212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
IC having a metal ring thereon for stress reduction
#302Semiconductor package and method of fabricating semiconductor package
#303Semiconductor device and method of manufacture
#304Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die
#305Land grid array patterns for modular electronics platforms and methods of performing the same
#306Method for processing a 3D integrated circuit and structure
#307Device and Method for UBM/RDL Routing
#308Bonding apparatus and method for using the same
#309Semiconductor components having conductive vias with aligned back side conductors
#310Methods for producing a 3D semiconductor memory device and structure
#3113D semiconductor device and structure with memory
#3123D semiconductor device and structure with memory
#3133D semiconductor device and structure with NAND logic
#3143D semiconductor memory device and structure
#315Stacked-die bulk acoustic wave oscillator package
#3163D device and devices with bonding
#317Sawing underfill in packaging processes
#318Through-Substrate Vias with Improved Connections
#319Semiconductor device with contact pad and method of making
#320Shielded gate trench MOSFET integrated with super barrier rectifier
#321Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof
#322Thin bonded interposer package
#323Switched power stage with integrated passive components
#324Finger pad leadframe
#325Chemically-sensitive sensor array device
#326Low warpage high density trench capacitor
#3273D integrated circuit device and structure with hybrid bonding
#328Modules incorporating encapsulation layers
#329Ball grid array current meter with a current sense wire
#330Multi-chip semiconductor package
#331INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
#332Electronic package for integrated circuits and related methods
#333Semiconductor device and fabricating method thereof
#334SEMICONDUCTOR INTEGRATED CIRCUIT AND RECEIVING DEVICE
#335Integrated circuit device including support patterns and method of manufacturing the same
#336Chip package structure with integrated device integrated beneath the semiconductor chip
#337Semiconductor device with sealed semiconductor chip
#338Integrated circuit device having redistribution pattern
#339Semiconductor die, semiconductor wafer, semiconductor device including the semiconductor die and method of manufacturing the semiconductor device
#340Single-package wireless communication device
#341Sawing underfill in packaging processes
#342Method and system for verifying integrated circuit stack having photonic device
#343Semiconductor device packages including an inductor and a capacitor
#344Electronic module
#345Stacking integrated circuits containing serializer and deserializer blocks using through
#346Capacitive coupling in a direct-bonded interface for microelectronic devices
#347Multi-chip package with partial integrated heat spreader
#348Pad structure for front side illuminated image sensor
#349Light-emitting apparatus
#350Advanced info POP and method of forming thereof
#351Method of manufacturing insulating circuit board with heatsink
#352Semiconductor device with a semiconductor chip connected in a flip chip manner
#353Stacked semiconductor device assembly in computer system
#354Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#355Three-dimensional functional integration
#356Semiconductor device and a method of manufacturing the same
#357Pad design for reliability enhancement in packages
#358Chip-on-film and display including the same
#359Structurally embedded and inhospitable environment systems having autonomous electrical power sources
#360Method of vertically vibrating a bonding arm
#361Hybrid computing module
#362Apparatus and method for securing components of an integrated circuit
#363Light-emitting package
#364Electromagnetic shields with bonding wires for sub-modules
#365THROUGH-SILICON VIAS AND DECOUPLING CAPACITANCE
#366Die-on-interposer assembly with dam structure and method of manufacturing the same
#367Interconnect structure
#368Semiconductor device, manufacturing method thereof, and electronic apparatus
#3693D integrated circuit
#370Multi-chip modules including stacked semiconductor dice
#371Via structure for packaging and a method of forming
#372Package with tilted interface between device die and encapsulating material
#373Electrically testable integrated circuit packaging
#374Semiconductor memory device structure
#375Through-hole electrode substrate
#376Package device
#377Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#378Illumination apparatus
#379Method to form a 3D integrated circuit
#380Protective layer for contact pads in fan-out interconnect structure and method of forming same
#381Semiconductor die singulation and structures formed thereby
#382Display device having connection unit
#383Semiconductor device and a method of manufacturing the same
#384Through-silicon via with low-K dielectric liner
#385Receiver optical module and process of assembling the same
#386Package with UBM and methods of forming
#387Connecting electronic components to substrates
#388Thermal conductivity for integrated circuit packaging
#389Semiconductor substrate with integrated inductive component
#390Memory devices with controllers under memory packages and associated systems and methods
#391Alignment marks in substrate having through-substrate via (TSV)
#392Multi-die memory device
#393Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#394Method for fabricating a semiconductor and semiconductor package
#395Non-vertical through-via in package
#396Integrated Circuit Package Including Miniature Antenna
#397Package-on-package (PoP) semiconductor package and electronic system including the same
