System for the Manufacture of Electronic Assemblies Without Solder

Cascode current sensor for discrete power semiconductor devices

Semiconductor circuit and switching power supply apparatus

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Larger than die size wafer-level redistribution packaging process

Power semiconductor module

Method for fabricating a semiconductor and semiconductor package

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Packaging substrate and application thereof

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Semiconductor device

Optical communication module

Mounting method, electric part-mounted substrate and an electric device

Noncontact information storage medium and method for manufacturing same

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

C4NP servo controlled solder fill head

INTERCONNECT ASSEMBLIES AND METHODS

Method for producing a circuit board comprising a lead frame

CHIP PACKAGE AND CHIP PACKAGING PROCESS THEREOF

Adhesive bleed prevention method and product produced from same

Assembly of Encapsulated Electronic Components to a Printed Circuit Board

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Electronic assemblies without solder having overlapping components

WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES

CHIP MODULE, ACTIVE DEVICE ARRAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY PANEL

RF identification device with near-field-coupled antenna

GROUP PROBING OVER ACTIVE AREA PADS ARRANGEMENT

Power electronics devices with integrated gate drive circuitry

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Method and structure to reduce cracking in flip chip underfill

SEMICONDUCTOR DEVICE

Die stacking apparatus and method

STACKING OF INTEGRATED CIRCUITS USING GLASSY METAL BONDING

Arrangement of stacked integrated circuit dice having a direct electrical connection

System and method for providing semiconductor device features using a protective layer

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

INTEGRATED CIRCUIT

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

Electronic device, method of producing the same, and semiconductor device

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE

Redistributed chip packaging with thermal contact to device backside

Integrated circuit packaging system for fine pitch substrates

PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Integrated Support Structure for Stacked Semiconductors With Overhang

Integrated circuit package system with multiple devices

TFCC (TM) and SWCC (TM) thermal flex contact carriers

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Relay substrate and substrate assembly

Method for forming semiconductor package and mold cast used for the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

INTERCONNECT STRUCTURE

Semiconductor die package with internal bypass capacitors

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Tapered dielectric and conductor structures and applications thereof

Semiconductor device and method of manufacturing same

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Integrated circuit having a semiconductor substrate with a barrier layer

Electronic assembly having a multilayer adhesive structure

Semiconductor device and method of manufacturing the same

Crosstalk-free WLCSP structure for high frequency application

Electronic device and method of manufacturing same

Semiconductor device with heat sink and method for manufacturing the same

Heat extraction from packaged semiconductor chips, scalable with chip area

Electronic component package and method of manufacturing same

Semiconductor module

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Stacked integrated circuit leadframe package system

Semiconductor device package

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Leadframe panel

Semiconductor device and method of manufacturing the same

Image sensor package structure and method for fabricating the same

Method for fabricating semiconductor device having backside redistribution layers

Semiconductor device having a sensor chip, and method for producing the same

Semiconductor device

Method and apparatus for loading solder balls

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic component-embedded board and method of manufacturing the same

Dual cavity, high-heat dissipating printed wiring board assembly

Methods of attaching a die to a substrate

Assembly substrate and method of manufacturing the same

Electronic component-embedded board and method of manufacturing the same

Isolated conformal shielding

Flip chip mounting method and bump forming method

Method and apparatus for fabricating integrated circuit device using self-organizing function

Semiconductor device with offset stacked integrated circuits

Memory card and its manufacturing method

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device having double side electrode structure and method of producing the same

Semiconductor device package and fabricating method thereof

HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES

Integrated circuit package and system interface

Method for packaging semiconductor dies having through-silicon vias

Wafer level package structure and fabrication methods

Semiconductor device

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Capacitive isolator

Manufacturing method of semiconductor integrated circuit device

Fretting and whisker resistant coating system and method

Device structure of carbon fibers and manufacturing method thereof

Semiconductor assembly

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit package system with flexible substrate and recessed package

Method of obtaining enhanced localized thermal interface regions by particle stacking

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Integrated circuit package system including stacked die

Semiconductor chip package and method of manufacturing the same

Integrated circuit package system with wire-in-film isolation barrier

Three-dimensional die-stacking package structure

Method for producing chip stacks, and associated chip stacks

Semiconductor device

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR CHIP AND PACKAGE PROCESS FOR THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

SEAL RING FOR GLASS WALL MICROELECTRONICS PACKAGE

Multichip module package and fabrication method

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Packaged semiconductor assemblies and methods for manufacturing such assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Fusion quad flat semiconductor package

