212222 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Nitrides composed of metals from groups of the periodic table 13th Group
Sub-classes:THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#2SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#3ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#4HEAT DISSIPATING STRUCTURE AND METHODS OF FORMING THE SAME
#5SEMICONDUCTOR PACKAGE AND RELATED METHODS
#6Bonding Layers Formed of High Thermal Conductivity Materials
#7OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
#8SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#9Heat Dissipating Structure and Methods of Forming The Same
#10RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
#11Semiconductor Devices and Methods of Forming the Same
#12SEMICONDUCTOR PACKAGES
#13THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
#14SEMICONDUCTOR PACKAGE AND RELATED METHODS
#15LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
#16THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#17MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER
#18Semiconductor Package and Method of Forming the Same
#19REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
#20RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
#21OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
#22THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEET
#23Laminate and electronic device
#24Semiconductor package and related methods
#25Semiconductor devices and semiconductor devices including a redistribution layer
#26Thermal interface material with ion scavenger
#27A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#28A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#29Semiconductor devices including conductive pillars
#30SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
#31Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#32EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER
#33Sintering materials and attachment methods using same
#34Thermal interface material with ion scavenger
#35Power module and fabrication method for the same
#36Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#37Front facing piggyback wafer assembly
#38Nitride based semiconductor package and method of manufacturing the same and bonding substrate
#39Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film
#40Reliable wire structure and method
#41Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
#42Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#43Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device
#44THERMOSETTING DIE-BONDING FILM
#45Thermosetting die-bonding film
#46DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#47Self-filleting die attach paste
#48ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
#49Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
#50Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#51Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#52ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#53THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#54LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#55Die bond film, dicing die bond film, and semiconductor device
#56DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME
#57Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#58Acrylic insulating adhesive
#59METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#60Self-Filleting Die Attach Paste
#61THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
#62Method of manufacturing semiconductor component, and semiconductor component
#63Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
#64Semiconductor wafer coated with a filled, spin-coatable material
#65Thermosetting die-bonding film
#66Methods for assembling thin semiconductor die
#67Thermosetting resin composition and semiconductor sealing medium
#68Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device
#69Adhesive composition, adhesive sheet and production method of semiconductor device
#70Adhesive composition and adhesive sheet
#71Thermally and electrically conductive interconnect structures
#72Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
#73Epoxy Resin Composition and Die Bonding Material Comprising the Composition
#74Die bonding agent and a semiconductor device made by using the same
#75Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
#76B-stageable die attach adhesives
#77Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#78Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
#79Thermally conductive composite and uses for microelectronic packaging
#80Adhesive sheet, semiconductor device, and process for producing semiconductor device
#81Adhesion method using gray-scale photolithography
#82Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
#83Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography
#84Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
#85Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
#86Die attach adhesives with improved stress performance
#87Thermally conductive composite and uses for microelectronic packaging
#88Co-curable compositions
#89Underfill and encapsulation of semiconductor assemblies with materials having differing properties
#90Thermally conductive compositions and methods of making thereof
#91Wafer bonding using boron and nitrogen based bonding stack