212514 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Passive devices, e.g. 2 terminal devices; Optical Diode LED
Single-shot encapsulation
#302Electronic substrate and electronic device
#303Display device and method of fabricating the same
#304Dielectric Film Forming Compositions
#305LED with internally confined current injection area
#306Light conversion device
#307Display module and manufacturing method thereof
#308Electronic device and manufacturing method of electronic device
#309Apparatus for and method for aligning dipoles and method of fabricating display device
#310Monolithic light source with integrated optics based on nonlinear frequency conversion
#311Display device
#312Display panel and head mounted device
#313Display device and method for manufacturing the same
#314Light emitting diode package and display apparatus including the same
#315Circuit board structure and method for manufacturing a circuit board structure
#316Systems and methods for multi-color LED pixel unit with horizontal light emission
#317Light emitting device module and display apparatus having the same
#318Method of manufacturing light-emitting device
#319Dense hybrid package integration of optically programmable chip
#320Methods and devices for fabricating and assembling printable semiconductor elements
#321Light-emitting diode, method for manufacturing the same, backlight source and display device for improving heat dissipation
#322Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#323Integrated display devices
#324Display device
#325Method of transferring a plurality of micro light emitting diodes to a target substrate, array substrate and display apparatus thereof
#326Apparatus for manufacturing electronic device using device chip
#327Display device, display module, electronic device, and method for manufacturing display device
#328Semiconductor packages with an intermetallic layer
#329Selective micro device transfer to receiver substrate
#330Method for transferring and bonding of devices
#331Optical component package and device using same
#332Method for integrating a light emitting device
#333Multiple pixel package structure with buried chip and electronic device using the same
#334DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRATED PHOTONICS
#335Multi wavelength light emitting device and method of fabricating the same
#336Light emitting diode display with redundancy scheme
#337Light-emitting element package and light source module
#338Light emitting diode package
#339Display with embedded pixel driver chips
#340Display device having plurality of light emitting elements between a bank structure
#341Low pressure sintering powder
#342Portable light with curved chip-on-board assembly
#343Semiconductor light emitting device
#344Circuit backplane of display panel, method for manufacturing the circuit backplane, and display panel
#345Semiconductor device and method of making a wafer-level chip-scale package
#346Light-emitting device package including a lead frame
#347Light emitting diode containing a grating and methods of making the same
#348Semiconductor light emitting element and semiconductor light emitting device
#349Printed Circuit Board and Method of Manufacturing a Printed Circuit Board with at Least One Optoelectronic Component Integrated into the Printed Circuit Board
#350Die-bonding method and spraying device for LED
#351Multilevel semiconductor device and structure with waveguides
#352Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#353Method for temporarily fastening a semiconductor chip to a surface, method for producing a semiconductor component and semiconductor component
#354Photorelay
#355LIGHT EMITTING DEVICE
#356Display apparatus including conductive pattern in substrate and method of manufacturing the same
#357Surface emitting light source with lateral variant refractive index profile
#358Fan out structure for light-emitting diode (LED) device and lighting system
#359Light emitting device and fluidic manufacture thereof
#360Transfer carrier for micro light-emitting element
#361Semiconductor device and a method of manufacturing thereof
#362Fan out structure for light-emitting diode (LED) device and lighting system
#363LED display device
#364Etched trenches in bond materials for die singulation, and associated systems and methods
#365Stretchable display device
#366Method of transferring micro-light emitting diode for LED display
#367Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#368Packaging photon building blocks with top side connections and interconnect structure
#369Light emitting device for display and LED display apparatus having the same
#370Light emitting diode package
#371Wafer level packaging of light emitting diodes (LEDs)
#372Semiconductor device comprising PN junction diode and Schottky barrier diode
#373Fabric with embedded electrical components
#374Light emitting device for display and light emitting package having the same
#375Light-emitting diode device with driving mechanism
#376Illumination device
#377Thermosetting silicone resin composition and die attach material for optical semiconductor device
#378Semiconductor device package and method of manufacturing the same
#379LED assembly with omnidirectional light field
#380Micro LED display and manufacturing method with conductive film
#381Light emitting element and display device including the same and method for manufacturing display device
#382Light-emitting apparatus
#383Light emitting device
#384Semiconductor device
#385Optoelectronic semiconductor device and method for producing optoelectronic semiconductor devices
#386Method For Manufacturing Led Display
#387Selectively bonding light-emitting devices via a pulsed laser
#388Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
#389Curing pre-applied and plasma-etched underfill via a laser
#390Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
