Integrated circuit package system with penetrable film adhesive

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Carbon nanotube-based conductive connections for integrated circuit devices

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit

Stacked solder balls for integrated circuit device packaging and assembly

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME

Integrated circuit package system with overhang film

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Integrated circuit package system with external interconnects within a die platform

Ball grid array package layout supporting many voltage splits and flexible split locations

Stack die packages

Stackable Semiconductor Package and Stack Method Thereof

Integrated circuit package system for stackable devices

STACKED DIE MOLDED LEADLESS PACKAGE

Leadframe having mold lock vent

Thermally enhanced molded leadless package

Package system for shielding semiconductor dies from electromagnetic interference

Optical leadless leadframe package

WAFER LEVEL PACKAGES FOR REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

SEMICONDUCTOR DEVICE

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

SEMICONDUCTOR PACKAGE

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS

Chipstack package and manufacturing method thereof

Method of manufacturing semiconductor package

Submount and method of manufacturing the same

High voltage isolation dual capacitor communication system

Semiconductor device with recessed registration marks partially covered and partially uncovered

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

Solder interconnect pads with current spreading layers

Flip chip device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Conductive structure for a semiconductor integrated circuit

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

System and method for integrated waveguide packaging

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Integrated circuit and method

QUAD FLAT NON-LEADED PACKAGE STRUCTURE

Flat leadless packages and stacked leadless package assemblies

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Integrated semiconductor device

Semiconductor device and a method of manufacturing the same

Method of manufacturing printed wiring board with built-in electronic component

Method of manufacturing printed wiring board with built-in electronic component

Enhanced Die-Up Ball Grid Array and Method for Making the Same

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Gap capacitors for monitoring stress in solder balls in flip chip technology

INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE

Flip chip bonded semiconductor device with shelf and method of manufacturing thereof

Semiconductor device

Semiconductor apparatus having a through-hole interconnection

Integrated circuit having wide power lines

Semiconductor device and method of manufacturing the same

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

3D smart power module

Semiconductor device and manufacturing method thereof

Multi-chip package

Integrated circuit package

Embedded die system and method

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

Circuit substrate having post-fed die side power supply connections

Method for manufacturing board with built-in electronic elements

Memory system topologies including a buffer device and an integrated circuit memory device

Method of fabricating chip package structure

Method and apparatus for manufacturing semiconductor device

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

Device mounting board and manufacturing method therefor, and semiconductor module

Device mounting board, and semiconductor module and manufacturing method therefor

System, apparatus, and method for advanced solder bumping

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Differential internally matched wire-bond interface

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Integrated Circuit and Memory Module

Bond pad structure

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Method for manufacturing a wafer level package

HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS

Semiconductor chip package and method for manufacturing thereof

Integrated circuit device and a method of making the integrated circuit device

DEPOPULATING INTEGRATED CIRCUIT PACKAGE BALL LOCATIONS TO ENABLE IMPROVED EDGE CLEARANCE IN SHIPPING TRAY

Panel level methods and systems for packaging integrated circuits with integrated heat sinks

Integrated circuit package system with internal stacking module adhesive

Semiconductor device having wiring line and manufacturing method thereof

Method for manufacturing a semiconductor device

Integrated module for data processing system

Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

Folded leadframe multiple die package

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Semiconductor device having antenna over thin film integrated circuit

SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, DESIGNING APPARATUS, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Bondwire design

Semiconductor device and manufacturing method thereof

Microelectronic devices and methods for forming interconnects in microelectronic devices

METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Electronic device and method of manufacturing same

Apparatus for improved power distribution in wirebond semiconductor packages

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

Semiconductor device

ELECTRONIC ELEMENT PACKAGING

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

High temperature operating package and circuit design

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Multi-chip module

ANGLED FLYING LEAD WIRE BONDING PROCESS

Methods and systems for packaging integrated circuits

Integrated circuit package system with wafer scale heat slug

Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same

Electronic Circuit Package

Method of manufacturing semiconductor device

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Ultra-Thin Semiconductor Package

Method of manufacturing electronic device on leadframe

Manufacturing process of semiconductor device and semiconductor device

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Multilayer wiring board with concave portion for accomodating electronic component

Bonding wire for semiconductor device

Block-Molded Semiconductor Device Singulation Methods and Systems

Method for manufacturing electronic device

Power semiconductor devices having integrated inductor

IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE

Semiconductor device packages and methods of fabricating the same

Semiconductor power device with bias circuit

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Flip chip interconnect solder mask

Wiring substrate, tape package having the same, and display device having the same

Resin-sealed semiconductor device

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Electromagnetic shilding structure and manufacture method for multi-chip package module

Method of forming a semiconductor package and structure thereof

High performance system-on-chip inductor using post passivation process

Package structure module with high density electrical connections and method for packaging the same

Laser annealing for 3-D chip integration

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Method of forming bonding pad opening

