212504 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Passive devices, e.g. 2 terminal devices Rectifying Diode
Sub-classes:SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DEVICE
#3METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDIATE CARRIER
#4POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR HYBRID ELECTRIC VEHICLE
#5SEMICONDUCTOR MODULE
#6SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
#7SEMICONDUCTOR DEVICE
#8METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDIATE CARRIER
#9SEMICONDUCTOR PACKAGE AND RELATED METHODS
#10SEMICONDUCTOR MODULE AND VEHICLE
#11SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
#12ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTRICAL COMPONENTS
#13CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
#14PACKAGE STRUCTURE
#15SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
#16PACKAGE STRUCTURE FOR HEAT DISSIPATION
#17PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
#18SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#19THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCTOR DEVICE MODULES
#20WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
#21SEMICONDUCTOR DEVICE
#22PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION ELEMENT EXTENDING ALONG MOUNTING BASE
#23METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDIATE CARRIER
#24METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#25PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#26MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
#27SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
#28LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHANICAL ROBUSTNESS AND A SEMICONDUCTOR PACKAGE
#29ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
#30POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AND POWER SUPPLY EQUIPMENT
#31SEMICONDUCTOR DEVICE
#32CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND DIFFUSION SOLDERING
#33SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
#34Structure and Method of Forming a Joint Assembly
#35SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
#36SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
#37SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#38STACKED VIA STRUCTURE
#39COOLED POWER MODULE
#40ELECTRONIC APPARATUS
#41ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#42SEMICONDUCTOR DEVICE
#43SEMICONDUCTOR MODULE ARRANGEMENT
#44METAL WIRING BOARD
#45METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
#46DOUBLE-SIDE COOLED POWER MODULES
#47Package structure
#48POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#49SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT
#50DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPPER NICKEL TIN METALLIZATION STACK AND DIFFUSION SOLDERING
#51SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
#52POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#53POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR HYBRID ELECTRIC VEHICLE
#54Solder material
#55SEMICONDUCTOR PACKAGE AND RELATED METHODS
#56DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
#57Die package and method of forming a die package
#58Chip package structure having molding layer
#59SEMICONDUCTOR MODULE
#60METHODS AND SYSTEMS OF DRIVING ARRAYS OF DIODES
#61SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#62PACKAGE WITH FAN-OUT STRUCTURES
#63SEMICONDUCTOR MODULE
#64Thermal performance improvement and stress reduction in semiconductor device modules
#65Package structure for heat dissipation
#66SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#67SEMICONDUCTOR MODULE
#68SEMICONDUCTOR APPARATUS AND VEHICLE
#69RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
#70Fan-out structure and method of fabricating the same
#71SEMICONDUCTOR DEVICE
#72SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS
#73DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#74SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#75MANUFACTURABLE GALLIUM CONTAINING ELECTRONIC DEVICES
#76SEMICONDUCTOR MODULE AND FAILED ELEMENT DETERMINATION METHOD THEREFOR
#77RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
#78Free Configurable Power Semiconductor Module
#79Method for manufacturing package structure
#80POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AIR CONDITIONER
#81Bidirectional switch circuit and power conversion device
#82SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE
#83SEMICONDUCTOR MODULE
#84Package including multiple semiconductor devices
#85ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#86METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METHOD FOR JOINING MEMBERS TO BE JOINED
#87SEMICONDUCTOR MODULE
#88SEMICONDUCTOR DEVICE AND POWER CONVERTER
#89CERAMIC SUBSTRATE FOR POWER MODULE AND POWER MODULE COMPRISING SAME
#90Fingerprint recognition module and electronic device comprising same
#91Semiconductor module and method for manufacturing semiconductor module
#92Hybrid nanosilver/liquid metal ink composition and uses thereof
#93Power semiconductor module with laser-welded leadframe
#94Method for Producing Power Semiconductor Module and Power Semiconductor Module
#95Die package and method of forming a die package
#96Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips
#97SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
#98Semiconductor device encapsulated by molding material attached to redistribution layer
#99PACKAGED POWER SEMICONDUCTOR DEVICE AND POWER CONVERTER
#100High power density 3D semiconductor module packaging