#391Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
#392LED display and electronic device having same
#393Light-emitting diode chip, device, and lamp
#394Method of producing electroconductive substrate, electronic device and display device
#395Light-emitting package
#396Manufacturing method of micro-LED display panel
#397Optical component package and device using same
#398Light emitting device
#399Packaging for fingerprint sensors and methods of manufacture
#400Electronic device
#401Light bulb
#402Light conversion device
#403Display device and manufacturing method thereof
#404Semiconductor device and method of forming embedded wafer level chip scale packages
#405Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB
#406Display apparatus and manufacturing method thereof
#407DISPLAY APPARATUS AND METHOD OF MANUFACTURING THEREOF
#408Junction structure
#409Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#410Semiconductor light emitting device
#411Method for producing a connection between component parts, and component made of component parts
#412Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#413Assembly process for circuit carrier and circuit carrier
#414Light emitting device
#415Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#416Carrier structure and carrier device
#417Illumination device
#418Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#419Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#420Micro-connection structure and manufacturing method thereof
#421Integrated display devices
#422Printed LED arrays with large-scale uniformity
#423Display with embedded pixel driver chips
#424Isolator integrated circuits with package structure cavity and fabrication methods
#425Process for packaging component
#426Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film
#427Light-emitting device package including a lead frame
#428LED with internally confined current injection area
#429Direct transfer of semiconductor devices from a substrate
#430Method of producing a substrate and system for producing a substrate
#431Apparatus for direct transfer of semiconductor device die
#432Method and structure for die bonding using energy beam
#433Chiplets with connection posts
#434Via for semiconductor device connection and methods of forming the same
#435Semiconductor device package and a method of manufacturing the same
#436Method for transfer of semiconductor devices onto glass substrates
#437Semiconductor chip package having optical interface
#438Method of fabricating a plurality of linear arrays with submicron y-axis alignment
#439Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
#440Semiconductor device and a method of manufacturing thereof
#441Molded package
#442Lighting device for frequency-modulated emission
#443Method for integrating a light emitting device
#444Micro device transfer head assembly
#445METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#446Mounting device
#447Light bulb
#448Display apparatus including conductive pattern in substrate and method of manufacturing the same
#449Display devices and methods for forming the same
#450Display device using semiconductor light emitting device surrounded by conductive electrode and method for manufacturing the same
#451Systems for direct transfer of semiconductor device die
#452LED filament and LED light bulb
#453Photocoupler
#454Light emitting device
#455Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
#456Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
#457Display apparatus
#458Semiconductor device comprising PN junction diode and schottky barrier diode
#459LED MOUNTING METHOD AND DEVICE
#460Optical device
#461Semiconductor light emitting device and method for manufacturing same
#462LED module and method for fabricating the same
#463LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#464Light emitting device encapsulated above electrodes
#4653D Stacked and Encapsulated LED Display Screen Module and Its Encapsulation Method
#466Chiplets with connection posts
#467Light-emitting diode and application therefor
#468Stacking of three-dimensional circuits including through-silicon-vias
#469Display device and method of manufacturing the same
#470Light-emitting package
#471Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP
#472Semiconductor device
#473Light-emitting device package including a lead frame
#474High speed handling of ultra-small chips by selective laser bonding and debonding
#475Substrate laminated body and method of manufacturing substrate laminated body
#476Optoelectronic component and method for producing an optoelectronic component
#477Packaging photon building blocks with top side connections and interconnect structure
#478Light emitting diode with zinc oxide layer and method of fabricating the same
#479Light emitting diode display with redundancy scheme
#480LED module and method for fabricating the same
#481Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#482Methods and devices for fabricating and assembling printable semiconductor elements
#483METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP
#484Light emitting device and method of manufacturing the same
#485Light emitting device
#486Four-in-one mini-LED module, display screen and manufacturing method
#487Image display device
#488Light emitting device and method of manufacturing the light emitting device
#489Semiconductor chip stack and method for manufacturing semiconductor chip stack
#490Chiplets with connection posts
#491Micro device stabilization post
#492Single-shot encapsulation
#493Method for fabricating the electronic component, and method for transposing a micro-element
#494Method for producing an optical semiconductor device
#495Reflective layer for an illumination device
#496Apparatus for direct transfer of semiconductor device die
#497High speed handling of ultra-small chips by selective laser bonding and debonding
#498Method of manufacturing semiconductor device
