212504 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Passive devices, e.g. 2 terminal devices Rectifying Diode
Semiconductor module
#302Electronic assembly with enhanced thermal dissipation
#303Semiconductor device and manufacturing method thereof
#304High power gallium nitride devices and structures
#305Hybrid nanosilver/liquid metal ink composition and uses thereof
#306Electronic component package for electromagnetic interference shielding and method for manufacturing the same
#307Power module
#308High power gallium nitride devices and structures
#309Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane
#310Semiconductor device and semiconductor module provided with same
#311Physical topology for a power converter
#312Semiconductor device
#313Case, semiconductor device and manufacturing method of case
#314Semiconductor copper metallization structure and related methods
#315Light emitting device and solder bond structure
#316Semiconductor device and power conversion device including a bent control side frame
#317Power module and fabrication method of the same, graphite plate, and power supply equipment
#318Semiconductor device including sense insulated-gate bipolar transistor
#319Printing complex electronic circuits using a printable solution defined by a patterned hydrophobic layer
#320Semiconductor device
#321Package with vertically spaced partially encapsulated contact structures
#322Multi-phase power converter with common connections
#323Power semiconductor module and method for manufacturing the same
#324Method for manufacturing an electronic device and electronic device
#325Chip carrier configured for delamination-free encapsulation and stable sintering
#326Semiconductor device
#327Package with roughened encapsulated surface for promoting adhesion
#328Power module and manufacturing method thereof
#329Semiconductor device and method of manufacturing semiconductor device
#330Semiconductor copper metallization structure and related methods
#331Damaging components with defective electrical couplings
#332Intelligent power module and manufacturing method thereof
#333Power semiconductor module
#334Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#335Surface mount package and manufacturing method thereof
#336Semiconductor module and power converter
#337Semiconductor device with solders of different melting points and method of manufacturing
#338Method of manufacturing a circuit device
#339Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#340Semiconductor component and method of manufacture
#341Electronic Device
#342Structure and method of forming a joint assembly
#343Power module
#344Insulated circuit board, power module and power unit
#345Fan-out wafer level chip package structure
#346Apparatuses for communication systems transceiver interfaces
#347Semiconductor device and power module
#348Electronic component having a heat-sink thermally coupled to a heat-spreader
#349Semiconductor device
#350Semiconductor device
#351POWER CONVERSION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#352Power semiconductor module and method for manufacturing the same
#353Baseplate for an electronic module
#354Method for producing a semi-conductor arrangement and corresponding semi-conductor arrangement
#355Surface mount device package having improved reliability
#356Semiconductor device having a resin case with a notch groove
#357Semiconductor module
#358Solder paste
#359Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#360Sensor and manufacturing method thereof
#361Semiconductor device and electronic apparatus including a first semiconductor chip including an insulated gate bipolar transistor and a second semiconductor chip including a diode
#362Electric power conversion apparatus
#363Electronic circuit device
#364Semiconductor module
#365Power overlay structure and reconstituted semiconductor wafer having wirebonds
#366Power semiconductor device
#367Power semiconductor arrangement
#368Power semiconductor device including a semiconductor switching element
#369Semiconductor apparatus
#370Circuit board structure
#371Substrate structures and methods of manufacture
#372Power module package and method for manufacturing the same
#373Semiconductor device
#374Semiconductor module with bus bar including stacked wiring layers
#375Printing complex electronic circuits using a patterned hydrophobic layer
#376Method for forming complex electronic circuits by interconnecting groups of printed devices
#377Bridging DMB structure for wire bonding in a power semiconductor module
#378System and method for dual-region singulation
#379Power module
#380Semiconductor device and method for manufacturing same
#381SEMICONDUCTOR DEVICE
#382Semiconductor device and method of manufacturing semiconductor device
#383METHOD FOR MANUFACTURE A POWER ELECTRONIC SWITCHING DEVICE AND POWER ELECTRONIC SWITCHING DEVICE
#384Semiconductor device
#385Three-phase inverter module
#386Semiconductor device
#387Semiconductor device with separated main terminals
#388Apparatus and methods for radio frequency amplifiers
#389Projection display system
#390Electronic power module with enhanced thermal dissipation and manufacturing method thereof