#101Ultra small molded module integrated with die by module-on-wafer assembly
#102Semiconductor device and method for manufacturing semiconductor device
#103SEMICONDUCTOR MODULE
#104Package structure with fan-out feature
#105Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure
#106Power module with graphite plate
#107Power module and fabrication method of the same, graphite plate, and power supply equipment
#108Structure and method of forming a joint assembly
#109Package structure for heat dissipation
#110Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#111Power semiconductor device and substrate with dimple region
#112Method for manufacturing side wettable package
#113Silicon nitride circuit board and electronic component module
#114Electronic component and semiconductor device
#115Chip package structure
#116Side wettable package
#117SEMICONDUCTOR DEVICE
#118Electronic device
#119Single-shot encapsulation
#120Power semiconductor module
#121Semiconductor device including sense insulated-gate bipolar transistor
#122Transient liquid phase bonding compositions and power electronics assemblies incorporating the same
#123Manufacturing method of semiconductor device and semiconductor device
#124Semiconductor module
#125Semiconductor device and method for manufacturing semiconductor device
#126Package structure and method of forming the same
#127Package structures and methods of forming the same
#128Package with fan-out structures
#129Method of manufacturing semiconductor package structure
#130Half-bridge module for an inverter of an electric drive of an electric vehicle or a hybrid vehicle and an inverter for an electric drive of an electric vehicle or a hybrid vehicle
#131Formation method of chip package with fan-out structure
#132Apparatus for bond wave propagation control
#133Integrated circuit package and method of forming same
#134Semiconductor device, sintered metal sheet, and method for manufacturing sintered metal sheet
#135Power semiconductor module
#136Semiconductor device and manufacturing method of semiconductor device
#137Semiconductor device and method of manufacturing the same
#138METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#139METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#140Semiconductor device including surface pressure absorbing member for fastening heat sink
#141Fan-out structure and method of fabricating the same
#142Package structure for heat dissipation
#143Semiconductor device sub-assembly
#144Stacked via structure
#145Package including multiple semiconductor devices
#146Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
#147Package structure
#148Power semiconductor module and power conversion apparatus
#149Reflector markers and systems and methods for identifying and locating them
#150Semiconductor device
#151Semiconductor module arrangement
#152Semiconductor device encapsulated by molding material attached to redestribution layer
#153Method for forming hybrid-bonding structure
#154Package structures and methods of forming the same
#155Stacked via structure
#156Semiconductor component, package structure and manufacturing method thereof
#157Method of manufacturing semiconductor package structure
#158Semiconductor package and related methods
#159ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#160Semiconductor module
#161Semiconductor module and semiconductor module manufacturing method
#162Semiconductor apparatus, power module and power supply
#163Die package and method of forming a die package
#164Fan-out structure and method of fabricating the same
#165Power semiconductor device and manufacturing method for power semiconductor device
#166RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same
#167RF devices with enhanced performance and methods of forming the same
#168Semiconductor device and method for producing semiconductor device
#169Semiconductor with external electrode
#170High power module semiconductor package with multiple submodules
#171Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#172Semiconductor device manufacturing method and semiconductor device
#173Electronic device
#174Semiconductor arrangement
#175Chip package structure
#176Parallel electrode combination, power module and power module group
#177Method for manufacturing package structure
#178Electronic component and semiconductor device
#179Method of manufacturing semiconductor module and semiconductor module
#180Chip package with fan-out structure
#181Semiconductor device
#182Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereof
#183Molded wafer level packaging
#184Package structure and method of forming the same
#185Electric power conversion apparatus
#186Semiconductor device
#187Power semiconductor device and power conversion device
#188Methods and systems of driving arrays of diodes
#189Die bonder and methods of using the same
#190Die bonder and methods of using the same
#191Integrated circuit package and method of forming same
#192Apparatus for bond wave propagation control
#193Power Semiconductor Circuit and Method for Determining a Temperature of a Power Semiconductor Component
#194Semiconductor device including sense insulated-gate bipolar transistor
#195Semiconductor device
#196Method for manufacturing an electronic assembly
#197Hybrid nanosilver/liquid metal ink composition and uses thereof
#198Integrated circuit packages and methods of forming same
#199Structure and method of forming a joint assembly
#200SEMICONDUCTOR MODULE
