Semiconductor integrated circuit device and regulator using it

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

Method of fabricating a stacked type chip package structure

Semiconductor package having marking layer

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

Stable gold bump solder connections

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Memory Packages Having Stair Step Interconnection Layers

Partitioned Integrated Circuit Package with Central Clock Driver

I/O pad structures for integrated circuit devices

STACKABLE INTEGRATED CIRCUIT PACKAGE

Semiconductor device

Semiconductor device having grooved leads to confine solder wicking

Dual capillary IC wirebonding

Semiconductor package having a crack-propagation preventing unit

Semiconductor devices

Electroconductive particle placement sheet and anisotropic electroconductive film

Multilayer printed wiring board

Stacked semiconductor device and fabricating method thereof

Proximity communication package for processor, cache and memory

Forming method of electrode and manufacturing method of semiconductor device

Flip chip package with advanced electrical and thermal properties for high current designs

Method for thin semiconductor packages

Method for Manufacturing Microdevices or Integrated Circuits on Continuous Sheets

PLASMA DISPLAY APPARATUS

Circuit device

Reduced inductance interconnect for enhanced microwave and millimeter-wave systems

Integrated circuit package including miniature antenna

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

Die warpage control

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Semiconductor device

Semiconductor device with copper wirebond sites and methods of making same

Ball grid array substrate package and solder pad

Method for manufacturing an electronic component package and electronic component package

Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer

LOW LOSS RADIO FREQUENCY SIGNAL COMMUNICATION WITHIN A PACKAGE, A BOARD AND/OR A WAVE GUIDE

Integrated circuit package system with mold lock subassembly

Nanotube based vapor chamber for die level cooling

Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method

Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

Power semiconductor module

Semiconductor device and methods of manufacturing semiconductor devices

Integrated-circuit package for proximity communication

Integrated circuit package system with multiple die

Integrated circuit packaging system with base structure device

Integrated circuit package system with leadframe array

METHOD AND APPARATUS FOR PACKAGE-TO-BOARD IMPEDANCE MATCHING FOR HIGH SPEED INTEGRATED CIRCUITS

Glass cap molding package, manufacturing method thereof and camera module

Method for producing a matrix of individual electronic components and matrix produced thereby

Multi-layer board incorporating electronic component and method for producing the same

Electronic device

Chemical removal of oxide layer from chip pads

Method of applying encapsulant to wire bonds

Wire bond encapsulant application control

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Warpage control using a package carrier assembly

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

Method of adhering wire bond loops to reduce loop height

Method of wire bond encapsulation profiling

Method for forming BGA package with increased standoff height

Comb-shaped power bus bar assembly structure having integrated capacitors

Stackable self-aligning insulative guide tray for holding semiconductor substrates

Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure

Multi-wavelength light-emitting module

Integrated circuit support for low profile wire bond

MULTI-BAND TUNABLE RESONANT CIRCUIT

Local defect memories on semiconductor substrates in a stack computer

Method of testing using a temporary chip attach carrier

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Integrated circuit package system with multiple device units

Solder bump with inner core pillar in semiconductor package

Flip chip structure and method of manufacture

Stacked dual-die packages, methods of making, and systems incorporating said packages

Integrated circuit packaging system with interposer

Stacked semiconductor chips

Stacked semiconductor chips

Semiconductor device with conductive die attach material

Preventing breakage of long metal signal conductors on semiconductor substrates

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Stress relief structures for silicon interposers

Semiconductor package with passivation island for reducing stress on solder bumps

Semiconductor device and method of forming interconnect structure in non-active area of wafer

METHODS FOR ATTACHING A FLIP CHIP INTEGRATED CIRCUIT ASSEMBLY TO A SUBSTRATE

Method for stacking semiconductor chips

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Method and structure for dispensing chip underfill through an opening in the chip

Integrated semiconductor substrate structure using incompatible processes

Semiconductor substrate elastomeric stack

INTEGRATED CIRCUIT DEVICE

Large substrate structural vias

Air cavity package for flip-chip

Method of manufacturing integrated circuit package system with warp-free chip

Integrated circuit package system with under paddle leadfingers

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device

Bump forming method using self-assembling resin and a wall surface

Method for forming interconnects

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Wire bonding system utilizing multiple positioning tables

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Three dimensional packaging optimized for high frequency circuitry

Method of manufacturing a printed circuit board having an embedded electronic component

Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device

Thermo-compression bonded electrical interconnect structure and method

Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Thermal intermediate apparatus, systems, and methods

Electromagnetic shield formation for integrated circuit die package

Method for fabricating multi-chip stacked package

Process for making microelectronic element chips

Method of manufacturing semiconductor device

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Carrier assembly for an integrated circuit

Semiconductor chip package and printed circuit board

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

High voltage interlock system and control strategy

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Integrated circuit device having a gas-phase deposited insulation layer

Semiconductor device

Integrated circuit package system with package encapsulation having recess

Connecting and bonding adjacent layers with nanostructures

Thermo-compression bonded electrical interconnect structure and method

Semiconductor device and method of manufacturing same

Integrated circuit, circuit system, and method of manufacturing

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method of manufacturing the same