#499Sintered compact and light emitting device
#500High yield substrate assembly
#501LED display and electronic device having same
#502Integrated multi-color light-emitting pixel arrays based devices by bonding
#503CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME
#504Optoelectronic device with light-emitting diode with extraction enhancement
#505Light emitting device
#506LIGHT EMITTING PACKAGE
#507Electronic device with common electrode
#508Method for manufacturing a module and an optical module
#509Vertical gallium nitride Schottky diode
#510Light bulb
#511Light emitting device and method of manufacturing the light emitting device
#512Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#513Wiring board, electronic device, and electronic module
#514Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#515Thin film light emitting diode
#516Micro-device panel and manufacturing process thereof
#517Semiconductor package structure
#518Method for integrating a light emitting device
#519Micro device transferring method, and micro device substrate manufactured by micro device transferring method
#520Micro-connection structure and manufacturing method thereof
#521Illumination device
#522Micro-LED module and method for fabricating the same
#523Via for semiconductor device connection and methods of forming the same
#524Method for transferring micro device
#525Method for transferring micro device
#526Light emitting device and method of manufacturing the same
#527Method for improved transfer of semiconductor die
#528Display device
#529Method and system for bonding a chip to a substrate
#530Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#531Light emitting apparatus, illumination apparatus and display apparatus
#532Semiconductor device
#533Transfer method, mounting method, transfer device, and mounting device
#534Light emitting device
#535Method of aligning semiconductor chips, method of arranging semiconductor chips, device that produces a semiconductor component, and semiconductor component
#536Display apparatus and manufacturing method thereof
#537MOLDED CHIP FABRICATION METHOD AND APPARATUS
#538Semiconductor device
#539Location displacement detection method, location displacement detection device, and display device
#540Solder material
#541Direct-bonded optoelectronic interconnect for high-density integrated photonics
#542Structure with micro device
#543Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#544Component joining apparatus, component joining method and mounted structure
#545Placement method for circuit carrier and circuit carrier
#546Light emitting device and fluidic manufacture thereof
#547Foldable display design
#548Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer
#549Semiconductor chip package having optical interface
#550Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#551Microarray and method for forming the same
#552Advanced solder alloys for electronic interconnects
#553Light emitting device and method of manufacturing the same
#554Display device and method of manufacturing the same
#555Semiconductor device and method for manufacturing same
#556Micro LED transferring method, micro LED display panel and micro LED display device
#557Method of manufacturing a chip component
#558Transfer printing substrate and method for producing the same
#559METHOD AND APPARATUS FOR LIGHT DIFFUSION
#560Micro-LED display panel and manufacturing method thereof
#561Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
#562Device, system and method for aligning electronic components
#563Optical-semiconductor device including a wavelength converting member and method for manufacturing the same
#564Light emitting device and method of producing the same
#565Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP
#566Method and system for mass arrangement of micro-component devices
#567Lead frame including connecting portions and coupling portions
#568Light emitting device and method of forming the same
#569Semiconductor device and a method of manufacturing thereof
#570Semiconductor device and method of using a standardized carrier in semiconductor packaging
#571Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
#572Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device
#573Aluminate fluorescent material, light emitting device, and method for producing aluminate fluorescent material
#574ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE FILM
#575Optical package structure, optical module, and method for manufacturing the same
#576Light-emitting device
#577Display with embedded pixel driver chips
#578Micro device transfer head heater assembly and method of transferring a micro device
#579Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#580Semiconductor light emitting device and method for manufacturing same
#581Micro-transfer printable electronic component
#582Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array
#583Display device
#584Light emitting diodes, components and related methods
#585Optical device
#586Electronic unit
#587Method and apparatus for manufacturing electronic device using device chip
#588Application mechanism, application apparatus, method for manufacturing object to which application material is applied, and method for manufacturing substrate
#589Proximity detector device with interconnect layers and related methods
#590Video wall module and method of producing a video wall module
#591MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#592Device comprising a plurality of diodes
#593Thermal interface material with ion scavenger
#594Micro LED display device and method of fabricating the same
#595Method of producing electroconductive substrate, electronic device and display device
#596Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#597Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#598Light emitting apparatus
#599Light emitting device
#600Semiconductor device