Electrically connecting substrate with electrical device

Integrated circuit package system with multiple molding

Mixed wire semiconductor lead frame package

INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

Manufacturing process and structure of through silicon via

Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly

Method for connecting an electronic chip to a radiofrequency identification device

Component with sensitive component structures and method for the production thereof

Hybrid integrated circuit device and manufacturing method thereof

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Die-wafer package and method of fabricating same

Mounting system

Semiconductor Device Package Disassembly

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Layout of dummy patterns

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Semiconductor device suitable for a stacked structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Three-dimensional chip-stack package and active component on a substrate

Semiconductor device with pads of enhanced moisture blocking ability

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

SEMICONDUCTOR MODULE DEVICE, METHOD OF MANUFACTURING THE SAME, FLAT PANEL DISPLAY, AND PLASMA DISPLAY PANEL

Method of fabricating a power semiconductor module

Ultra-Thin Wafer-Level Contact Grid Array

Integrated circuit package system with flex bump

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR PACKAGE

Method of making a circuit assembly

Method of Creating Molds of Variable Solder Volumes for Flip Attach

Adhesive composition and adhesive sheet

Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

Method of fabricating a semiconductor package having through holes for molding back side of package

METHOD OF PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Method of fabricating a semiconductor die having a redistribution layer

Fabrication method of semiconductor integrated circuit device

Method of fabricating a memory card using SiP/SMT hybrid technology

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Electronic module and fabrication method thereof

Circuit board with an attached die and intermediate interposer

Packaging system with hollow package and method for the same

Chip attack protection

Semiconductor device with a buffer region with tightly-packed filler particles

Integrated circuit package system with overhang die

Integrated circuit package system with dual side connection

Semiconductor die having a distribution layer

Semiconductor device and wire bonding method

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

Integrated circuit package system with overhanging connection stack

Ta-TaN selective removal process for integrated device fabrication

Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground

IC chip with finger-like bumps

Integrated circuit package in package system with adhesiveless package attach

Semiconductor device

Semiconductor device including semiconductor chips having contact elements

Build-up-package for integrated circuit devices, and methods of making same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

High-Density Fine Line Structure And Method Of Manufacturing The Same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Stackable package by using internal stacking modules

Integrated circuit package system with top and bottom terminals

Semiconductor module for a switched-mode power supply and method for its assembly

Integrated circuit package system with integral inner lead and paddle

PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Semiconductor device

Methods of Creating Molds of Variable Solder Volumes for Flip Attach

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

Conformal shielding process using flush structures

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Heat sink formed with conformal shield

Method and arrangement for producing a smart card

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Grooving bumped wafer pre-underfill system

Formation of alpha particle shields in chip packaging

Process applying die attach film to singulated die

Stack circuit member and method

Manufacturing Method of Semiconductor Integrated Circuit Device

Device and method for fabricating double-sided SOI wafer scale package with optical through via connections

Manufacturing method for semiconductor integrated device

RECOVERABLE ELECTRONIC COMPONENT

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Demountable interconnect structure

MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Multi-layer substrate and manufacture method thereof

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Apparatus for non-conductively interconnecting integrated circuits

Semiconductor device including a stress buffer

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Wafer level surface passivation of stackable integrated circuit chips

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Semiconductor device

Die backside metallization and surface activated bonding for stacked die packages

Methods of post-contact back end of the line through-hole via integration

CHIP PACKAGE

Semiconductor device and manufacturing method thereof

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Integrated circuit package system employing device stacking

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

Direct edge connection for multi-chip integrated circuits

THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Bumpless flip-chip assembly with a complaint interposer contractor

VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE

Semiconductor Package-on-Package System Including Integrated Passive Components

Array molded package-on-package having redistribution lines

Multiple die integrated circuit package

Integrated circuit package system having perimeter paddle

Semiconductor device with surface mounting terminals

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Method of making a wafer level integration package

Method of assembly using array of programmable magnets

Method of making demountable interconnect structure

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS

Power composite integrated semiconductor device and manufacturing method thereof

METHOD OF FORMING AN INTERCONNECT JOINT

Manufacturing method for semiconductor device containing stacked semiconductor chips

Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer

Radio frequency identification (RFID) tag lamination process using liner

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material

Thick film circuit component and method for manufacturing the same

Apparatus for Producing Ic Chip Package

Method and structure to improve thermal dissipation from semiconductor devices

Method of producing a transponder and a transponder

Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

Semiconductor power device having a stacked discrete inductor structure

Semiconductor memory device

Fabricated adhesive microstructures for making an electrical connection

Die offset die to die bonding

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Solder bump interconnect for improved mechanical and thermo-mechanical performance