212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Ultra-thin multichip power devices
#602Packaging for integrated circuits
#603Proximity coupling interconnect packaging systems and methods
#6043D integrated circuit (3DIC) structure
#605Flip chip package utilizing trace bump trace interconnection
#606Electronic device having inverted lead pins
#607Semiconductor device with sealed semiconductor chip
#608Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#609Semiconductor package and method of fabricating semiconductor package
#610RIBBON WIRE BOND
#611Magnetically coupled galvanically isolated communication using lead frame
#612Grid array connection device and method
#613Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#614Integrated circuit (IC) devices with varying diameter via layer
#615Integrated circuit including standard cell
#616Power converter having a conductive clip
#617Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
#618Computer modules with small thicknesses and associated methods of manufacturing
#619Microelectronic die stack having at least one rotated microelectronic die
#620MICROELECTRONIC DEVICE STACK HAVING A GROUND SHIELDING LAYER
#621SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
#622Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
#623Device and method for reworking flip chip components
#6243D chip testing through micro-C4 interface
#625Scalable phased array package
#626Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier
#627Package structures and methods of forming the same
#628Multipart lid for a semiconductor package with multiple components
#629Process system and operation method thereof
#630Memory system topologies including a buffer device and an integrated circuit memory device
#631Illumination apparatus
#632Metal additive structures on printed circuit boards
#633Back biasing of FD-SOI circuit blocks
#634Trace Design for Bump-on-Trace (BOT) Assembly
#635Package with UBM and methods of forming
#636Bond structures and the methods of forming the same
#637Methods of manufacturing an integrated circuit having stress tuning layer
#638Packaged semiconductor components having substantially rigid support members
#639Method for transferring micro device
#640Method for transferring micro device
#641Light emitting device and method of manufacturing the same
#642Low warpage high density trench capacitor
#643SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#644Semiconductor Devices and Methods of Manufacture Thereof
#645Integrated circuit with backside structures to reduce substrate warp
#646Semiconductor packages
#647Semiconductor device
#6483D semiconductor device
#649Method of forming a dummy die of an integrated circuit having an embedded annular structure
#650SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
#6513D IC package with RDL interposer and related method
#652Semiconductor systems having dual leadframes
#653Integrated circuit (IC) package with a solder receiving area and associated methods
#654Fan-out sensor package
#655Structurally embedded and inhospitable environment systems having autonomous electrical power sources
#656Semiconductor device
#657Method and system for bonding a chip to a substrate
#658Bond pads with surrounding fill lines
#659Semiconductor chips and semiconductor packages including the same
#660FAN-OUT SEMICONDUCTOR PACKAGE
#661Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#662Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
#663Semiconductor device
#664Thermal interface materials with adhesive selant for electronic components
#665Multi-die memory device
#666Package with solder regions aligned to recesses
#667Magnetic shielding package structure for MRAM device and method for producing the same
#668SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS
#669Methods for bump planarity control
#670Semiconductor package having a metal barrier
#671Integrated circuit package with partitioning based on environmental sensitivity
#672Semiconductor package
#673System and method of assembling a system
#674INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
#675Integrated circuit packages with wettable flanks and methods of manufacturing the same
#676Chip-on-film and display including the same
#677COMPONENT FORMING MACHINE WITH JAMMED COMPONENT MITIGATION
#678Thermal conductivity for integrated circuit packaging
#679Bonding apparatus and method for using the same
#680Designs and methods for conductive bumps
#681Location displacement detection method, location displacement detection device, and display device
#682Trace/via hybrid structure and method of manufacture
#683Trace/via hybrid structure and method of manufacture
#684Laser-releasable bonding materials for 3-D IC applications
#685Solder material
#686Low stress integrated circuit package
#687Fan-out semiconductor package
#688Process for fabricating circuit components in matrix batches
#689Mainboard assembly including a package overlying a die directly attached to the mainboard
#690Display device including a reinforcing member
#691Method and system for electronic devices with polycrystalline substrate structure interposer
#692Selective recess
#693Package with support structure
#694Electronic package and method for fabricating the same
#695Semiconductor device and a method of manufacturing the same
#696Crack sensor for sensing cracks in a solder pad, and method for production quality control
#697PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#698Through-hole electrode substrate
#699Integrated circuit package substrate
#700Semiconductor device and method of manufacture
#701Semiconductor device package and method for manufacturing the same
#702Electronic package for integrated circuits and related methods
#703Non-embedded silicon bridge chip for multi-chip module
#704Method for forming interconnect structure
#705Light emitting device and method of manufacturing the same
#706Interconnect structure with redundant electrical connectors and associated systems and methods