Structure and method for fabricating flip chip devices

Techniques for forming solder bump interconnects

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Electronic assemblies providing active side heat pumping

Packaging substrate having heat-dissipating structure

Semiconductor device

Memory device system with stacked packages

Integrated circuit package system with delamination prevention structure

Integrated circuit package system with multi-chip module

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with external interconnects at high density

Integrated circuit package system with leads separated from a die paddle

Integrated circuit package-in-package system with leads

Thermal enhanced upper and dual heat sink exposed molded leadless package

Multi-Chip Stacked Package Structure

Molded semiconductor device including IC-chip covered with conductor member

Integrated shielding process for precision high density module packaging

Carrier Tape Segment Including Mechanical Interlocking Features Thereon

Structural component comprising boron nitride agglomerated powder

Formation of circuitry with modification of feature height

Printed circuit board manufacturing method

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

3D IC method and device

Microelectronic package interconnect and method of fabrication thereof

Semiconductor connection component

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Electrical Interconnect Formed by Pulsed Dispense

Manufacturing process for a chip package structure

Alkali silicate glass based coating and method for applying

Electronic shielding apparatus and methods

High density in-package microelectronic amplifier

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Electronic device mounting structure

Packaging Method For Wideband Power Using Transmission Lines

Semiconductor chip with crack stop

Stacked die package

Stack chip and stack chip package having the same

Package structure for multiple die stack

Semiconductor device for preventing inflow of high current from an input/output pad and a circuit for preventing inflow of high current thereof

Structure of high performance combo chip and processing method

Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Multi-chip semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Dual-sided chip attached modules

Semiconductor package embedded in substrate, system including the same and associated methods

Semiconductor die mount by conformal die coating

Singulated semiconductor package

Semiconductor device with leadframe including a diffusion barrier

Semiconductor package and method of assembling a semiconductor package

Semiconductor device and producing method of the same

Conductive metal structure applied to a module IC and method of manufacturing the same

Substrate having through-wafer vias and method of forming

METHOD OF FORMING A SEMICONDUCTOR DIE HAVING A SLOPED EDGE FOR RECEIVING AN ELECTRICAL CONNECTOR

ELECTRONIC DEVICE

Circuit board structure and fabrication method thereof

Printed wiring board

Interposer for connecting plurality of chips and method for manufacturing the same

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Method of packaging an integrated circuit die

Method of manufacturing a semiconductor device including plural semiconductor chips

Method of producing electronic apparatus

Semiconductor device and manufacturing method of the same

Semiconductor device

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Low-noise flip-chip packages and flip chips thereof

Semiconductor device with non-overlapped circuits

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Wire bond pads

Method and structure for increased wire bond density in packages for semiconductor chips

Structure of high performance combo chip and processing method

Stacked chip package with redistribution lines

Semiconductor integrated circuit device and method of fabricating the same

Semiconductor device and method of manufacturing the same

High strength solder joint formation method for wafer level packages and flip applications

Nail-shaped pillar for wafer-level chip-scale packaging

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers

Semiconductor device having wafer level chip scale packaging substrate decoupling

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

Wafer level packaging of semiconductor chips

Semiconductor device comprising internal and external wiring

Multi-Chip Package

Packaging substrate structure with electronic component embedded therein and method for manufacture of the same

Through-chip via interconnects for stacked integrated circuit structures

Ball grid array package enhanced with a thermal and electrical connector

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated Circuit Package with Passive Component

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package-on-package system with anti-mold flash feature

Integrated circuit package-in-package system with carrier interposer

Integrated circuit package-in-package system with side-by-side and offset stacking

Method for forming a packaged semiconductor device

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Integrated circuit package and manufacturing method thereof

Method of making a circuit subassembly

Method for manufacturing multilayer ceramic electronic device

Method of manufacturing electronic component package

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

Printed board with component mounting pin

Printed board with component mounting pin

Wirebond pad for semiconductor chip or wafer

Micro-power source module

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device and manufacturing method for the same

Semiconductor device and method for manufacturing the same

Semiconductor device including semiconductor constituent and manufacturing method thereof

Semiconductor package having buss-less substrate

Flip-chip type semiconductor device

Electronic device and electronic apparatus

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

Fan out type wafer level package structure and method of the same

Multi-chip module package

Semiconductor component

Electronic device wafer level scale packages and fabrication methods thereof

Electronic device wafer level scale packges and fabrication methods thereof

Semiconductor device

Switching assembly for an aircraft ignition system

Mounting structure of electronic component

Method for producing shock and tamper resistant microelectronic devices

Method for manufacturing a device having a high aspect ratio via

PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE

Amplification of HIV-1 sequences for detection of sequences associated with drug-resistance mutations

Packaging substrate structure with electronic components embedded therein and method for manufacturing the same

Planar magnetic device and power supply IC package using same

Method of manufacturing semiconductor device

Semiconductor device

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

Top layers of metal for high performance IC's

Carrier substrate and integrated circuit

Integrated circuit including parylene material layer

Electronic device

Flip chip interconnection

STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND DISPLAY DEVICE

Manufacturing method of semiconductor device

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Method of manufacturing an integrated circuit module

Fabrication method of an organic substrate having embedded active-chips