Integrated circuit packaging system with interposer

Integrated circuit package system with package integration

Mountable integrated circuit package system with mountable integrated circuit die

Semiconductor device

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Electronic device

Integrated circuit package system with offset stacking

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY

Electronic device including an inductor

Semiconductor apparatus

FABRICATING METHODS OF PHOTOELECTRIC DEVICES AND PACKAGE STRUCTURES THEREOF

Semiconductor device

Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

Thick metal interconnect with metal pad caps at selective sites and process for making the same

METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Method of fabricating semiconductor device having three-dimensional stacked structure

Manufacturing method of contact structure

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Method of manufacturing flexible semiconductor assemblies

Microelectronic imaging units

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY

Interconnection element with plated posts formed on mandrel

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Using coulomb forces to form 3-D reconfigurable antenna structures

Wire bonding personalization and discrete component attachment on wirebond pads

Fabricated adhesive microstructures for making an electrical connection

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Integrated circuit package-on-package stacking system and method of manufacture thereof

Top layers of metal for high performance IC's

Post passivation interconnection schemes on top of the IC chips

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

Semiconductor device thermal connection

Thermoset polyimides for microelectronic applications

DIRECT ATTACH INTERCONNECT FOR CONNECTING PACKAGE AND PRINTED CIRCUIT BOARD

Semiconductor package and method of forming similar structure for top and bottom bonding pads

SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Lead frame and semiconductor device provided with lead frame

Electronic device

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Secure connector grid array package

Dispensing solder for mounting semiconductor chips

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Method of fabricating an interconnection element having conductive posts

Method of printing electronic circuits

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Chip on wafer bonder

Method of manufacturing a semiconductor device

Method to build a wirebond probe card in a many at a time fashion

Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed

LCD Driver IC and Method for Manufacturing the Same

Wafer level package integration and method

Wafer level die integration and method

Flexible column die interconnects and structures including same

Pad structure to provide improved stress relief

Metal foil interconnection of electrical devices

Semiconductor device and method of making integrated passive devices

Soft error rate mitigation by interconnect structure

EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW

Holistic thermal management system for a semiconductor chip

COMBINATION SUBSTRATE

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT

Integrated circuit package-on-package system with anti-mold flash feature

Electronic device having profiled elements extending from planar surfaces

System and Method for Improving Reliability of Integrated Circuit Packages

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures

Dielectric isolation type semiconductor device and manufacturing method therefor

Semiconductor device with less power supply noise

Electronic tag chip

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Method of Forming Conductive Lines and Similar Features

Copper Clad Laminate for Chip on Film

Multi-die processor

Isolating chip-to-chip contact

Low fabrication cost, high performance, high reliability chip scale package

Method for making a device including placing a semiconductor chip on a substrate

Chip packaging process including simpification and mergence of burn-in test and high temperature test

FILM-LIKE ADHESIVE AND METHOD FOR CARRYING THE SAME

Electronic component with wire bonds in low modulus fill encapsulant

Flat Display Device

Wireless IC device and component for wireless IC device

Integrated circuit package having reversible ESD protection

Method for fabricating electrical bonding pads on a wafer

Method of producing multiple semiconductor devices

Integrated circuit packaging system with carrier and method of manufacture thereof

Integrated circuit with flexible planar leads

Adhesive on wire stacked semiconductor package

Semiconductor package and packaging method for balancing top and bottom mold flows from window

Semiconductor power device package having a lead frame-based integrated inductor

Leadframe based flash memory cards

Device and method including a soldering process

Electronic component module

Molded Sensor Package and Assembly Method

Solder ball attachment ring and method of use

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

Manufacture of a circuit board containing a component

Protected solder ball joints in wafer level chip-scale packaging

Stacked dual MOSFET package

Method for forming an electrical structure comprising multiple photosensitive materials

High-volume on-wafer heterogeneous packaging of optical interconnects

Multilayer printed wiring board

Circuit device and method of manufacturing the same

System for electronic components mounted on a circuit board

Stacked-die package for battery power management

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Integrated circuit package system with package substrate having corner contacts

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Semiconductor module

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION

INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF

Method and system for providing a reliable semiconductor assembly

Method and System for Providing a Low-Profile Semiconductor Assembly

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT

Package and Manufacturing Method for a Microelectronic Component

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Stacking die package structure for semiconductor devices and method of the same

Power device packages and methods of fabricating the same

Integrated circuit package system with insulator over circuitry

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package-in-package system with wire-in-film encapsulant

Multi-Terminal Package Assembly For Semiconductor Devices

Back to Back Die Assembly For Semiconductor Devices

Multilayer dielectric substrate and semiconductor package

Semiconductor chip device having through-silicon-via (TSV) and its fabrication method

Semiconductor device and manufacturing method thereof

Electrical device and method

Methods and apparatus for measuring analytes using large scale FET arrays

Optoelectronic device

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Apparatus and method for producing a bonding connection

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME

Flip chip mounting method and method for connecting substrates

MANUFACTURING METHOD OF LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE

Die-to-robot alignment for die-to-substrate bonding

Integrated circuit with intra-chip clock interface and methods for use therewith

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

Semiconductor device with bonding pad

Semiconductor device having through electrode and method of fabricating the same

Method of manufacturing semiconductor device

Low profile stacking system and method

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Semiconductor chip and semiconductor device including the same

