212223 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Nitrides composed of metals from groups of the periodic table 13th Group AlN
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#2INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
#3INTEGRATED CIRCUIT PACKAGE AND METHOD
#4INTEGRATED CIRCUIT PACKAGES AND METHODS
#5HEAT DISSIPATING STRUCTURE AND METHODS OF FORMING THE SAME
#6INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
#7METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE
#8INTEGRATED CIRCUIT PACKAGES AND METHODS
#9Heat Dissipating Structure and Methods of Forming The Same
#10DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER
#11Semiconductor Devices and Methods of Forming the Same
#12SEMICONDUCTOR DEVICE
#13THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
#14LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
#15Integrated Circuit Package and Method
#16THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
#17ALN-BASED HYBRID BONDING
#18MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER
#19REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
#20Semiconductor device
#21Display device
#22METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT
#23THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEET
#24Semiconductor module and method for manufacturing same
#25Laminate and electronic device
#26Semiconductor packaging structure and process
#27Thermal interface material with ion scavenger
#28Multiple-chip package with multiple thermal interface materials
#29INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSOCIATED SYSTEMS AND METHODS
#30Optoelectronic semiconductor component
#31Semiconductor module and power converter
#32Semiconductor packaging structure and process
#33Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference
#34Electronic device, electronic device fabrication method, and electronic apparatus
#35Power module package and method for manufacturing the same
#36EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER
#37Sintering materials and attachment methods using same
#38Thermal interface material with ion scavenger
#39Semiconductor devices and methods of manufacturing the same
#40Power module with the integration of control circuit
#41ASSEMBLY COMPRISING TWO ELEMENTS OF DIFFERENT THERMAL EXPANSION COEFFICIENTS AND A SINTERED JOINT OF HETEROGENEOUS DENSITY AND PROCESS FOR MANUFACTURING THE ASSEMBLY
#42Semiconductor device
#43Interconnect structure with improved conductive properties and associated systems and methods
#44CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#45Semiconductor device module with solder layer
#46Power module and fabrication method for the same
#47Electronic Circuit Board, Semiconductor Device Using the Same and Manufacturing Method for the Same
#48SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
#49High-power electronic device packages and methods
#50Hybrid bonding mechanisms for semiconductor wafers
#51METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRISING ALUMINUM NITRIDE INTERPOSER
#52MODULE AND METHOD FOR PRODUCING MODULE
#53Method for forming chip package
#54Reduced expansion thermal compression bonding process bond head
#55Graphite-containing substrates for LED packages
#56Hybrid bonding mechanisms for semiconductor wafers
#57Optoelectronic semiconductor component
#58Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film
#59FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, AND SEMICONDUCTOR DEVICE
#60Manufacturing a filling of a gap in semiconductor devices
#61Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
#62THERMOSETTING DIE-BONDING FILM
#63Thermosetting die-bonding film
#64DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#65ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
#66SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND
#67DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE
#68ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#69THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#70LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#71Die bond film, dicing die bond film, and semiconductor device
#72DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME
#73Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#74Acrylic insulating adhesive
#75METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#76THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
#77Method of manufacturing semiconductor component, and semiconductor component
#78Electronic component mounted structure
#79Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
#80MULTI CHIP STACKING WITH RELIABLE JOINING
#81Thermosetting die-bonding film
#82Methods for assembling thin semiconductor die
#83ADHESIVE FILM FOR SEMICONDUCTOR
#84Thermally and electrically conductive interconnect structures
#85Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
#86Epoxy Resin Composition and Die Bonding Material Comprising the Composition
#87Adhesive composition and a method of using the same
#88Die bonding agent and a semiconductor device made by using the same
#89Multi-chip semiconductor package and method for fabricating the same
#90B-stageable die attach adhesives
#91Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#92COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
#93Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
#94Thermally conductive composite and uses for microelectronic packaging
#95Adhesive sheet, semiconductor device, and process for producing semiconductor device
#96Adhesion method using gray-scale photolithography
#97Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
#98Thermally conductive composite and uses for microelectronic packaging
#99Bonding wire and bonded connection
#100Co-curable compositions
#101Compositions for use in electronics devices
#102Thermally conductive compositions and methods of making thereof
#103Manufacturing method for multichip module