#391Semiconductor package with integrated semiconductor devices and passive component
#392Selecting a substrate to be soldered to a carrier
#393Semiconductor device
#394Disc-shaped thyristor for a plurality of plated-through semiconductor components
#395Semiconductor component and method of manufacture
#396Shaped lead terminals for packaging a semiconductor device for electric power
#397Semiconductor device
#398ASSEMBLY COMPRISING TWO ELEMENTS OF DIFFERENT THERMAL EXPANSION COEFFICIENTS AND A SINTERED JOINT OF HETEROGENEOUS DENSITY AND PROCESS FOR MANUFACTURING THE ASSEMBLY
#399Semiconductor devices with ball strength improvement
#400Semiconductor device
#401Semiconductor device
#402Power module packaging structure and method for manufacturing the same
#403Power semiconductor module
#404Semiconductor device and production method therefor
#405Power semiconductor device
#406Power semiconductor device
#407Electronic module comprising fluid cooling channel and method of manufacturing the same
#408Cooler-integrated semiconductor module
#409Semiconductor device
#410Power semiconductor device
#411Cooler and cooler fixing method
#412Lead-Free Solder Alloy and Semiconductor Device
#413Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power
#414SNUBBER CIRCUIT
#415System and method for dual-region singulation
#416High performance package and process for making
#417SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE
#418Power semiconductor module and composite module
#419Hybrid circuit device
#420Electrostatic discharge protection for a balun
#421Semiconductor device module with solder layer
#422Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#423Semiconductor device
#424Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#425Power module and fabrication method for the same
#426Method of manufacturing a circuit device
#427Semiconductor chip and method of processing a semiconductor chip
#428Memory module in a package
#429Semiconductor device, a power semiconductor device, and a method for processing a semiconductor device
#430Semiconductor device and method of manufacturing a semiconductor device
#431Semiconductor device and manufacturing method thereof
#432SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
#433Semiconductor die arrangement
#434Fan-out wafer level chip package structure and manufacturing method thereof
#435Method for attaching a semiconductor die to a carrier
#436Double-sided cooling power module and method for manufacturing the same
#437Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
#438Power module, power converter and drive arrangement with a power module
#439Through package circuit in fan-out wafer level package
#440Semiconductor device and manufacturing method thereof
#441SEMICONDUCTOR CHIP AND ELECTRONIC COMPONENT
#442Wiring core structure, semiconductor evaluation device and semiconductor device
#443Miniaturized SMD diode package and process for producing the same
#444Passive component integrated with semiconductor device in semiconductor package
#445Semiconductor package with integrated semiconductor devices and passive component
#446Power semiconductor device and power conversion device
#447Processing techniques for silicon-based transient devices
#448Semiconductor device
#449Semiconductor device
#450Embedded semiconductor device package and method of manufacturing thereof
#451Semiconductor device
#452Semiconductor device
#453Power semiconductor module
#454Semiconductor device including sense insulated-gate bipolar transistor
#455Power semiconductor module with switching device and assembly
#456Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
#457Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
#458Wedge bond foot jumper connections
#459Semiconductor device for suppressing inductance
#460Package structure and packaging method of wafer level chip scale package
#461Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#462SEMICONDUCTOR DEVICE
#463Semiconductor device for suppressing a temperature increase in beam leads
#464Electric power semiconductor device
#465Power Semiconductor Module
#466Electronic Device and Method for Fabricating an Electronic Device
#467Package assembly having interconnect for stacked electronic devices and method for manufacturing the same
#468Power module package and method of manufacturing the same
#469Electronic component
#470Miniaturized SMD diode package and process for producing the same
#471Semiconductor package including a connecting member
#472Semiconductor device
#473PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
#474Power semiconductor device to reduce voltage variation between terminals
#475Electronic component with sheet-like redistribution structure
#476Aluminum coated copper bond wire and method of making the same
#477Aluminum coated copper ribbon
#478Semiconductor package comprising two semiconductor modules and laterally extending connectors
#479Chip scale diode package no containing outer lead pins and process for producing the same
#480Power semiconductor module having pattern laminated region
#481Sintered backside shim in a press pack cassette
#482Embedded semiconductor device package and method of manufacturing thereof
#483Multichip device including a substrate
