and method of manufacturing the same

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Method for the lateral contacting of a semiconductor chip

Semiconductor apparatus and method for fabricating the same

Image sensor packages

Moisture-resistant electronic device package and methods of assembly

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device capable of detecting an open bonding wire using weak current

Electrical circuit assembly with improved shock resistance

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor apparatus with decoupling capacitor

Circuit device and manufacturing method of circuit device

Semiconductor package with through-hole

Semiconductor device and method of manufacturing thereof

Method and device to elongate a solder joint

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Thermal interface adhesive

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Solder bump structure and method for forming the same

In situ determination of resistivity, mobility and dopant concentration profiles

Integrated circuit package

I/O architecture for integrated circuit package

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same

Flip chip substrate design

Semiconductor device having transferred integrated circuit

Process of manufacturing a solder-fill for applying to semiconductor package

Method and system for stud bumping

Bond pad techniques for integrated circuits

Diffusion solder position, and process for producing it

Ball film for integrated circuit fabrication and testing

Method of making a circuitized substrate

Semiconductor device and manufacturing method thereof

Self-assembled nanometer conductive bumps and method for fabricating

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit

Memory cell and semiconductor memory device

Electronic part mounting substrate and method for producing same

Multi-dice chip scale semiconductor components

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Flip-chip interconnect with increased current-carrying capability

Adhesive sheet for producing a semiconductor device

Leadframe-based mold array package heat spreader and fabrication method therefor

Chip stack package and manufacturing method thereof

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Thermal conductive material utilizing electrically conductive nanoparticles

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Process for forming lead-free bump on electronic component

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Fluxless assembly of chip size semiconductor packages

Electronic parts packaging structure and method of manufacturing the same

Process for making contact with and housing integrated circuits

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Flip chip die bond pads, die bond pad placement and routing optimization

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Package module for an IC device and method of forming the same

Heat dissipation apparatus for package device

Semiconductor package with improved chip attachment and manufacturing method thereof

Circuit device

Semiconductor component having dummy segments with trapped corner air

Semiconductor device including a semiconductor chip mounted on a metal base

Interconnections

Aqueous based metal etchant

Method of metal sputtering for integrated circuit metal routing

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Flip chip on lead frame

Process for producing a semiconductor device

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing semiconductor devices

Semiconductor packaging structure and method for forming the same

Electronic component and method for manufacturing the same

CSP semiconductor device having signal and radiation bump groups

Wire bonding method for copper interconnects in semiconductor devices

Bump transfer fixture

Die-up ball grid array package including a substrate having an opening and method for making the same

Semiconductor chip with bumps and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Chip package structure

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Probe card assembly

Package substrate and process thereof

Encapsulated component which is small in terms of height and method for producing the same

Semiconductor sensor and method of plating semiconductor devices

Single tool defect classification solution

Asymmetric plating

Method for reducing defects in post passivation interconnect process

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Structure and method for fine pitch flip chip substrate

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Method for creating adhesion during fabrication of electronic devices

Under bump metallurgic layer

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Apparatus and method for packaging circuits

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor device structural body and electronic device

Circuit board and semiconductor device using the same

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Stacked mass storage flash memory package

Multi-chip package and manufacturing method thereof

Leadframe and semiconductor package made using the leadframe

Topless semiconductor package

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Protection circuit device using MOSFETs and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Contact structures and methods for making same

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Inhibition of tin oxide formation in lead free interconnect formation

Semiconductor processing methods

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Conductive block mounting process for electrical connection

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Manufacturing method of semiconductor device

Packaged microelectronic components

Method of manufacturing semiconductor device

Power supply device

Low-inductance circuit arrangement for power semiconductor modules

Voltage protection device

Semiconductor device and semiconductor device manufacturing method

Pad over active circuit system and method with meshed support structure

Nickel bonding cap over copper metalized bondpads

Semiconductor device with strain relieving bump design

CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME

Method for assembling a ball grid array package with multiple interposers

Solder pads and method of making a solder pad

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Multi-chips module package and manufacturing method thereof