#201Planarization of semiconductor packages and structures resulting therefrom
#202Chip packaging method and device with packaged chips
#203Semiconductor device and method of manufacturing the same
#204Semiconductor device
#205Semiconductor module and power conversion apparatus
#206Single-shot encapsulation
#207Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
#208Semiconductor component, package structure and manufacturing method thereof
#209Power electronics package and method of manufacturing thereof
#210Package including multiple semiconductor devices
#211Power semiconductor module
#212Fan-out structure and method of fabricating the same
#213Chip package structure
#214Semiconductor device sub-assembly
#215Semiconductor device
#216Method of manufacturing a semiconductor device
#217Power semiconductor module and power semiconductor device
#218Cooling bond layer and power electronics assemblies incorporating the same
#219SEMICONDUCTOR DEVICE
#220High power module semiconductor package with multiple submodules
#221Power semiconductor device
#222Semiconductor device sub-assembly
#223Semiconductor device
#224Semiconducter device with filler to suppress generation of air bubbles and electric power converter
#225Solder material
#226Electronic device
#227Semiconductor device
#228Process for fabricating circuit components in matrix batches
#229Conductor design for integrated magnetic devices
#230Semiconductor device and manufacturing method of semiconductor device
#231Semiconductor structure and manufacturing method thereof
#232Semiconductor package having stacked substrates with cavities
#233Semiconductor apparatus and electric power conversion apparatus
#234Method for producing a printed circuit board structure
#235Package structure and method of manufacturing the same
#236SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#237Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
#238Planarization of semiconductor packages and structures resulting therefrom
#239Semiconductor device and method for producing semiconductor device
#240Chip package structure
#241Method of manufacturing semiconductor package structure
#242Die stack structure and method of fabricating the same
#243Package with fan-out structures
#244Method of fabricating integrated fan-out packages
#245Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same
#246Package structure and method of forming the same
#247Package structure for heat dissipation
#248Package structures and methods of forming the same
#249Semiconductor copper metallization structure and related methods
#250Semiconductor apparatus
#251Semiconductor device including conductive spacer with small linear coefficient
#252Apparatus for bond wave propagation control
#253Semiconductor device and electronic apparatus including semiconductor chips including an insulated gate bipolar transistor and a diode
#254Method for manufacturing a semiconductor component and a semiconductor component
#255Semiconductor device
#256Package structure and method of fabricating package structure
#257Semiconductor device
#258Semiconductor device and fabrication method thereof
#259Power module with multi-layer substrate
#260Molded wafer level packaging
#261Power semiconductor apparatus and manufacturing method therefor
#262Power module and power conversion apparatus including case and elastic member
#263Semiconductor device
#264Semiconductor module for a power conversion circuit for reliably reducing a voltage surge
#265Semiconductor chip and method of processing a semiconductor chip
#266Semiconductor device and semiconductor element with improved yield
#267Semiconductor device
#268Power device
#269Damaging components with defective electrical couplings
#270Solid top terminal for discrete power devices
#271Molded package with chip carrier comprising brazed electrically conductive layers
#272Method of packaging power semiconductor module including power transistors
#273Power semiconductor device load terminal
#274Power module based on multi-layer circuit board
#275Semiconductor device
#276Multi-phase power converter with common connections
#277Ultra small molded module integrated with die by module-on-wafer assembly
#278Reverse mounted gull wing electronic package
#279Semiconductor structures and fabrication methods thereof
#2803D chip sharing data bus
#281Projection display system
#282Package structure and method for forming the same
#283Power semiconductor device and power conversion device
#284Semiconductor device and method of manufacturing the semiconductor device
#285Component module and power module
#286Semiconductor structures and methods
#287Power semiconductor module for an inverter circuit and method of manufacturing the same
#288Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
#289Processing Techniques for Silicon-Based Transient Devices
#290Semiconductor device and method of manufacturing semiconductor device
#291Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
#292Reflector markers and systems and methods for identifying and locating them
#293Pressure contact type semiconductor apparatus
#294Metal line design for hybrid-bonding application
#295Stackable power module
#296Semiconductor module and power conversion device
#297Semiconductor device and method of forming partition fence and shielding layer around semiconductor components
#298Semiconductor device and method of manufacturing the same
#299Semiconductor package structure
#300MICRO- OR NANO-WIRE LED LIGHT SOURCE COMPRISING TEMPERATURE MEASUREMENT MEANS