Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Methods and apparatus for package on package devices

Semiconductor package with embedded die

Stacked semiconductor packages

Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits

Semiconductor package and methods of formation thereof

Printed wiring board and method for manufacturing printed wiring board

Interlocking type solder connections for alignment and bonding of wafers and/or substrates

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Circuit device

Circuit device

Circuit device

Circuit device and method for manufacturing same

Stud bump structure for semiconductor package assemblies

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

Method for chip packaging

Methods for forming semiconductor device packages

Metal-insulator-metal capacitors on glass substrates

HIGH DENSITY 3D PACKAGE

Flip chip mounted monolithic microwave integrated circuit (MMIC) structure

Semiconductor device

Bump-on-trace interconnect

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Semiconductor device including a polymer disposed on a carrier

Wafer level MOSFET metallization

Method to realize flux free indium bumping

Integrated thermal solutions for packaging integrated circuits

Off-chip vias in stacked chips

Leadless array plastic package with various IC packaging configurations

Apparatus for thinning, testing and singulating a semiconductor wafer

Apparatus and method for integration of through substrate vias

Semiconductor device packages and methods

Package on package structures and methods for forming the same

Strain reduced structure for IC packaging

Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same

Method for designing a package and substrate layout

Power module

Methods and apparatus for heat spreader on silicon

3D packaging with low-force thermocompression bonding of oxidizable materials

Thermal compression bonding of semiconductor chips

Etching solution for copper or copper alloy

Indium compositions

Semiconductor packages and methods of fabricating the same

Dispensing Tool

RFID tags and processes for producing RFID tags

Electronic Module

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

Semiconductor device with heat dissipation

Methods and apparatus of wafer level package for heterogeneous integration technology

Bottom-up plating of through-substrate vias

Semiconductor device and method of forming the same

Stress reduction means for warp control of substrates through clamping

Power line filter for multidimensional integrated circuits

Wireless communication system

Package on package structures and methods for forming the same

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS

Monolithic Power Converter Package with Through Substrate vias

GRID FAN-OUT WAFER LEVEL PACKAGE AND METHODS OF MANUFACTURING A GRID FAN-OUT WAFER LEVEL PACKAGE

ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHODS OF MANUFACTURING ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES

Semiconductor device

Packaging device and method of making the same

Chip package and manufacturing method thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Multichip power semiconductor device

Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package

Process of making a stacked semiconductor package having a clip

Semiconductor device packaging structure and packaging method

Nitride group semiconductor light emitting device

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Plating bath and method

Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate

Method of manufacturing a semiconductor device

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Probing chips during package formation

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

Microelectronic package

Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief

Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die

Power semiconductor device module

THROUGH SILICON VIA FILLING

GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH

Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Conductive bump structure on substrate and fabrication method thereof

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces

Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration

Method of manufacturing a semiconductor component

Molded leadframe substrate semiconductor package

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP

Semiconductor package and methods of formation thereof

Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package

Through-silicon via with a non-continuous dielectric layer

Methods and apparatus of guard rings for wafer-level-packaging

Power semiconductor module and power unit device

Packaged integrated device die between an external and internal housing

SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME

Semiconductor chip package having via hole and semiconductor module thereof

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Contact test structure and method

Wiring board and semiconductor device

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

Semiconductor device bonding with stress relief connection pads

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor constructions

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

Semiconductor component that includes a protective structure

Semiconductor device including a stress buffer material formed above a low-k metallization system

Surface metal wiring structure for an IC substrate

Room temperature metal direct bonding

Three-dimensional system-in-package architecture

Protection layer for adhesive material at wafer edge

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Electrical connections for chip scale packaging

Power semiconductor module with method for manufacturing a sintered power semiconductor module

Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

Method for package-on-package assembly with wire bonds to encapsulation surface

Method for chip package

Magnetic attachment structure

Production method of high-density SIM card package

Mechanisms for controlling bump height variation

Enhanced flip chip structure using copper column interconnect

Semiconductor package with integrated selectively conductive film interposer

Mechanisms for forming connectors with a molding compound for package on package

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

System-in-package with integrated socket

Light-emitting device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Embedded electrical component surface interconnect

Fine-pitch package-on-package structures and methods for forming the same

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

Package-in-package using through-hole via die on saw streets

Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

Fabricating method of circuit board and circuit board

Manufcaturing method for room-temperature substrate bonding

Method of transferring and bonding an array of micro devices

Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)

Maintaining alignment in a multi-chip module using a compressible structure

Semiconductor device and method for manufacturing the same

Post-passivation interconnect structure AMD method of forming same

Semiconductor device package having backside contact and method for manufacturing

Chip attach frame

Multilayer printed wiring board

Semiconductor device using diffusion soldering

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

Package with interposer frame and method of making the same

Reducing stress in multi-die integrated circuit structures

SEMICONDUCTOR PACKAGE

Package manufacturing method and semiconductor device

Method for building vertical pillar interconnect

Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)

System and method for an electronic package with a fail-open mechanism

Apparatuses and methods for providing capacitance in a multi-chip module

Semiconductor package with improved testability

Packaged microdevices and methods for manufacturing packaged microdevices

Methods of stress balancing in gallium arsenide wafer processing

Integrated Circuit Die And Method Of Fabricating

Processes and structures for IC fabrication

Semiconductor device

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Carrier, semiconductor package and fabrication method thereof