#398Package structures and methods of forming
#399Package structures and methods of forming the same
#400Flip chip package utilizing trace bump trace interconnection
#401Method and apparatus for heat sinking high frequency IC with absorbing material
#402Electronic device having inverted lead pins
#403Integrated circuit including standard cell
#404Build-up package for integrated circuit devices, and methods of making same
#405Carrier structure and carrier device
#406Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#407Integrated circuit device and electronic device
#408Embedded semiconductive chips in reconstituted wafers, and systems containing same
#409Semiconductor device
#410Method of making a stacked inductor-electronic package
#411Bonded semiconductor structures
#412Optical scrambler with nano-pyramids
#413Batch manufacture of component carriers
#414Method of producing a substrate and system for producing a substrate
#415Semiconductor device having electrode pads arranged between groups of external electrodes
#416Method of manufacturing an electronic device
#417PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#418Microelectronic assembly from processed substrate
#419Semiconductor device and a method of manufacturing the same
#420Hexagonally arranged connection patterns for high-density device packaging
#421Planar integrated circuit package interconnects
#422Semiconductor device having an oscillator and an associated integrated circuit
#423Semiconductor package device and method of manufacturing the same
#424Memory system topologies including a memory die stack
#425Structurally embedded and inhospitable environment systems having autonomous electrical power sources
#426Micro device transfer head assembly
#427Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies
#428THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT ASSEMBLIES USING PHASE CHANGE MATERIALS
#429System and method to enhance reliability in connection with arrangements including circuits
#430High-performance integrated circuit packaging platform compatible with surface mount assembly
#431LEADFRAME FOR MULTICHIP DEVICES WITH THINNED DIE PAD PORTIONS
#432Leadframe die pad with partially-etched groove between through-hole slots
#433Semiconductor package with liquid metal conductors
#434Semiconductor device and a method of manufacturing the same
#435Electro-optical device and electronic apparatus
#436Liquid thermal interface material in electronic packaging
#437Dynamic biasing to mitigate electrical stress in integrated resistors
#438Method for bonding and interconnecting semiconductor chips
#439Fan-out electronic device
#440Semiconductor device and semiconductor module
#441Three dimensional integrated circuit
#442Apparatus and method for filling a ball grid array
#443POWER CONVERTER HAVING A CONDUCTIVE CLIP
#444Memory system topologies including a buffer device and an integrated circuit memory device
#445Hybrid computing module
#446Scalable High-Bandwidth Connectivity
#447Package on antenna package
#448Packaged semiconductor system having unidirectional connections to discrete components
#449Semiconductor device manufacturing method and semiconductor device
#450STACKED EMBEDDED PASSIVE SUBSTRATE STRUCTURE
#451Stacked chip package structure and manufacturing method thereof
#452INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
#453Stack frame for electrical connections and the method to fabricate thereof
#454Semiconductor device package including embedded conductive elements
#455Integrated circuit and electronic circuit comprising the same
#456INTEGRATED CIRCUIT CHIP PACKAGING
#457INTEGRATED CIRCUIT CHIP PACKAGING
#458High-frequency module
#459Package module
#460High density substrate and stacked silicon package assembly having the same
#461Semiconductor device and process for fabricating the same
#462METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULES WITH BALL GRID ARRAYS
#463Semiconductor package device and method of manufacturing the same
#464Methods and apparatus for scribe seal structures
#465Semiconductor device with contact pad
#466Stacked-die bulk acoustic wave oscillator package
#467System on integrated chips and methods of forming same
#468Light engine based on silicon photonics TSV interposer
#469Through-hole electrode substrate
#470System and method for physically detecting counterfeit electronics
#471Semiconductor device and method of manufacture
#472Systems and methods for depopulating pins from contactor test sockets for packaged semiconductor devices
#473Oscillator, electronic apparatus and vehicle
#474Optical transceiver and manufacturing method thereof
#475Power electronic assemblies with high purity aluminum plated substrates
#476Protrusion bump pads for bond-on-trace processing
#477Land grid array patterns for modular electronics platforms and methods of performing the same
#478Stacked semiconductor device
#479Method for measuring analytes using large scale chemfet arrays
#480Semiconductor device and bump formation process
#481Electronic device
#482Packages and methods of forming packages
#483Stacking integrated circuits containing serializer and deserializer blocks using through via
#484Semiconductor device
#485Multi-chip modules formed using wafer-level processing of a reconstituted wafer
#486DIE WITH BUMPER FOR SOLDER JOINT RELIABILITY
#487Package system for integrated circuits
#488Stacked semiconductor device assembly in computer system
#489Single-package wireless communication device
#490Semiconductor device and method of forming a semiconductor device
#491Semiconductor device
#492Process for molding a back side wafer singulation guide
#493Semiconductor device with a semiconductor chip connected in a flip chip manner
