212514 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Passive devices, e.g. 2 terminal devices; Optical Diode LED
Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment
#602Fabric with embedded electrical components
#603Light emitting module and display device
#604Carrier substrate for an optoelectronic semiconductor component
#605Isolator integrated circuits with package structure cavity and fabrication methods
#606Semiconductor light source
#607Light emitting device and lead frame with resin
#608Chip mounting apparatus and method using the same
#609Ultraviolet light-emitting device
#610Opto-reflector
#611Light bulb
#612Optical device
#613Optoelectronic component and method of producing same
#614Micro device integration into system substrate
#615LED module and method for fabricating the same
#616LED module and method for fabricating the same
#617Semiconductor device comprising PN junction diode and Schottky barrier diode
#618Method of manufacturing a semiconductor device including through silicon plugs
#619METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#620Die bond pad design to enable different electrical configurations
#621Electronic device and manufacturing method thereof
#622Light emitting device and method of manufacturing the light emitting device
#623Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#624Method of making fully molded peripheral package on package device
#625SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
#626Termination structure for gallium nitride Schottky diode including junction barriar diodes
#627Light-emitting diode (LED) display array, manufacturing method thereof, and wearable device
#628Method of producing an optical semiconductor device
#629Micro LED display device and method of fabricating the same
#630Semiconductor devices for integration with light emitting chips and modules thereof
#631Electronic component mounting board, electronic device, and electronic module
#632Illumination device
#633Using MEMS fabrication incorporating into LED device mounting and assembly
#634Etched trenches in bond materials for die singulation, and associated systems and methods
#635Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#636Substrate with Array of LEDs for Backlighting a Display Device
#637Light emitting device
#638Method of transferring micro devices
#639Method of batch transferring micro semiconductor structures
#640Method for producing semiconductor device
#641Apparatus for direct transfer of semiconductor device die
#642Display unit
#643Methods for surface attachment of flipped active components
#644Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
#645Electronic device
#646Support substrate for transfer of semiconductor devices
#647Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier
#648Semiconductor module and power conversion device
#649Semiconductor device and an electronic device
#650Method and apparatus for direct transfer of semiconductor device die from a mapped wafer
#651Apparatus for direct transfer of semiconductor devices with needle retraction support
#652Method and apparatus for improved direct transfer of semiconductor die
#653Device and method for producing a device
#654MICRO- OR NANO-WIRE LED LIGHT SOURCE COMPRISING TEMPERATURE MEASUREMENT MEANS
#655Electronic component mounting board and electronic device
#656Semiconductor device and method of packaging
#657Display apparatus including conductive pattern in substrate and method of manufacturing the same
#658Semiconductor device
#659Wiring board, electronic device, and electronic module
#660Light emitting device and method of manufacturing the same
#661Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element
#662Fiducial mark for chip bonding
#663Electronic component mounting board, electronic device, and electronic module
#664Mounting Method of a semiconductor device using a colored auxiliary joining agent
#665Diode with an improved electric current injection
#666Device comprising a plurality of diodes
#667Substrate with array of LEDs for backlighting a display device
#668Electronic device
#669Light-emitting element package
#670Method for fabricating a semiconductor chip panel
#671Light-emitting device having surface-modified luminophores
#672Wiring board and electronic package
#673Solution deposited magnetically guided chiplet displacement
#674Light emitting device and method of fabricating the same
#6753D microdisplay device and structure
#676Flexible support substrate for transfer of semiconductor devices
#677Light emitting device and light emitting module
#678Isolator integrated circuits with package structure cavity and fabrication methods
#679Semiconductor device comprising PN junction diode and schottky barrier diode
#680Massively parallel transfer of microLED devices
#681Semiconductor device package and a method of manufacturing the same
#682Method of surface-mounting components
#683Method for manufacturing light emitting device using a releasable base material
#684Method for integrating a light emitting device
#685LED Module and method for fabricating the same
#686Semiconductor device and method for producing the same
#687Optoelectronic component and method for producing an optoelectronic component
#688Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#689Light emitting device and method of producing the same
#690Light emitting device and method of producing the same
#691Semiconductor light-emitting device
#692Light source comprising a number of semi-conductor components
#693Optical proximity sensor and manufacturing method thereof
#694Light emitting device and solder bond structure
#695Semiconductor light emitting device including cap structure and method of making same
#696Light emitting diode chip
#697LED module and method for fabricating the same
#698Manufacturing method of display
#699Method of making LED light bulb with thermal radiation filaments
#700Wiring board, electronic device, and electronic module
#701Method for fabricating LED module using transfer tape
