212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Methods for surface attachment of flipped active components
#902Through-hole electrode substrate
#903Electronic device
#904Window Clamp
#905Window Clamp
#906Pad structure and integrated circuit die using the same
#907ANTENNA DEVICE
#908Microelectronic elements with post-assembly planarization
#909Crystal controlled oscillator and manufacturing method of crystal controlled oscillator
#910Grid array connection device and method
#911Semiconductor device and bump formation process
#9123-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#913Hybrid nanosilver/liquid metal ink composition and uses thereof
#914Light emitting device and method of manufacturing the same
#915Light-emitting element, light-emitting element package comprising light-emitting element, and light-emitting device comprising light-emitting element package
#916Stackable electronic package and method of fabricating same
#917Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#918Electronic component mounting board, electronic device, and electronic module
#919Methods of forming integrated circuit package with thermally conductive pillar
#920High voltage device with multi-electrode control
#921Semiconductor device with contact pad and fabrication method therefore
#922Integrated circuit package
#923Stack frame for electrical connections and the method to fabricate thereof
#924Distributed computing
#925Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor
#926Magnetically coupled galvanically isolated communication using lead frame
#927Package with solder regions aligned to recesses
#928Integrated circuit including standard cell
#929Semiconductor integrated circuit including discharge control circuit
#930Electro-optical device having flexible wiring substrate, and electronic apparatus
#931Integrated circuit (IC) package with a solder receiving area and associated methods
#932HYBRID COMPUTING MODULE
#933Protective layer for contact pads in fan-out interconnect structure and method of forming same
#934METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
#935Electronic device interconnections for high temperature operability
#936Wiring board and electronic package
#9373D semiconductor device, fabrication method and system
#938Semiconductor integrated circuit, semiconductor system, and electric source voltage control method
#939Connecting device and circuit chip connecting method using connecting device
#940Packaged semiconductor device having multi-level leadframes configured as modules
#941Efficient heat removal from component carrier with embedded diode
#942Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#943Electrically testable microwave integrated circuit packaging
#944Stacked semiconductor device
#945Integrated circuit sensor and sensor substrate
#946Semiconductor memory device and structure
#947Advanced node cost reduction by ESD interposer
#948Substrates, assembles, and techniques to enable multi-chip flip chip packages
#949Package with tilted interface between device die and encapsulating material
#950SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#951Integrated circuit package having wirebonded multi-die stack
#952Packages with metal line crack prevention design
#953Semiconductor device with frame having arms and related methods
#954Electronic device package
#955Semiconductor devices having metal posts for stress relief at flatness discontinuities
#956Packaged chip and signal transmission method based on packaged chip
#957Integrated circuit package mold assembly
#958Semiconductor device and power conversion device
#959Semiconductor device
#960Semiconductor module
#961Microelectronic assembly from processed substrate
#962Common procedure of interconnecting electronic chip with connector body and forming the connector body
#963Semiconductor device and a method of manufacturing the same
#964SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER
#965Semiconductor device and method with clip arrangement in IC package
#966Foreign matter removal method and foreign matter removal device
#967Bond structures and the methods of forming the same
#968Semiconductor device
#969Package structures and method of forming the same
#970Multi-die memory device
#971Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#972Packaged semiconductor assemblies and methods for manufacturing such assemblies
#973Semiconductor package device and method of manufacturing the same
#974HEAT DISSIPATING STRUCTURE AND MANUFACTURE
#975Chip package
#976Post passivation interconnect and fabrication method therefor
#977Integrated circuit (IC) devices with varying diameter via layer
#978Package structure and method for forming the same
#979Pad design for reliability enhancement in packages
#980Semiconductor device package thermal conduit
#981Semiconductor device packages including an inductor and a capacitor
#982Packaged semiconductor devices and methods of packaging semiconductor devices
#983Fan-out semiconductor package
#984Memory system topologies including a buffer device and an integrated circuit memory device
#985Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#986Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#987Thermocompression Bonding with Passivated Gold Contacting Metal
#988Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#989Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#990Thermocompression Bonding Using Metastable Gas Atoms
#991System for Low-Force Thermocompression Bonding
#992Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#993Active chip on carrier or laminated chip having microelectronic element embedded therein
#994Package substrate and associated fabrication method with varying depths for circuit device terminals
#995IC package
#996Semiconductor device and method for manufacturing the same
#997Fan-out semiconductor package and method of manufacturing the fan-out semiconductor
#998Semiconductor device and process for fabricating the same
#999Sensor device for wearable device generating power-on trigger signal
#1000Multi-chip module
#1001Electronic-component mount substrate, electronic device, and electronic module