Alignment verification for C4NP solder transfer

Lamination device manufacturing method

MULTI-LAYER SUBSTRATE AND MANUFACTURE METHOD THEREOF

Semiconductor module

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

STACKED SEMICONDUCTOR APPARATUS, SYSTEM AND METHOD OF FABRICATION

Structure of embedded active components and manufacturing method thereof

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Packaging structure, method for manufacturing the same, and method for using the same

Integrated circuit package and fabricating method thereof

Local area semiconductor cooling system

Integrated circuit incorporating wire bond inductance

FLEXIBLE SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Integrated circuit package system with leadfinger support

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor component and method for producing the same

Removing material from defective opening in glass mold

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD

Silicon Carrier Including An Integrated Heater For Die Rework And Wafer Probe

Multiple access over proximity communication

Electric connector

Micropad formation for a semiconductor

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Removable layer manufacturing method

Method of manufacturing a semiconductor device

METHOD OF MANUFACTURING TRANSPONDER FOR WIRELESS CARD, METHOD OF MANUFACTURING WIRELESS CARD, WIRELESS CARD TRANSPONDER, AND WIRELESS CARD

High power integrated RF amplifier

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging

Semiconductor device

Semiconductor device and the method of manufacturing the same

SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES

Semiconductor device including electrically conductive bump and method of manufacturing the same

Three-dimensional stacked substrate arrangements

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Integrated circuit package system with heat slug

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Method and manufacture of silicon based package and devices manufactured thereby

Semiconductor device and programming method

Semiconductor module

Module with Flat Construction and Method for Placing Components

Semiconductor package and semiconductor device

Die package including substrate with molded device

Semiconductor package with an embedded printed circuit board and stacked die

Flexible contactless wire bonding structure and methodology for semiconductor device

Radio frequency over-molded leadframe package

ESD protection semiconductor device having an insulated-gate field-effect transistor

IC MODULE, IC INLET, AND IC MOUNTED BODY

Method of manufacturing semiconductor device

Adhesive composition and adhesive sheet

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Optimized circuit design layout for high performance ball grid array packages

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Directing the flow of underfill materials using magnetic particles

Integrated circuit device and method of producing

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

Pad in semicondcutor device and fabricating method thereof

RFID tags and processes for producing RFID tags

Compact inductive power electronics package

Circuit substrate, circuit device and manufacturing process thereof

Method for cutting and molding in small windows to fabricate semiconductor packages

Flip-chip package

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

Mountable integrated circuit package system with intra-stack encapsulation

Integrated circuit package with improved connections

Air-gap ILD with unlanded vias

ELECTRICAL BONDING PAD

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

METAL INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Method and system for providing an aligned semiconductor assembly

Semiconductor chip having conductive member for reducing localized voltage drop

Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device

METAL COVER ON FLIP-CHIP MATRIX-ARRAY (FCMX) SUBSTRATE FOR LOW COST CPU ASSEMBLY

Package substrate embedded with semiconductor component

Integrated circuit package system with interposer

Mountable integrated circuit package system with stacking interposer

System and apparatus for wafer level integration of components

Leadless package system having external contacts

Integrated circuit package system with lead locking structure

Integrated circuit package system with shielding

Leadframe design for QFN package with top terminal leads

Chipset package structure

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Semiconductor chip

Microball attachment using self-assembly for substrate bumping

Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure

Circuit board and process for producing the same

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Low profile wire bonded USB device

Electronic assembly manufacturing method

Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of forming a wafer level package

Electronic device and method of manufacturing thereof

Composition of a solder, and method of manufacturing a solder connection

Nanoscale metal paste for interconnect and method of use

Data storage and stackable configurations

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Compact power semiconductor package and method with stacked inductor and integrated circuit die

Surface-mount type crystal oscillator

Formation of a hybrid integrated circuit device

Flip-chip package and method of forming thereof

Integrated circuit package

Semiconductor device

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

Method of fabricating a power electronic device

Wafer level chip scale packaging

Managed Memory Component

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Package with multiple dies

Infrared proximity sensor package with reduced crosstalk

Integrated circuits with phase change devices

Forming solder balls on substrates

Low cost high frequency device package and methods

Electronic component manufacturing apparatus

Circuit arrangements and associated apparatus and methods

Terminal pad structures and methods of fabricating same

Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes

Integrated circuit package system with package integration

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of forming integrated passive device module

Multi-die wafer level packaging

Semiconductor device

Thermal enhanced low profile package structure and method for fabricating the same

ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

Method of manufacturing a printed wiring board

Wiring substrate and display device including the same

Method and system for a phased array antenna embedded in an integrated circuit package

Sensor module and method for manufacturing a sensor module

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP

Semiconductor package

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Semiconductor package having redistribution layer

Methods of fluxless micro-piercing of solder balls, and resulting devices

Method of forming stacked die package

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Methods and systems for packaging integrated circuits

Integrated circuit package system with interconnect lock