#707Semifinished product and component carrier
#708Multilayer pillar for reduced stress interconnect and method of making same
#709Systems and methods for electromagnetic interference shielding
#710Semiconductor structure capable of improving row hammer effect in dynamic random access memory and fabrication method thereof
#711Integrated circuit package mold assembly
#712Multi-chip modules formed using wafer-level processing of a reconstituted wafer
#713Semiconductor device assemblies with molded support substrates
#714Element place on laminates
#715Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#716System and method for a transducer in an eWLB package
#717METHOD FOR PRODUCING A 3D MEMORY DEVICE
#7183D IC method and device
#719Threshold voltage tuning for fin-based integrated circuit device
#720Electronic device
#721Package-on-package (PoP) semiconductor package and electronic system including the same
#722Wireless module with antenna package and cap package
#723Packaged semiconductor system having unidirectional connections to discrete components
#724PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
#725Temporary bonding scheme
#7263D SEMICONDUCTOR DEVICE AND SYSTEM
#727Semiconductor package device and method of manufacturing the same
#728Receiver optical module and process of assembling the same
#729Chip package assembly with enhanced interconnects and method for fabricating the same
#730Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#731Alignment marks in substrate having through-substrate via (TSV)
#732Acoustic management in integrated circuit using phononic bandgap structure
#733Optical-semiconductor device including a wavelength converting member and method for manufacturing the same
#734Redistribution metal and under bump metal interconnect structures and method
#735Power distribution network of integrated circuit
#736Protrusion bump pads for bond-on-trace processing
#737Dummy metal with zigzagged edges
#738Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof
#739Semiconductor device and process for fabricating the same
#740Package with tilted interface between device die and encapsulating material
#741Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#742Semiconductor integrated circuit device
#743Packages and methods of forming packages
#744Capacitive coupling in a direct-bonded interface for microelectronic devices
#745ROOM TEMPERATURE METAL DIRECT BONDING
#746Double layer release temporary bond and debond processes and systems
#747METHOD OF FORMING INTEGRATED MODULE
#748Inverted leads for packaged isolation devices
#749Integrated circuit package assemblies including a chip recess
#750Method and apparatus for heat sinking high frequency IC with absorbing material
#751Methods of processing semiconductor devices
#752Electronic devices having tapered edge walls
#753Molded air cavity packages and methods for the production thereof
#7543D SEMICONDUCTOR DEVICE AND SYSTEM
#755Methods of forming joint structures for surface mount packages
#756Package with UBM and methods of forming
#757Electronic device packages with attenuated electromagnetic interference signals
#758INTEGRATED EMBEDDED SUBSTRATE AND SOCKET
#759Shielding in electronic assemblies
#760Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#761Micro device transfer head heater assembly and method of transferring a micro device
#762Anisotropic conductive film with conductive particles forming repeating units of polygons
#763Integrated circuit packages
#764Semiconductor device and manufacturing method thereof
#765System and method to enhance solder joint reliability
#766Electrically testable integrated circuit packaging
#767Laminated interposers and packages with embedded trace interconnects
#768Micro-transfer printable electronic component
#769Method of manufacturing a semiconductor device
#770Via structure for packaging and a method of forming
#771Multichip modules and methods of fabrication
#772Packaged integrated circuit having stacked die and method for therefor
#773Method for forming semiconductor device structure with conductive shielding structure
#774Semiconductor device and a method of manufacturing the same
#775Recessed and embedded die coreless package
#776Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#777High density multi-component packages
#778Electrical connection structure, semiconductor package and method of forming the same
#779Chip packaging apparatus and method thereof
#780Microelectronics package with self-aligned stacked-die assembly
#7813D SEMICONDUCTOR DEVICE AND SYSTEM
#782Methods for producing packaged semiconductor devices
#783Stacked semiconductor device assembly in computer system
#784Integrated semiconductor assemblies and methods of manufacturing the same
#785Radar module with wafer level package and underfill
#786Molded intelligent power module and method of making the same
#787Die-on-interposer assembly with dam structure and method of manufacturing the same
#788Non-vertical through-via in package
#7893D SEMICONDUCTOR DEVICE AND SYSTEM
#790Semiconductor package and method of fabricating semiconductor package
#791Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle
#792Chip on glass package assembly
#793Redistribution layer structure of semiconductor package
#7943D SEMICONDUCTOR DEVICE AND SYSTEM
#795Placing ultra-small or ultra-thin discrete components
#796INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND PLANE
#797Semiconductor device and manufacturing method thereof
#798Fan-out wafer level multilayer wiring package structure
#799Semiconductor package device and method of manufacturing the same
#800Semiconductor device having electrode pads arranged between groups of external electrodes
#801Molded air cavity packages and methods for the production thereof
#802PHYSICAL QUANTITY SENSOR, COMPLEX SENSOR, INERTIAL MEASUREMENT UNIT, PORTABLE ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND VEHICLE
#803Semiconductor package having a variable redistribution layer thickness