#702Manufacturing method of semiconductor device
#703Optical fingerprint recognition sensor package
#704OPTICAL FINGERPRINT SENSOR MODULE AND PACKAGE THEREOF
#705Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support
#706Counterbore pocket structure for fluidic assembly
#707Display apparatus and manufacturing method thereof
#708Printing complex electronic circuits using a printable solution defined by a patterned hydrophobic layer
#709Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
#710Light emitting device and method for manufacturing light emitting device
#711Semiconductor light-emitting device
#712Wavelength-converting film and light emitting device and display device using the same
#713Semiconductor light emitting apparatus, stem part
#714Display devices and methods for forming the same
#715Method of producing an optoelectronic component and optoelectronic component
#716Fully molded miniaturized semiconductor module
#717Semiconductor device and method of forming interposer with opening to contain semiconductor die
#718Light emitting diode display with redundancy scheme
#719Light emitting diode with pads on side surface thereof, light emitting device and display device including the light emitting diode
#720Advanced Solder Alloys For Electronic Interconnects
#721Semiconductor chip package having optical interface
#722Micro-transfer printing with volatile adhesive layer
#723Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#724Packaging for fingerprint sensors and methods of manufacture
#725LIGHT EMITTING DIODES AND METHODS
#726CHIP BONDING PROCESS
#727Fluidic Self Assembly of Contact Materials
#728Flexible system integration to improve thermal properties
#729Light emitting diode switch device and array
#730Method of manufacturing light emitting device including metal patterns and cut-out section
#731Semiconductor device and method of manufacturing the same
#732LED module and method for fabricating the same
#733Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
#734LIGHT-EMITTING MODULE, LIGHTING APPARATUS FOR MOBILE OBJECT, AND MOBILE OBJECT
#735Light-emitting device and manufacturing method thereof
#736Electronic component mounting substrate, electronic device, and electronic module
#737Semiconductor device and method of manufacturing the same
#738Engineered polymer-based electronic materials
#739Light emitting device and method of manufacturing the same
#740Apparatus for multi-direct transfer of semiconductors
#741Light emitting device and lighting apparatus including the same
#742Semiconductor device
#743Method for manufacturing light emitting device
#744Light-emitting device
#745Ultraviolet reflective rough adhesive contact
#746Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#747Compact optoelectronic modules
#748Apparatus with forward and reverse-biased light emitting diodes coupled in parallel
#749LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
#750DISPLAY DEVICES AND METHODS FOR FORMING THE SAME
#751Communicating optical signals between stacked dies
#752Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same
#753SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH DISPERSIVE OPTICAL UNIT AND ILLUMINATION DEVICE COMPRISING THE SAME
#754Sintered compact and light emitting device
#755Pixel tile structures and layouts
#756Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#757Light source device having light-emitting diode chips of varying thickness
#758Multiple pixel surface mount device package
#759Lead frame and method of producing a chip housing
#760P—N separation metal fill for flip chip LEDs
#761SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
#762LED with high thermal conductivity particles in phosphor conversion layer
#763Light-emitting apparatus
#764Semiconductor device on string circuit and method of making the same
#765Self-similar and fractal design for stretchable electronics
#766Semiconductor light source
#767Substrate based light emitter devices, components, and related methods
#768Transferring method, manufacturing method, device and electronic apparatus of micro-LED
#769Semiconductor device and method of making embedded wafer level chip scale packages
#770Proximity detector device with interconnect layers and related methods
#771Transferring method, manufacturing method, device and electronic apparatus of micro-LED
#772Assembling method, manufacturing method, device and electronic apparatus of flip-die
#773Molded package and method of manufacture
#774Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer
#775OPTOELECTRONIC SYSTEM
#776METHOD OF PRODUCING A CARRIER AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
#777SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#778METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#779Light emitting device and method for manufacturing the same
#780Light emitting device and fluidic manufacture thereof
#781Methods and devices for fabricating and assembling printable semiconductor elements
#782Optical element stack assemblies
#783Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#784Thin film light emitting diode
#785Light-emitting device
#786Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
#787Anisotropic conductive film including a reflective layer
#788Semiconductor device and an electronic device
#789Package support, fabrication method and LED package
#790Light emitting device and method of manufacturing the same
#791Light emitting device and method of fabricating the same
#792Semiconductor devices for integration with light emitting chips and modules thereof
#793Semiconductor device and method of forming embedded wafer level chip scale packages
#794Electronic device and method for producing an electronic device
#795Semiconductor device and a method of manufacturing thereof
#796Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
#797Spatially selective roughening of encapsulant to promote adhesion with functional structure
#798Method and apparatus for light diffusion
#799Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device
