ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device

Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof

Chip package structure

Semiconductor device

Flip chip with interposer, and methods of making same

Semiconductor device and manufacturing method thereof

Chip package

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

Low shrinkage polyester thermosetting resins

Electromigration-Resistant Flip-Chip Solder Joints

Wire Bonds Having Pressure-Absorbing Balls

UBM structure for strengthening solder bumps

Structure of semiconductor chip and package structure having semiconductor chip embedded therein

Multi-chip module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Package on-package secure module having BGA mesh cap

Package-on-package secure module having anti-tamper mesh in the substrate of the upper package

Curing layers of a semiconductor product using electromagnetic fields

Semiconductor module

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device

Apparatus for shielding integrated circuit devices

Mounted body and method for manufacturing the same

Semiconductor fabrication method and system

LOW-STRESS HERMETIC DIE ATTACH

Semiconductor module including semiconductor chips coupled to external contact elements

Wafer-level package having test terminal

Substrate and method for manufacturing the same

Mounting substrate and electronic device

Electrical interconnect structure and method

Method to create a metal pattern using a damascene-like process

Wafer level package with good CTE performance

Asymmetric alignment of substrate interconnect to semiconductor die

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Integrated circuit carrier arrangement with electrical connection islands

Arrangement for Energy Conditioning

Layout structure for chip coupling

Interconnect for chip level power distribution

Semiconductor device with a semiconductor chip connected in a flip chip manner

Stack package, a method of manufacturing the stack package, and a digital device having the stack package

Top layers of metal for high performance IC's

SEMICONDUCTOR DEVICE WITH BONDING PAD

Novel substrate design for semiconductor device

Packed system of semiconductor chips having a semiconductor interposer

Integrated circuit device and method for the production thereof

Stacked package module and board having exposed ends

Chip package structure

Semiconductor package structure having enhanced thermal dissipation characteristics

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Detector system and detector subassembly

Electronic component assembly with composite material carrier

Semiconductor-encapsulating resin composition and semiconductor device

Variable interconnect geometry for electronic packages and fabrication methods

Method of creating contour structures to highlight inspection region

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

Solder composition doped with a barrier component and method of making same

Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS

Lid attachment mechanism

Wafer-level-chip-scale package and method of fabrication

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method for fabricating a low cost integrated circuit (IC) package

Manufacturing method of semiconductor device

Print mask and method of manufacturing electronic components using the same

Gang flipping for IC packaging

GANG FLIPPING FOR FLIP-CHIP PACKAGING

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Semiconductor device

INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME

Semiconductor device

Semiconductor package, method of fabricating the same, and semiconductor package mold

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same

Semiconductor device

Integrated circuit package system with bonding in via

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor Package and Method for Fabricating the Same

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device

Semiconductor device and manufacturing method thereof

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Integrated circuit with flexible planer leads

Stacked integrated circuit package system with conductive spacer

Stacked electronic component package having single-sided film spacer

Integrated circuit package system with encapsulating features

ISOLATED SOLDER PADS

Composite semiconductor device

SOI substrate and method for manufacturing SOI substrate

Sensor-type semiconductor device and manufacturing method thereof

Integrated circuits and interconnect structure for integrated circuits

LIGHT RECEIVING APPARATUS

Die backside wire bond technology for single or stacked die package

Circuit board and circuit device

APPARATUSES AND METHODS FOR FORMING SMART LABELS

Manufacturing Method For Micro-SD Flash Memory Card

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of fabricating intergrated circuit chip

Method of wire bonding over active area of a semiconductor circuit

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

METHOD OF MANUFACTURING DEVICE

Manufacturing method for devices

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Pre-plated leadframe having enhanced encapsulation adhesion

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Method of making semiconductor package with plated connection

Contact carriers (tiles) for populating larger substrates with spring contacts

Module comprising a semiconductor chip

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Wire-bonded semiconductor component with reinforced inner connection metallization

Semiconductor integrated circuit device and fabrication process thereof

Semiconductor element connected to printed circuit board

Wafer-level stack package and method of fabricating the same

Integrated circuit and method for producing the same

INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS

Copper die bumps with electromigration cap and plated solder

Chip and wafer integration process using vertical connections

Semiconductor package

Stacked package module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Integrated circuit package system with molded strip protrusion