#494Redistribution metal and under bump metal interconnect structures and method
#495Semiconductor device
#496Electric power conversion apparatus
#497Anti-fuse with reduced programming voltage
#498Light-emitting package
#499Stacked semiconductor system having interposer of half-etched and molded sheet metal
#500Pattern decomposition lithography techniques
#501Package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure
#502Integrated circuit packages and methods for forming the same
#503Impedance controlled electrical interconnection employing meta-materials
#504Dummy metal with zigzagged edges
#505Fabrication of solder balls with injection molded solder
#506Semiconductor device with conductive shielding structure
#507Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#508Semiconductor device
#509Integrated circuit (IC) structure for high performance and functional density
#510Via structure for packaging and a method of forming
#511Semiconductor device and method of manufacturing the same
#512Integrated circuit package and method of forming same
#513Post passivation interconnect
#514Shielded fan-out packaged semiconductor device and method of manufacturing
#515System and method for a transducer in an EWLB package
#516VISIBLE LIGHT COMMUNICATION FOR MOBILE DEVICES
#517Multi-chip detector appratus
#518Thermal and stress isolation for precision circuit
#519Integrated circuit (IC) structure for high performance and functional density
#520Serially connected computing nodes in a distributed computing system
#521Connected plane stiffener within integrated circuit chip carrier
#522Semiconductor package mounted substrate
#523Semiconductor device
#524Die-on-interposer assembly with dam structure and method of manufacturing the same
#525PACKAGED INTEGRATED CIRCUIT
#526Electronic component package
#527Embedded 3D interposer structure
#528Integrated circuit package including miniature antenna
#529Wafer level integration of passive devices
#530Inductor structure for integrated circuit
#531Inductor structure for integrated circuit
#532Substrate with embedded stacked through-silicon via die
#533Multi-branch terminal for integrated circuit (IC) package
#534Method for fabricating a row of MOS transistors
#535Hybrid nanosilver/liquid metal ink composition and uses thereof
#536Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#537Method for fabricating a semiconductor and semiconductor package
#538Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#539Non-embedded silicon bridge chip for multi-chip module
#540Illumination apparatus
#541Inverted leads for packaged isolation devices
#542Methods and devices for fabricating and assembling printable semiconductor elements
#543Semiconductor device packages, packaging methods, and packaged semiconductor devices
#544Methods for improved die bonding
#545Implementing transient electronic circuits for security applications
#546Electric magnetic shielding structure in packages
#547Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#548Underfill control structures and method
#549Apparatus and method for securing components of an integrated circuit
#550Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#551Device and method for UBM/RDL routing
#552Light emitting device and method of manufacturing the same
#553Electronic device package
#554Wiring structure of glass substrate, glass substrate and display device
#555Packaging layer inductor
#556Wireless communication with dielectric medium
#557Semiconductor device, manufacturing method thereof, and electronic apparatus
#558Memories and memory components with interconnected and redundant data interfaces
#559Display device
#560Hybrid bonding with uniform pattern density
#561Shielded electronic component package
#562Back side metallization
#563Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#5643D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
#565Method for packaging circuits
#566Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#567Integrated assemblies and methods of forming integrated assemblies
#568Protection of integrated circuits
#569Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
#570Implementation module for stacked connection between isolated circuit components and the circuit thereof
#571Integrated circuit structure
#572Thin bonded interposer package
#573Implementing transient electronic circuits for security applications
#574Semiconductor device
#575Double-sided hermetic multichip module
#576Multiple underfills for flip chip packages
#577Method of room temperature covalent bonding
#578METHOD OF ROOM TEMPERATURE COVALENT BONDING
#579Stacked-die bulk acoustic wave oscillator package
#580Method, apparatus and system to interconnect packaged integrated circuit dies
#581Bi-layer prepreg for reduced dielectric thickness
#582Multilayer pillar for reduced stress interconnect and method of making same
#583Multilayer pillar for reduced stress interconnect and method of making same
#584Through-substrate vias with improved connections
#585System and method to enhance solder joint reliability
#586Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit
#587Stacked semiconductor packages
#588Semiconductor memory device structure
#589Spot-solderable leads for semiconductor device packages
#590Ilumination apparatus
#591Illumination apparatus
#592Illumination apparatus
#593Illumination apparatus
#594Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package
#595Multi-chip semiconductor package
#596Carrier and integrated memory
#597Carrier and integrated memory
#598Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#599Heterogeneous miniaturization platform
#6003D IC package with RDL interposer and related method