#800Display device
#801Semiconductor device comprising PN junction diode and schottky barrier diode
#802Heat sink for cooling of power semiconductor modules
#803Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB
#804Semiconductor device on glass substrate
#805Method and apparatus for transfer of semiconductor devices
#806Micro-transfer printable electronic component
#807Substrate for Optical Device
#808LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE COMPRISING SAME
#809Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#810Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#811Substrate free LED package
#812Display apparatus including a micro light-emitting diode
#813Electronic arrangement
#814Light emitting apparatus, illumination apparatus and display apparatus
#815Semiconductor device
#816Semiconductor device and method of forming interconnect substrate for FO-WLCSP
#817Light-emitting apparatus
#818Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#819Wafer level packaging of light emitting diodes (LEDs)
#820Mounting device
#821Method of producing optoelectronic component with integrated protection diode
#822Chip component
#823Methods for surface attachment of flipped active components
#824Thermally and electrically conductive adhesive composition
#825LED package with covered bonding wire
#826Light emitting device
#827Light-emitting diode and application therefor
#828Solvent for manufacture of self-assembled nano-scale LED electrode assembly and method for manufacturing self-assembled nano-scale LED electrode assembly by the same
#829Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
#830Wire bonded electronic devices to round wire
#831Integrated LED and LED driver units and methods for fabricating the same
#832Semiconductor device and method of controlling warpage in reconstituted wafer
#833Conductor pad for flexible circuits and flexible circuit incorporating the same
#834CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#835Semiconductor device and method of forming ultra high density embedded semiconductor die package
#836Semiconductor devices with integrated thin-film transistor circuitry
#837High yield substrate assembly
#838Carrier for an electrical component
#839Opto-electronic apparatus and manufacturing method thereof
#840Display device using semiconductor light emitting device and method for manufacturing
#841Micro device stabilization post
#842PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
#843Method of manufacturing light emitting device
#844Bonding wire for semiconductor package and semiconductor package including same
#845Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
#846Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#847Semiconductor devices for integration with light emitting chips and modules thereof
#848Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other
#849Apparatus and method for direct transfer of semiconductor devices
#850Thermal interface material with ion scavenger
#851Printing complex electronic circuits using a patterned hydrophobic layer
#852Semiconductor packages with an intermetallic layer
#853Semiconductor device and method of controlling warpage in reconstituted wafer
#854Semiconductor device and method of using a standardized carrier in semiconductor packaging
#855Semiconductor chip package having optical interface
#856Light emitting device mount, leadframe, and light emitting apparatus
#857Method for integrating a light emitting device
#858Method for forming complex electronic circuits by interconnecting groups of printed devices
#859Semiconductor device and package including solder bumps with strengthened intermetallic compound
#860Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
#861Flow passage member and semiconductor module
#862Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#863Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#864Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#865Interconnection structure, LED module and method
#866Display device
#867Method of manufacturing light emitting device including metal patterns and cut-out section
#868Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#869LED package, backlight unit and illumination device including same, and liquid crystal display including backlight unit
#870Light emitting diode
#871Light source, method of manufacturing the light source, and method of mounting the light source
#872System-level packaging structures
#873Fully molded miniaturized semiconductor module
#874Circuit board structure and method for manufacturing a circuit board structure
#875Method of processing wafer
#876Substrate with array of LEDs for backlighting a display device
#877Printable component structure with electrical contact
#878Semiconductor chip for protecting against electrostatic discharges
#879Low pressure sintering powder
#880Semiconductor device and method comprising redistribution layers
#881Method for manufacturing metal powder
#882Manufacturing method of a flip-chip light emitting diode package module
#883Integrated LED light-emitting device and fabrication method thereof
#884Display apparatus and manufacturing method thereof
#885Die-die stacking
#886WAFER CIRCUIT
#887Thermosetting resin composition, semiconductor device, and electrical/electronic component
#888Light emitting diode switch device and array
#889Micro device transfer head heater assembly and method of transferring a micro device
#890Semiconductor device comprising PN junction diode and Schottky barrier diode
#891Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#892Semiconductor device
#893Compliant micro device transfer head
#894Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
#895Electronic component and use thereof
#896Light emitting device and manufacturing method thereof
#897Optoelectronic component and method of producing an optoelectronic component
#898Light emitting diode chip
#899Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
#900Method for fabricating a semiconductor chip panel