Semiconductor device and method for manufacturing thereof

Bump structure formed from using removable mandrel

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device

Semiconductor device and a method of manufacturing the same

Chip structure and stacked structure of chips

Flexible interposer for stacking semiconductor chips and connecting same to substrate

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Integrated circuit package system with package integration

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Double-sided integrated circuit chips

Test structure

Radiation detector array

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Method for manufacturing a printed wiring board

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

Method for manufacturing circuit device

Manufacturing method of semiconductor integrated device with inverting plating cup

Electrostatic discharge (ESD) protection structure

Method of forming an inductor on a semiconductor wafer

Integrated transistor module and method of fabricating same

Flip chip mounting method and bump forming method

Method for micro component self-assembly

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Flip chip mounting method and method for connecting substrates

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Back end integrated WLCSP structure without aluminum pads

Mounting structure of electronic component

Electronic component

Electronic Circuit Package

Interposer and semiconductor device

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

Mountable integrated circuit package system with mounting interconnects

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and semiconductor device

Integrated circuit package system with array of external interconnects

High bond line thickness for semiconductor devices

Integrated circuit package with integrated heat sink

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Integrated circuit package

Reduction of package height in a stacked die configuration

Integrated circuit package system with dual connectivity

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIAS FOR HIGH CURRENT,HIGH FREQUENCY, AND HEAT DISSIPATION

Electronic device and method of manufacturing same

Method of making a wiring board having an engineered metallization layer

Apparatus for electrically coupling a semiconductor package to a printed circuit board

Methods for forming connective elements on integrated circuits for packaging applications

Wafer bonding method

Coated lead frame

Wafer-level chip scale package and method for fabricating and using the same

Modular chip integration techniques

Substrate anchor structure and method

Assembly comprising a functional device and a resonator and method of making same

RFID tag and manufacturing method thereof

DIE-ATTACH MATERIAL OVERFLOW CONTROL FOR DIE PROTECTION IN INTEGRATED CIRCUIT PACKAGES

Device with a plurality of semiconductor chips

Semiconductor device and method for manufacturing the same

Device including a semiconductor chip having a plurality of electrodes

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Chip structure

SELF-ASSEMBLED STRESS RELIEF INTERFACE

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device, PDP driver, and plasma display panel

Mountable integrated circuit package system with substrate having a conductor-free recess

Techniques for modular chip fabrication

Stacked package and method of manufacturing the same

Semiconductor package

SEMICONDUCTOR DEVICE

Apparatus and method configured to lower thermal stresses

SEMICONDUCTOR DEVICE AND ITS FABRICATION PROCESS

Direct-connect signaling system

Semiconductor device

Semiconductor structure and method of manufacture

Semiconductor Device And Method for Fabricating The Same

Solder Ball Placement Vacuum Tool

Method of packaging an LED array module

Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise

BUSINESS TO MEDIA TRANSACTION BUSINESS PROCESS

Semiconductor chip with coil element over passivation layer

Semiconductor package having increased resistance to electrostatic discharge

Apparatus and method of forming high performance integrated RF optical module

Power recovery circuit based on partial standing waves

Power Integrated Circuit with Bond-Wire Current Sense

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

Flip chip connection structure having powder-like conductive substance and method of producing the same

Self-Aligned Wafer Level Integration System

SEMICONDUCTOR DEVICE

Patterned Leads For WLCSP And Method For Fabricating The Same

Device including a housing for a semiconductor chip including leads extending into the housing

Package on package structure

Semiconductor packaging device

Packaged microchip with spacer for mitigating electrical leakage between components

Integrated circuit package

Integrated circuit package with etched leadframe for package-on-package interconnects

Semiconductor device

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Through-silicon vias and methods for forming the same

PACKAGED SEMICONDUCTOR ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Metallic laminate and method for preparing the same

Wiring terminal-connecting adhesive

Inductor formed in an integrated circuit

Methods for forming a through via

Method of forming metallic bump and seal for semiconductor device

Method of forming metallic bump on I/O pad

Integrated circuit package including wire bonds

Method of forming premolded lead frame

Electronic component module

Method and apparatus for high performance switch mode voltage regulators

Layout schemes and apparatus for high performance DC-DC output stage

SOI on package hypersensitive sensor

Integrated circuit underfill package system

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE HAVING THE SAME MOUNTED THEREON

Semiconductor device

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Thermally enhanced wafer level package

Semiconductor package, electronic part and electronic device

Package for a power semiconductor device

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Current distribution structure and method

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Multilayer pillar for reduced stress interconnect and method of making same

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Sprocket opening alignment process and apparatus for multilayer solder decal

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Roll-on encapsulation method for semiconductor packages

Die offset die to bonding

Circuit module and radio communications equipment, and method for manufacturing circuit module

Stack structure of circuit boards embedded with semiconductor chips

Circuit device

On-chip identification circuit incorporating pairs of conductors, each having an essentially random chance of being shorted together as a result of process variations