#1002Staged via formation from both sides of chip
#1003Heterogeneous miniaturization platform
#1004Integrated circuit package and method of forming same
#1005Driving chip bump having irregular surface profile, display panel connected thereto and display device including the same
#1006Display device including support films
#1007Methods of packaging semiconductor devices and packaged semiconductor devices
#1008Fully molded miniaturized semiconductor module
#1009Semiconductor Substrate
#1010Semiconductor device and method of forming interposer with opening to contain semiconductor die
#1011Bonded semiconductor structures
#1012Underfill control structures and method
#1013Micro-transfer printing with volatile adhesive layer
#1014Fan-out semiconductor package
#1015Fan-out semiconductor package
#1016Semiconductor device and display device
#1017Lead and lead frame for power package
#1018Complex cavity formation in molded packaging structures
#1019Circuit structure
#1020Method and apparatus for providing a transistor
#1021Semiconductor device and manufacturing method thereof
#1022Backside ground plane for integrated circuit
#1023Wafer level package and method
#1024Integrated fan-out package
#1025Leadframe
#1026Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect
#1027Non-volatile memory with stacked semiconductor chips
#1028Semiconductor device including a buffer layer structure for reducing stress
#1029Electrical connectivity of die to a host substrate
#1030Spot-solderable leads for semiconductor device packages
#1031Backside spacer structures for improved thermal performance
#1032Conductive paste for bonding
#1033Packaging for high power integrated circuits and infrared emitter arrays
#1034Method for bonding and interconnecting integrated circuit devices
#1035Semiconductor device with a semiconductor chip connected in a flip chip manner
#1036Fan-out semiconductor package
#1037Display device having connection unit
#1038Integrated circuit die and manufacture method thereof
#1039Electronic component mounting substrate, electronic device, and electronic module
#1040Light emitting device and method of manufacturing the same
#1041Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
#1042Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die
#1043Printed wiring board and method for manufacturing printed wiring board
#10443D printed hermetic package assembly and method
#1045Memories and memory components with interconnected and redundant data interfaces
#1046Method of fabricating an optical module that includes an electronic package
#1047BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC DEVICES
#1048LPS solder paste based low cost fine pitch pop interconnect solutions
#1049Limiting electronic package warpage
#1050Wafer-level package with enhanced performance
#1051Integrated electronic device with transceiving antenna and magnetic interconnection
#1052Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1053Remapped packaged extracted die with 3D printed bond connections
#1054Semiconductor device
#1055Method and apparatus for making integrated circuit packages
#1056INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE INCLUDING THE SAME
#1057Tooling for coupling multiple electronic chips
#1058Semiconductor die singulation and structures formed thereby
#1059Embedded semiconductive chips in reconstituted wafers, and systems containing same
#1060Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#1061Interconnect structure with redundant electrical connectors and associated systems and methods
#10623D semiconductor package interposer with die cavity
#1063Reducing wafer warpage during wafer processing
#1064Surface mount package and manufacturing method thereof
#1065Semiconductor device and a method of manufacturing the same
#1066Integrated circuit (IC) structure for high performance and functional density
#1067WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor
#1068Integrated circuit packages and methods for forming the same
#1069Apparatus with forward and reverse-biased light emitting diodes coupled in parallel
#1070Electronic device
#1071Semiconductor package and method of manufacturing the same
#1072Switched power stage with integrated passive components
#1073Composite magnetic sealing material
#1074Anti-fuse with reduced programming voltage
#1075RECESSED AND EMBEDDED DIE CORELESS PACKAGE
#1076Chip-on-wafer package and method of forming same
#1077SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#1078System and method for determining a cause of network congestion
#1079Method of manufacturing a circuit device
#1080Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same
#1081Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#1082Integrated circuit package assemblies including a chip recess
#1083Integrated circuit package stack
#1084SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
#1085Circuitized substrate with electronic components mounted on transversal portion thereof
#1086Planar integrated circuit package interconnects
#1087Repackaged integrated circuit assembly method
#1088Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#1089Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#1090Tamper detection for a chip package
#1091Vias and conductive routing layers in semiconductor substrates
#1092Light-emitting apparatus
#1093Integrated circuit package including miniature antenna
#1094Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
#1095Electronic component package and electronic device including the same
#1096ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
#1097Bonding structure and method
#1098Integrated circuits and methods of manufacturing
#1099Integrated fan-out package and method of fabricating the same
#1100Electronic device having a liquid crystal polymer solder mask and related devices
#1101Isolation module for use between power rails in an integrated circuit
#1102Device and Method for UBM/RDL Routing
#1103Advanced INFO POP and method of forming thereof
#1104Package structures and methods of forming the same
#1105Semiconductor device and a method of manufacturing the same
#1106Integrated fan-out package and method of fabricating the same
