INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURES

Electronic structures including barrier layers defining lips

Semiconductor device, chip package and method of fabricating the same

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

Electro-optical apparatus and a circuit bonding detection device and detection method thereof

Semiconductor device

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Method of fabricating a semiconductor device

Bonding structure with buffer layer and method of forming the same

Heat spreader for center gate molding

Method of machining wafer

METHOD OF REDUCING WARPAGE IN SEMICONDUCTOR MOLDED PANEL

In-situ functionalization of carbon nanotubes

SEMICONDUCTOR MOLDED PANEL HAVING REDUCED WARPAGE

BONDING PAD STRUCTURE

Patterned die attach and packaging method using the same

Electronic circuit package

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD

Semiconductor device and method of manufacturing semiconductor device

STRUCTURE FOR PREVENTING PAD PEELING

Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same

Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel

Circuit arrangement and integrated circuit

Through silicon via dies and packages

Through-silicon via interconnection formed with a cap layer

Contact pad and method of forming a contact pad for an integrated circuit

Method of packaging a microchip having a footprint that is larger than that of the integrated circuit

High-Density Fine Line Structure And Method Of Manufacturing The Same

Electronic Component

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Electronic system with vertical intermetallic compound

Chip-in-slot interconnect for 3D chip stacks

Pin grid array package substrate including pins having curved pin heads

Integrated circuit package system with contoured die

Electrically interconnected stacked die assemblies

Lead frame-BGA package with enhanced thermal performance and I/O counts

Integrated circuit package system with leadfinger

Integrated circuit package system with leaded package

Semiconductor chip package

Semiconductor subassemblies with interconnects and methods for manufacturing the same

Vented die and package

Printed wiring board and a method of manufacturing a printed wiring board

Flexible and elastic dielectric integrated circuit

Fill head for injection molding of solder

Methods of making metal core foldover package structures

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

Chip scale package having flip chip interconnect on die paddle

Integrated circuit die with logically equivalent bonding pads

Front-end processing of nickel plated bond pads

One piece method for integrated circuit (IC) assembly

Method for providing near-hermetically coated, thermally protected integrated circuit assemblies

Electronic assemblies without solder and methods for their manufacture

Current sensor

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Arrangement including a semiconductor device and a connecting element

Semicondutor device

Reduced inductance in ball grid array packages

Enhanced copper posts for wafer level chip scale packaging

Multi-die wafer level packaging

Semiconductor device

Cylindrical bonding structure and method of manufacture

Protection and Connection of Devices Underneath Bondpads

Fluid spreader

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA

Chip assembly including package element and integrated circuit chip

Metal interconnect System and Method for Direct Die Attachment

Electronic Module and Chip Card With Indicator Light

Multilayer wiring board for an electronic device

Semiconductor chip mounting board with multiple ports

Method of manufacturing electronic component package

Fully integrated RF transceiver integrated circuit

Connector connectable with low contact pressure

Prevention and control of intermetallic alloy inclusions

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT DAMAGE

Standoff height improvement for bumping technology using solder resist

Semiconductor package, method for fabricating the same, and semiconductor device

Method for mounting anisotropically-shaped members

Semiconductor package, printed circuit board, and electronic device

Antenna structure for integrated circuit die using bond wire

Semiconductor device with integrated coils

SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR

Method of packaging integrated circuits

Post passivation interconnection process and structures

Semiconductor device and fabrication method thereof

Chip Assembly and Method of Manufacturing Thereof

Chip Scale Package and Method of Assembling the Same

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Mold design and semiconductor package

Compliant thermal contactor

Compliant thermal contactor

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE

STACKED CHIP SEMICONDUCTOR DEVICE

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Semiconductor device and a method of manufacturing the same

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

Integrated circuit package system with relief

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

METHOD OF PACKAGING INTEGRATED CIRCUITS

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor integrated circuit with solder bump

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Composite substrate and method for manufacturing composite substrate

Direct Package Mold Process For Single Chip SD Flash Cards

Semiconductor device and a method of manufacturing the same

METHOD FOR FABRICATING METAL PAD

Downhill Wire Bonding for QFN L - Lead

Semiconductor device packaged into chip size and manufacturing method thereof

Method of manufacturing a semiconductor device

Method of making integrated circuit package with transparent encapsulant

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Temporary chip attach carrier

Semiconductor integrated circuit

Flip chip mounting method and bump forming method

Method for Fabricating Array-Molded Package-On-Package

Base semiconductor component for a semiconductor component stack and method for the production thereof

SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD OF FABRICATION

Semiconductor device and method of manufacturing same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Reliable metal bumps on top of I/O pads after removal of test probe marks

Chip assembly with interconnection by metal bump

Method for manufacturing semiconductor device, and semiconductor device

BUMP STRUCTURE

Apparatus for connecting integrated circuit chip to power and ground circuits

Dimple free gold bump for drive IC

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor package having die with recess and discrete component embedded within the recess

Integrated circuit package system with thin profile

Methods of assembling integrated circuit packages

Electronic system with expansion feature

Compact multi-port CAM cell implemented in 3D vertical integration

Die stacking system and method

Multi layer low cost cavity substrate fabrication for pop packages

Housed active microstructures with direct contacting to a substrate

System-in-package type semiconductor device

Semiconductor device and manufacturing method thereof

Chip-On-Lead and Lead-On-Chip Stacked Structure

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Semiconductor Package Having Reduced Thickness