#484Semiconductor devices with ball strength improvement
#485Connection arrangement of an electric and/or electronic component
#486Semiconductor Device with Reduced Contact Resistance
#487DE-POP ON-DEVICE DECOUPLING FOR BGA
#488Semiconductor device
#489Memory module in a package
#490Semiconductor device
#491Semiconductor device and method for manufacturing same
#492III-nitride rectifier package
#493Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
#494Semiconductor device that attenuates high-frequency oscillation
#495Printing complex electronic circuits
#496Balanced stress assembly for semiconductor devices
#497Semiconductor device
#498Medical apparatus and X-ray high voltage apparatus
#499Semiconductor device and method for manufacturing the same
#500Semiconductor device
#501Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#502Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#503Method for producing semiconductor device
#504Power semiconductor device
#505Power module
#506Semiconductor module
#507Stacked type power device module
#508Power overlay structure with leadframe connections
#509Power overlay structure with leadframe connections
#510Low profile surface mount package with isolated tab
#511Dual compartment semiconductor package
#512Semiconductor package with temperature sensor
#513Semiconductor device and method of manufacturing same
#514Semiconductor unit and semiconductor device using the same
#515Semiconductor module cooler
#516Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#517Methods for producing a bond and a semiconductor module
#518Electro-thermal cooling devices and methods of fabrication thereof
#519Semiconductor module and method for manufacturing the same
#520Circuit device
#521Circuit device
#522Circuit device
#523Semiconductor device having improved thermal properties
#524Power semiconductor device module
#525Semiconductor device
#526Power module and output circuit
#527Power semiconductor module and method of manufacturing the same
#528Circuit board for high-capacity modules, and a production method of the circuit board
#529Die fixing method and apparatus
#530Semiconductor device including cladded base plate
#531Power conversion device
#532Methods of and semiconductor devices with ball strength improvement
#533Diode package having improved lead wire and manufacturing method thereof
#534Semiconductor device
#535De-pop on-device decoupling for BGA
#536Semiconductor device including cladded base plate
#537Power overlay structure with leadframe connections
#538Semiconductor device
#539Memory module in a package
#540Memory module in a package
#541De-skewed multi-die packages
#542Conductive pads defined by embedded traces
#543Electrically-cooled power module
#544Apparatus and methods for electronic amplification
#545Solar cell assembly II
#546High voltage cascoded III-nitride rectifier package utilizing clips on package surface
#547Semiconductor device
#548Dual compartment semiconductor package with temperature sensor
#549Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
#550Semiconductor device and method of testing the same
#551Power semiconductor package structure and manufacturing method thereof
#552SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
#553Conductive pads defined by embedded traces
#554Power package module with low and high power chips and method for fabricating the same
#555Circuit device and method of manufacturing the same
#556Semiconductor apparatus and the method of manufacturing the same
#557Semiconductor device
#558SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#559Semiconductor device
#560Electronic device comprising a chip disposed on a pin
#561Semiconductor module and method for production thereof
#562Electrical connection device
#563Semiconductor device
#564Flip chip bonder head for forming a uniform fillet
#565Semiconductor device production method and semiconductor device
#566ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
#567SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#568CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER
#569Semiconductor device including semiconductor packages stacked on one another
#570Method of manufacturing semiconductor modules and semiconductor module
#571Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#572Power semiconductor device and power conversion device
#573Circuit board including a heat radiating plate
#574WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#575Electric power conversion apparatus
#576Semiconductor device and passive component integration in a semiconductor package
#577Electric power conversion apparatus
#578Integrated circuit with flexible planar leads
#579Compression connection for vertical IC packages
#580Semiconductor device with reduced contact resistance
#581Semiconductor device
#582LED packaging structure
#583Manufacturable thin film gallium and nitrogen containing devices
#584Heat dissipation substrate for multi-chip package
#585Molded package with chip carrier comprising brazed electrically conductive layers
#586Inverse diode stack
#587Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#588Power module
#589Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof