Top layers of metal for high performance IC's

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor device and method of manufacturing semiconductor device

Method of preparing detectors for oxide bonding to readout integrated chips

Structure and method for stacked wafer fabrication

Semiconductor device and a manufacturing method of the same

Image forming apparatus, chip, and chip package

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Integrated circuit package

Bond pad array for complex IC

Microarray package with plated contact pedestals

Integrated circuit package system with encapsulation lock and method of manufacture thereof

Mold and substrate for use with mold

Cooling channels in 3DIC stacks

Sensor packages including a lead frame and moulding body and methods of manufacturing

Semiconductor body and method for the design of a semiconductor body with a connecting line

Semiconductor device

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor test pad structures

Electrical microfilament to circuit interface

Adhesive film, connecting method, and joined structure

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Semiconductor device and a manufacturing method of the same

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Manufacturing method for semiconductor device embedded substrate

Integrated circuit package formation

Methods for securing semiconductor devices using elongated fasteners

Semiconductor memory device

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Inner-connecting structure of lead frame and its connecting method

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES

Method for manufacturing an electronic device

Molded memory card with write protection switch assembly

Semiconductor body and method for voltage regulation

Conductive paths for transmitting an electrical signal through an electrical connector

Stacked integrated circuit packages that include monolithic conductive vias

Semiconductor device including a reduced stress configuration for metal pillars

Chip structure and chip package structure

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

High bandwidth package

SEMICONDUCTOR DEVICE

Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained

Flip chip with interposer

Semiconductor device and method of manufacturing the same

Semiconductor packing having offset stack structure

Wafer-level chip-on-chip package, package on package, and methods of manufacturing the same

Semiconductor device including semiconductor chip mounted on lead frame

Pre-molded, clip-bonded multi-die semiconductor package

Chip package and manufacturing method thereof

Virtual IC wafers and bonding of constitutent IC films

SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT

Semiconductor device and manufacturing method thereof

Semiconductor device

Method of manufacturing a multilayer printed wiring board

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

Single-layer component package

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

Anisotropic conductive material, connected structure, and production method thereof

LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

High frequency module for filling level measurements in the W-band

Semiconductor device

Electronic circuit for controlling a power field effect transistor

Semiconductor package system with cavity substrate and manufacturing method therefor

Hybrid Semiconductor Chip Package

Semiconductor device and method of forming double-sided through vias in saw streets

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

Semiconductor package and manufacturing method thereof

SHRINK PACKAGE ON BOARD

POWER MODULE AND INVERTER FOR VEHICLES

SEMICONDUCTOR MULTI-CHIP PACKAGE

Semiconductor package including a plurality of stacked semiconductor devices

Semiconductor device

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Semiconductor device

Integrated circuit packages incorporating an inductor and methods

Semiconductor device and passive component integration in a semiconductor package

Test structure for charged particle beam inspection and method for fabricating the same

APPLICATION OF A SELF-ASSEMBLED MONOLAYER AS AN OXIDE INHIBITOR

Manufacturing method for protection circuit module of secondary battery

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

Method for manufacturing antenna and method for manufacturing semiconductor device

Solder joint flip chip interconnection having relief structure

Mitigation of plating stub resonance by controlling surface roughness

MAGNETIC INSULATOR NANOLAMINATE DEVICE FOR INTEGRATED SILICON VOLTAGE REGULATORS

Process for spontaneous deposition from an organic solution

Enhanced power distribution in an integrated circuit

Assembling stacked substrates that can form 3-D structures

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Electric power semiconductor device

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Semiconductor device and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Cut-out heat slug for integrated circuit device packaging

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Thermally improved semiconductor QFN/SON package

Semiconductor integrated circuit device

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Semiconductor package with embedded spiral inductor

Methods of forming fine patterns in integrated circuit devices

Adhesive film, connecting method, and joined structure

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Flexible circuit assemblies without solder and methods for their manufacture

Microelectronic contact structure

Manufacturing method of semiconductor device comprising silicide layer with varied thickness

Electronic device and method for fabricating the same

Bonding apparatus and bonding method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE

Multi-die memory device

PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

CMOS RF IC

Pad structure of semiconductor integrated circuit apparatus

Multi-chip package system incorporating an internal stacking module with support protrusions

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device with improved resin configuration

Semiconductor device

Packaging systems and methods

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Manufacturing method of semiconductor device and semiconductor device

Bonding process for CMOS image sensor

Semiconductor integrated circuit device

METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE

Forming solder balls on substrates

Bonding apparatus and bonding method

METHOD AND APPARATUS FOR WAFER BONDING

LITHOGRAPHIC CONTACT ELEMENTS

Module having a stacked passive element and method of forming the same

Mounting method using dilatancy fluid

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Dual or multiple row package

Semiconductor Chip Package System Vertical Interconnect

Module having a stacked passive element and method of forming the same

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

Transfer tape strap process

Multilayer circuit board and method for manufacturing the same

Double-sided connector with protrusions

Method of forming a package with exposed component surfaces

Method of assembling integrated circuit components

Underfill process and materials for singulated heat spreader stiffener for thin core panel processing

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESS

Adhesive tape and semiconductor device using the same

Integrated circuit package system with mounting structure

Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device

Electronic device and method of manufacturing same

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE

Method and core materials for semiconductor packaging

Chip package structure and fabricating method thereof

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Microelectronic package with carbon nanotubes interconnect and method of making same

Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof

System and method for pre-patterned embedded chip build-up

Semiconductor device

Stacked die semiconductor device having circuit tape

Semiconductor device assemblies, electronic devices including the same and assembly methods

Semiconductor package system with through silicon via interposer

PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

On-chip RF shields with front side redistribution lines

Packaging technology

Lock and key through-via method for wafer level 3 D integration and structures produced

Integrated circuit module with integrated passive device

Circuit device

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Glass thick film embedded passive material

Universal bump array structure

Wiring board with built-in electronic component and method for manufacturing the same

Printed circuit board including electronic component embedded therein and method of manufacturing the same

Printed circuit board for harsh environments

Method of forming assymetrical encapsulant bead

METHOD OF REDUCING VOIDS IN ENCAPSULANT

METHOD OF REDUCING VOIDS IN ENCAPSULANT

Method and apparatus for fabricating self-assembling microstructures

Method of forming semiconductor package

Low cost die-to-wafer alignment/bond for 3d IC stacking

Thermal barrier layer for integrated circuit manufacture

METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD

Method of controlling satellite drops from an encapsulant jetter

Minimizing plating stub reflections in a chip package using capacitance

LASER ABLATION TO CREATE POCKET FOR DIE PLACEMENT

Protecting sidewalls of semiconductor chips using insulation films

Bond pad structure having dummy plugs and/or patterns formed therearound

Integrated circuit package system with adhesive segment spacer

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

Wafer level packaged MEMS integrated circuit

Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die

Method of manufacturing an electronic system

High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof

Inkjet printed leadframe

Process for precision placement of integrated circuit overcoat material

Stacking package structure with chip embedded inside and die having through silicon via and method of the same

Semiconductor package with a controlled impedance bus and method of forming same

Stacked integrated circuit package using a window substrate

Semiconductor device and manufacturing method of a semiconductor device

FINE-PITCH OBLONG SOLDER CONNECTIONS FOR STACKING MULTI-CHIP PACKAGES

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Integrated circuit package system for stackable devices

Integrated circuit packaging system having planar interconnect

Low cost die placement

Semiconductor package and method for manufacturing the same

Integrated circuit package system with anti-peel contact pads

Semiconductor package system with die support pad

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Quad flat pack in quad flat pack integrated circuit package system

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

ULTRA-THIN OXIDE BONDING FOR SI TO SI DUAL ORIENTATION BONDING

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Package substrate and light emitting device using the same

LOW COST FLEXIBLE DISPLAY SHEET

Semiconductor device

Tack adhesion testing device

Method and apparatus for forming planar alloy deposits on a substrate

Electronic component mounting structure

PACKAGE AND SUBSTRATE STRUCTURE WITH AT LEAST ONE ALIGNMENT PATTERN

Solvent softening to allow die placement

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

Transfer method of adhesive film

Low cost die release wafer

System and method for packaged memory

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and a method of manufacturing the same

FABRICATION METHOD OF OPTICAL MODULE AND OPTICAL MODULE USING THE SAME METHOD

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Flexible electronic device and flexible display device

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Integrated circuit device

Solder joint flip chip interconnection

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Electronic device and method of manufacturing same

Resin sheet, circuit device and method of manufacturing the same

PACKAGING STRUCTURE, PACKAGING METHOD AND PHOTOSENSITIVE DEVICE

Integrated circuit devices with stacked package interposers

Bond pad structures and semiconductor devices using the same

Stacked Semiconductor Chips with Through Substrate Vias

Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias

Semiconductor device and method of forming high-frequency circuit structure and method thereof

Process for making contact with and housing integrated circuits

Electronic component mounting apparatus and electronic component mounting method

Printed wiring board

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER

Anisotropic conductive film, joined structure and method for producing the joined structure

Self assembly of elements for displays

Multilayer printed wiring board

Low temperature curing acrylate and maleimide based formulations and methods for use thereof

Method of manufacturing a semiconductor device

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Method of fabicating a microelectronic die having a curved surface

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Multi layer low cost cavity substrate fabrication for PoP packages

Method of manufacturing a stacked die module

Mainboard assembly including a package overlying a die directly attached to the mainboard

LED display utilizing freestanding epitaxial LEDs

Semiconductor integrated circuit device and test terminal arrangement method

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAME

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF DISPLAY DEVICE, SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT

Carrier structure of SoC with custom interface

Integrated circuit package system with redistribution layer

Leadless semiconductor chip carrier system

METHOD OF FORMING BALL BOND

Semiconductor device with signal wirings and dummy wirings that pass through under electrode pads and in which the number of dummy wirings near the peripheral portion of the device being greater than at a more centrally located portion

Power amplifier assembly

Semiconductor device

Ball grid array package stacking system

Systems and methods for enabling ESD protection on 3-D stacked devices

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Package with power and ground through via

Method of manufacturing a semiconductor device including etching to etch stop regions

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Method of fabricating a semiconductor device

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT

Optical-semiconductor device and method for manufacturing the same

Wire bonding method, wire bonding apparatus, and wire bonding control program

Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Dicing and die attach adhesive

METHOD FOR DECAPSULATING PACKAGE

Electrically conductive structure on a semiconductor substrate formed from printing