Crack-arresting structure for through-silicon vias

Crack stopper on under-bump metallization layer

Multi-chip fan out package and methods of forming the same

Package assembly and method of forming the same

Semiconductor packaging structure and method

Biosensor capacitor

Molding method for COB-EUSB devices and metal housing package

Bump pad structure

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP BONDING

Package on package interconnect structure

Leadframe and semiconductor package made using the leadframe

Package leadframe for dual side assembly

Power semiconductor module and method of manufacturing the same

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

Electronic component mounting apparatus and the same method thereof

Stackable microelectronic package structures

Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias

Power semiconductor device with reduced contact resistance

UBM formation for integrated circuits

Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance

Manufacturing method and electronic module with new routing possibilities

Apparatus and method for placing solder balls

Method of fabricating a packaged semiconductor

Stackable semiconductor package and manufacturing method thereof

Package method for electronic components by thin substrate

Circuit module with multiple submodules

Electronic-component mounted body, electronic component, and circuit board

Method of manufacturing an electronic module

Die up fully molded fan-out wafer level packaging

Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier

Semiconductor package with a bridge interposer

Fully molded fan-out

ESD protection device

PHOTODIODE ARRAYS AND METHODS OF FABRICATION

Integrated compact MEMS device with deep trench contacts

Precious metal paste for bonding semiconductor element

Method of manufacturing printed wiring board

Production apparatus of composite silver nanoparticle

COMPOSITE ALLOY BONDING WIRE

High efficiency module

SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF SEGMENTS

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor package

Module including a discrete device mounted on a DCB substrate

Manufacturing method of semiconductor device, processing method of semiconductor wafer, semiconductor wafer

Electronics device package and fabrication method thereof

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor light-emitting device, method for producing same, and display device

Printed circuit board and method for manufacturing the same

MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE

Chip assembly with a coreless substrate employing a patterned adhesive layer

Semiconductor package including flip chip controller at bottom of die stack

Determining alignment using a spatially varying charge distribution

Microspring structures adapted for target device cooling

Method for packaging semiconductors at a wafer level

Semiconductor Device and Fabrication Method

Direct write interconnections and method of manufacturing thereof

Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP

Integrated circuit packaging system with coupling features and method of manufacture thereof

Stacked Packaging Using Reconstituted Wafers

Semiconductor module

SEMICONDUCTOR STACK PACKAGES AND METHODS OF FABRICATING THE SAME

Integrated circuit packaging system with pad and method of manufacture thereof

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Electrically bonded arrays of transfer printed active components

FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN

Micro-fabricated atomic magnetometer and method of forming the magnetometer

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed

Methods of fabricating fan-out wafer level packages and packages formed by the methods

Semiconductor package

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Substrate with embedded stacked through-silicon via die

Semiconductor device

Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer

Post-passivation interconnect structure

Semiconductor device with bump structure on an interconncet structure

Landing areas of bonding structures

Ultra-small chip package and method for manufacturing the same

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor package having internal shunt and solder stop dimples

Device including two power semiconductor chips and manufacturing thereof

Integrated Reflow and Cleaning Process and Apparatus for Performing the Same

Method for forming a reliable solderable contact

Method of processing solder bump by vacuum annealing

Packaging process tools and systems, and packaging methods for semiconductor devices

Interposer wafer bonding method and apparatus

Semiconductor device including a protective film

Solderable contact and passivation for semiconductor dies

Flip chip package utilizing trace bump trace interconnection

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

TSV structures and methods for forming the same

Bump-on-trace structures in packaging

Electronic device with multi-layer contact

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Monolithic semiconductor switches and method for manufacturing

FLIP CHIP PACKAGING STRUCTURE

Power semiconductor package with conductive clip

Solder ball mounting tool

Semiconductor packages

Flip chip package for DRAM with two underfill materials

Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer

Bonding material for semiconductor devices

Microelectronic package with self-heating interconnect

Planarized bumps for underfill control

Packaged die for heat dissipation and method therefor

Chip-on-Wafer structures and methods for forming the same

INTERPOSER AND SEMICONDUCTOR PACKAGE WITH NOISE SUPPRESSION FEATURES

Semiconductor device and manufacturing method thereof

Multi-transistor exposed conductive clip for semiconductor packages

Wafer level chip scale package

Joining method and semiconductor device manufacturing method

Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process

Solder in cavity interconnection structures

MATRICES FOR RAPID ALIGNMENT OF GRAPHITIC STRUCTURES FOR STACKED CHIP COOLING APPLICATIONS

Integrated circuit having staggered bond pads and I/O cells

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Device having electrodes formed from bumps with different diameters

Mechanisms for forming fine-pitch copper bump structures

Semiconductor device and manufacturing method thereof

Chip-package having a cavity and a manufacturing method thereof

Thermally efficient integrated circuit package

Flexible interconnect pattern on semiconductor package

Methods for performing reflow in bonding processes

Semiconductor device with wireless communication

Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die

Method for developing a custom device

Microelectronic package and method of manufacturing same

Package structures and methods for forming the same

Package for three dimensional integrated circuit

Termination structure for gallium nitride schottky diode

Misalignment correction for embedded microelectronic die applications

Apparatus for electrostatic discharge protection and noise suppression in circuits