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Electronic device package

Standoffs for centralizing internals in packaging process

Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Method of making a semiconductor device having an opening in a solder mask

Nickel bonding cap over copper metalized bondpads

Stable electroless fine pitch interconnect plating

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming bump protective collars on a bumped wafer

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Method and apparatus for attaching microelectronic substrates and support members

Multiple substrate microelectronic devices and methods of manufacture

Methods and devices for providing bias to a monolithic microwave integrated circuit

Module part

IC chip with improved pillar bumps

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps

Wirebond pad for semiconductor chip or wafer

Semiconductor device with connections for bump electrodes

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Interconnecting component

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Ball grid array structures having tape-based circuitry

Semiconductor device and switching element

Method for forming a chip package

Module for high voltage power for converting a base of IGBT components

Flip-chip bonding of light emitting devices

Light-emitting semiconductor component

[PROCESS FOR FABRICATING BUMPS]

Method, system, and apparatus for transfer of dies using a pin plate

Substrate holder and plating apparatus

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Method of making a semiconductor device having an opening in a solder mask

Stencil mask design method and under bump metallurgy for C4 solder bump

Electronic component-built-in module

Chip package structure

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor device including a diffusion layer

Reconnectable chip interface and chip package

Under-bump metallugical structure

Semiconductor device having chip size package with improved strength

Method of surface-mounting semiconductor chip on PCB

Enhanced die-down ball grid array and method for making the same

Reconnectable chip interface and chip package

Modular power semiconductor module

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device having a flip-chip construction

Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET

Semiconductor device wiring structure

Low temperature bonding of multilayer substrates

Method of fabricating an electronic device

Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Wafer level bumping process

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Manufacturing method for semiconductor device

Method for manufacturing semiconductor device

Aluminum cap with electroless nickel/immersion gold

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Laminated sheet

Interlayer dielectric and pre-applied die attach adhesive materials

Controller and rectifier for an electrical machine, and electrical machine

Method, system, and apparatus for authenticating devices during assembly

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

Packaging assembly and method of assembling the same

Manufacturing method for multichip module

Semiconductor device and manufacturing method thereof

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Bump electrodes having multiple under ball metallurgy (UBM) layers

Method for packaging electronic modules and multiple chip packaging

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Integrated semiconductor power device for multiple battery systems

Semiconductor device and method for manufacturing the same

Multiple chip semiconductor package

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Bonding pad for a packaged integrated circuit

Method, system, and apparatus for high volume transfer of dies

Method and apparatus for low temperature copper to copper bonding

Method and apparatus for low temperature copper to copper bonding

Process of forming bonding columns

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device

Micro lead frame package

Semiconductor package production method and semiconductor package

System and method for controlling integrated circuit die height and planarity

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Corrosion-resistant copper bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Semiconductor device

Semiconductor device with under bump metallurgy and method for fabricating the same

Chip scale package and method of fabricating the same

Substrate for semiconductor package and wire bonding method using thereof

Ultra wideband BGA

Leadless leadframe package substitute and stack package

Method of mounting electronic part and flux-fill

Moly mask construction and process

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Transfer assembly for manufacturing electronic devices

Plasma processing apparatus including a plurality of plasma processing units having reduced variation

Micro-bonding structure

High voltage switch module

Via and trench filling using injection molded soldering

Tin-indium based low temperature solder alloy

Wafer-level die to package and die to die interconnects suspended over integrated heat sinks

Method for establishing interconnects in packages using thin interposers

Semiconductor package structure having hollow chamber and bottom substrate and package process thereof

Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole

Pre-formed via array for integrated circuit package

Method of forming surface protrusions on an article and the article with the protrusions attached

Semiconductor device with leadframe configured to facilitate reduced burr formation

Flip chip cavity package

Molded leadframe substrate semiconductor package