Leadframe for a semiconductor device

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Semiconductor device

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Manufacturing method of semiconductor device and electronic device

Stacked die package for peripheral and center device pad layout device

Systems and methods for post-circuitization assembly

METHODS FOR FORMING PACKAGE STRUCTURES

CONVEX DIE ATTACHMENT METHOD

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Etch method

Mounting Assembly for Optoelectronic Devices

Semiconductor package and method of forming the same, and printed circuit board

RF-coupled digital isolator

RF-coupled digital isolator

Semiconductor device with improved resin configuration

Semiconductor package and method of forming the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Package structure for integrated circuit device

Multi-die molded substrate integrated circuit device

Substrate and multilayer circuit board

Methods of packaging a semiconductor die and package formed by the methods

Package integrated soft magnetic film for improvement in on-chip inductor performance

Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures

LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER

Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Electronic Assemblies without Solder and Methods for their Manufacture

Electronic device manufacturing method and supporter

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor package having through-hole via on saw streets formed with partial saw

Semiconductor device package with multi-chips and method of the same

Process and apparatus for wafer-level flip-chip assembly

Wafer-level flip-chip assembly methods

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Method of assembling electronic components of an electronic system, and system thus obtained

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Multipath Soldered Thermal Interface Between a Chip and its Heat Sink

Multi-layer thermal insulation for a bonding system

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS

PCB having embedded IC and method for manufacturing the same

Carrier with embedded component and method for fabricating the same

Integrated circuit package system with interference-fit feature

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

Method for Producing a Microcircuit Card

Package-in-package using through-hole via die on saw streets

Semiconductor package substrate structure and manufacturing method thereof

Package substrate and its solder pad

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Integrated circuit package with top-side conduction cooling

Pin grid array package substrate including slotted pins

Integrated circuit package system with device cavity

Package-on-package using through-hole via die on saw streets

Air cavity package for a semiconductor die and methods of forming the air cavity package

Semiconductor die package and integrated circuit package and fabricating method thereof

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Extended redistribution layers bumped wafer

Selectively conducting devices, diode constructions, constructions, and diode forming methods

High Density Nanotube Devices

Thermal insulation for a bonding tool

WEDGE-BONDING OF WIRES IN ELECTRONIC DEVICE MANUFACTURE WITH REVERSIBLE WEDGE BONDING

Re-workable heat sink attachment assembly

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

Apparatus for removing interconnects to separate two parts of a workpiece

Metallization with tailorable coefficient of thermal expansion

Substrate with feedthrough and method for producing the same

Manufacturing method of a semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method and system for bonding 3D semiconductor devices

Chip package

Fabricating process of a chip package structure

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Bidirectional multiplexed RF isolator

Magnetoresistive device and method of packaging same

METHOD AND APPARATUS FOR HEAT DISSIPATION

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Package equipped with semiconductor chip and method for producing same

Semiconductor device having a sealing resin and method of manufacturing the same

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

Semiconductor device and process for fabricating the same

Structure for electrostatic discharge in embedded wafer level packages

Semiconductor chip with post-passivation scheme formed over passivation layer

Semiconductor device

Wafer level package

Highly reliable low cost structure for wafer-level ball grid array packaging

WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE

Integrated chip package structure using organic substrate and method of manufacturing the same

Semiconductor device and method of fabricating the semiconductor device

WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

Etched interposer for integrated circuit devices

Semiconductor device

Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

IC chip and its manufacturing method

Magnetically alignable integrated circuit device

Semiconductor layer structure and method of making the same

Semiconductor device

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Electronic flame-off electrode with ball-shaped tip

Interconnect structure with stress buffering ability and the manufacturing method thereof

Selective etch of TiW for capture pad formation

Electronic Device Installed in an Engine Room

Method for manufacturing printed circuit board having embedded component

Semiconductor layer structure and method of making the same

SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device and manufacturing method thereof

On chip transformer isolator

3-dimensional integrated circuit architecture, structure and method for fabrication thereof

Method for fabricating a probing pad of an integrated circuit chip

Fabric type semiconductor device package and methods of installing and manufacturing same

Semiconductor device

Three-dimensional semiconductor device

Integration type semiconductor device and method for manufacturing the same

Low fabrication cost, fine pitch and high reliability solder bump

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Method of making solder pad

Cut-out heat slug for integrated circuit device packaging

SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD

Semiconductor packaging with internal wiring bus

Integrated circuit package system for package stacking and method of manufacture therefor

High Input/Output, Low Profile Package-On-Package Semiconductor System

Simplified Substrates for Semiconductor Devices in Package-on-Package Products

Wiring board and semiconductor package using the same

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Controlling warping in integrated circuit devices

Semiconductor package and method

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Semiconductor device with improved pads

Semiconductor device

Integrated circuits and interconnect structure for integrated circuits

Integrated circuits and interconnect structure for integrated circuits

Semiconductor light emitting device packages and methods

IC card

IC card module

Packaging substrate and method for manufacturing the same

Layout circuit

Spring interconnect structures

Semiconductor device and a method of manufacturing the same

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device and process for manufacturing the same

Encapsulation method

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

System in package (SIP) with dual laminate interposers

Manufacturing method of a tray, a socket for inspection, and a semiconductor device