#804Semiconductor device and method for manufacturing the same
#805Flip chip self-alignment features for substrate and leadframe applications
#806Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#807Magnetic sensor testing device
#808Semiconductor device
#809Semiconductor device and a corresponding method of manufacturing semiconductor devices
#810Shielded fan-out packaged semiconductor device and method of manufacturing
#811Antenna module and manufacturing method thereof
#812System on integrated chips and methods of forming same
#813Semiconductor device
#814A 3D SEMICONDUCTOR DEVICE AND SYSTEM
#815Anisotropic conductive film
#816Anti-fuse with reduced programming voltage
#817Method, apparatus and system to interconnect packaged integrated circuit dies
#818Methods of fluxless micro-piercing of solder balls, and resulting devices
#819Semiconductor device including a buffer layer structure for reducing stress
#820Chemically-sensitive sensor array calibration circuitry
#821Non-destructive testing of integrated circuit chips
#822NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
#823Semiconductor device and semiconductor module
#824Package structures and methods of forming
#825Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#8263D SEMICONDUCTOR DEVICE AND SYSTEM
#8273D semiconductor device and structure
#828Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure
#829Conductive wire through-mold connection apparatus and method
#830Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
#8313D integration method using SOI substrates and structures produced thereby
#832Die stack with cascade and vertical connections
#833Semiconductor device and method for manufacturing the same
#834Multi-chip modules formed using wafer-level processing of a reconstitute wafer
#835Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#836Wrapped signal shielding in a wafer fanout package
#837Electronic component packaged in component carrier serving as shielding cage
#838Detection of a suspect counterfeit part by chromatography
#839Microwave module
#840Switched-capacitor network packaged with load
#841Memory devices with controllers under memory packages and associated systems and methods
#842Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
#843Fan-out semiconductor device
#844Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#845Integrated circuit device with plating on lead interconnection point and method of forming the device
#846SYSTEM IN PACKAGE PROCESS FLOW
#8473D SEMICONDUCTOR DEVICE AND SYSTEM
#8483D SEMICONDUCTOR DEVICE AND SYSTEM
#8493D SEMICONDUCTOR DEVICE AND SYSTEM
#8503D SEMICONDUCTOR DEVICE AND SYSTEM
#851Method of manufacturing a semiconductor device including through silicon plugs
#852METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED
#853Multi-tier conductive circuits free of supporting substrate with intermediary devices on a plurality of tiers, detachable production platform for additive manufacturing, solder-dispensers and device-dispensers
#854Semiconductor structure and a method of making thereof
#855Methods of packaging semiconductor devices and packaged semiconductor devices
#856Microelectronic devices and methods for filling vias in microelectronic devices
#8573D integration method using SOI substrates and structures produced thereby
#858Methods and apparatus for measuring analytes using large scale FET arrays
#859Integrated circuit package including miniature antenna
#860Backside isolation for integrated circuit
#861Pad structure for front side illuminated image sensor
#862Proximity coupling interconnect packaging systems and methods
#863Method of fabricating a semiconductor package
#864Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices
#8653D chip sharing data bus
#866Microprocessor package with first level die bump ground webbing structure
#867InFO coil structure and methods of manufacturing same
#868Semiconductor die singulation and structures formed thereby
#869Electro-optic device with multiple photonic layers and related methods
#870Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus
#871Semiconductor die with back-side integrated inductive component
#872Wafer level packaging method
#873Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
#874Connection pads for low cross-talk vertical wirebonds
#875Protrusion bump pads for bond-on-trace processing
#876Projection display system
#877INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#878Circuitized substrate with electronic components mounted on transversal portion thereof
#879Circuitized substrate with electronic components mounted on transversal portion thereof
#8803D integration method using SOI substrates and structures produced thereby
#881Method for forming chip package structure with adhesive layer
#882ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#883Oxidation resistant barrier metal process for semiconductor devices
#884Integrated circuit packages and methods for forming the same
#885Electronic component mounting board, electronic device, and electronic module
#886Systems and methods for improved delamination characteristics in a semiconductor package
#887Semiconductor device
#888Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#889Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#890Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#8913D semiconductor device and system
#892Embedded 3D interposer structure
#893Semiconductor device packages, packaging methods, and packaged semiconductor devices
#894Monolithic decoupling capacitor between solder bumps
#895Methods of interconnect for high density 2.5D and 3D integration
#896Fan-out semiconductor package including electromagnetic interference shielding layer
#897Method for fabricating a row of MOS transistors
#898Semiconductor structure capable of improving row hammer effect in dynamic random access memory and fabrication method thereof
#899Electronic device with embedded electronic component
#900Wireless communications with dielectric medium