#1107Semiconductor package including flip chip mounted IC and vertically integrated inductor
#11083D chip testing through micro-C4 interface
#1109Chip package and manufacturing method thereof
#1110Heat-dissipating structure and method for manufacturing same
#1111Semiconductor package with barrier for radio frequency absorber
#1112Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#1113Crosstalk reduction in electrical interconnects
#1114OPTOELECTRONIC SYSTEM
#1115Integrated circuit assembly that includes stacked dice
#1116Electronic device provided with an integral conductive wire and method of manufacture
#1117MOSCAP-based circuitry for wireless communication devices, and methods of making and using the same
#1118Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#1119Stackable semiconductor package and manufacturing method thereof
#1120Stacked semiconductor devices
#1121Through substrate vias with improved connections
#11223D IC method and device
#1123Stack frame for electrical connections and the method to fabricate thereof
#1124Methods and devices for fabricating and assembling printable semiconductor elements
#1125Semiconductor chip assembly and method for making same
#1126Semiconductor device having an inductor
#1127Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#1128Fan-out semiconductor package
#1129Semiconductor device and corresponding method
#1130Process system and operation method thereof
#1131Method and apparatus for connecting packages onto printed circuit boards
#1132MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTRONIC DEVICES
#1133Trench-type heat sink structure applicable to semiconductor device
#1134Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#1135Integrated circuits with backside metalization and production method thereof
#1136Electro-optic device with multiple photonic layers and related methods
#1137Computer modules with small thicknesses and associated methods of manufacturing
#1138Flat No-Leads Package With Improved Contact Pins
#1139Pressure-sensing integrated circuit device with diaphragm
#1140Electronic Assemblies without Solder and Methods for their manufacture
#1141Systems and methods for thermal management for high power density EMI shielded electronic devices
#1142Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#1143Systems and methods for electromagnetic interference shielding
#1144SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#1145System and method for a transducer in an eWLB package
#1146Light emitting device and method of manufacturing the same
#1147Semiconductor package assembly
#1148Antenna cavity structure for integrated patch antenna in integrated fan-out packaging
#1149Electrical interconnect for an integrated circuit package and method of making same
#1150Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#1151Fan-out semiconductor package
#1152Electric component with sensitive component structures and method for producing an electric component with sensitive component structures
#1153Hybrid carbon-metal interconnect structures
#1154Semiconductor constructions, electronic systems, and methods of forming cross-point memory arrays
#1155Dual lead frame semiconductor package and method of manufacture
#1156Semiconductor package, printed circuit board substrate and semiconductor device
#1157Backside drill embedded die substrate
#1158Semiconductor device and wafer level package including such semiconductor device
#1159Semiconductor device and a method of manufacturing the same
#1160Multilayer substrate, component mounted board, and method for producing component mounted board
#1161CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
#1162Printed adhesion deposition to mitigate integrated circuit delamination
#1163Redistribution film for IC package
#1164Semiconductor device
#1165Fan-out semiconductor package and method of manufacturing same
#1166System-in-package devices with magnetic shielding
#1167Power and ground routing of integrated circuit devices with improved IR drop and chip performance
#1168Semiconductor device having electrode pads arranged between groups of external electrodes
#1169Compact optical transceiver by hybrid multichip integration
#1170Methods of making semiconductor device packages and related semiconductor device packages
#1171Localized redistribution layer structure for embedded component package and method
#1172Micro-transfer printable electronic component
#1173OPTICAL ELECTRONIC DEVICE AND METHOD OF FABRICATION
#1174Electronic components having three-dimensional capacitors in a metallization stack
#1175Module for heat generating electronic component
#1176Microelectronic elements with post-assembly planarization
#1177Efficiently micro-transfer printing micro-scale devices onto large-format substrates
#1178Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#1179Methods for microelectronics fabrication and packaging using a magnetic polymer
#1180Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
#1181Vertical semiconductor device with thinned substrate
#1182Integrated circuit with backside structures to reduce substrate warp
#1183Integrated circuit chip packaging
#1184Integrated circuit chip packaging including a heat sink topped cavity
#1185Chip package assembly with power management integrated circuit and integrated circuit die
#1186Integrated circuit dies with through-die vias
#1187Multichip modules and methods of fabrication
#1188Device with top-side base plate
#1189Packages and methods of forming packages
#1190Inter-chip alignment
#1191Methods of manufacturing an integrated circuit having stress tuning layer
#1192Chip part and method of making the same
#1193Semiconductor devices, methods of manufacture thereof, and methods of singulating semiconductor devices
#1194Anisotropic conductive film
#1195Semiconductor integrated circuit device
#1196Semiconductor device and manufacturing method thereof
#1197Semiconductor devices and methods of manufacture thereof
#1198Info coil structure and methods of manufacturing same
#1199IC packaging method and a packaged IC device
#1200Semiconductor device, manufacturing method thereof, and electronic apparatus