CHIP PACKAGE STRUCTURE

Integrated circuit package system with lead support

Leadframe Array with Riveted Heat Sinks

Methods and apparatus for flip-chip-on-lead semiconductor package

Leadframe design for QFN package with top terminal leads

Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit

Integrated cirucit package and method for fabrication thereof

Self chip redistribution apparatus and method for the same

System for fabricating semiconductor components with conductive interconnects

Fibrous laminate interface for security coatings

Wirebond structure and method to connect to a microelectronic die

Method of making reliable wafer level chip scale package semiconductor devices

Integrated circuit package system employing multi-package module techniques

Phenolic polymers and photoresists comprising same

Molded beam for optoelectronic sensor chip substrate

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module with multiple semiconductor chips

Semiconductor device having stacked dice disposed on base substrate

Silicon chip having inclined contact pads and electronic module comprising such a chip

Electronic device and method for producing electronic devices

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING

Semiconductor module having deflecting conductive layer over a spacer structure

Lead structure for a semiconductor component and method for producing the same

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

Package structure and stacked package module using the same

Multi-chip package with a single die pad

Method and apparatus for fabricating a plurality of semiconductor devices

Interposer structure with embedded capacitor structure, and methods of making same

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Low cost lead-free preplated leadframe having improved adhesion and solderability

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Power module having stacked flip-chip and method of fabricating the power module

CHIP PACKAGE STRUCTURE

Vertical electrical interconnect formed on support prior to die mount

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device package

Image sensor module having build-in package cavity and the method of the same

Electronic device, resonator, oscillator and method for manufacturing electronic device

Packaging methods for imager devices

Wiring substrate and electronic device

Wiring board and capacitor to be built into wiring board

Method of opening reservoir of containment device

Wireless communication system

Method of manufacturing device having a UV-curable adhesive

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor module

Method of fabricating module having stacked chip scale semiconductor packages

Thin film deposition as an active conductor and method therefor

Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and Methods

Method and structure to improve thermal dissipation from semiconductor devices

Extended COB-USB with dual-personality contacts

Method and structure for magnetically-directed, self-assembly of three-dimensional structures

Method and device including reworkable alpha particle barrier and corrosion barrier

Semiconductor device with grounding structure

Substrate with feedthrough and method for producing the same

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Removal of integrated circuits from packages

Mounting configuration of electronic component

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces

Structure of semiconductor device package and method of the same

MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF

Integrated passive cap in a system-in-package

Space-efficient package for laterally conducting device

Leadframe treatment for enhancing adhesion of encapsulant thereto

Designs and methods for conductive bumps

Method of forming plugs

Semiconductor device and fabrication process thereof

Method of forming a bump-on-lead flip chip interconnection having higher escape routing density

Electronic part mounting board and method of mounting the same

Compression connection for vertical IC packages

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

SEMICONDUCTOR COMPONENT

Carbon nanotube bond pad structure and method therefor

Integrated circuit package system with underfill

Semiconductor device and a method of manufacturing the same

High temperature, stable SiC device interconnects and packages having low thermal resistance

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device and method of manufacturing the same

Electronic assembly having a multilayer adhesive structure

Interposer for die stacking in semiconductor packages and the method of making the same

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

Semiconductor package having insulating substrate

Integrated circuit package system with interposer

Package structure to improve the reliability for WLP

Heat dissipation methods and structures for semiconductor device

IC card and method of manufacturing the same

Memory IC package assembly having stair step metal layer and apertures

Flip chip contact (FCC) power package

Semiconductor package configuration with improved lead portion arrangement

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Method and system for flip chip packaging of micro-mirror devices

SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR DESIGNING THE SAME

High-heat-resistive semiconductor device

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Methods for fabricating semiconductor components with conductive interconnects

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

REWORKABLE CHIP STACK

Electronic component structure and method of making

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Layer sequence and method of manufacturing a layer sequence

Plastic Conductive Particles and Manufacturing Method Thereof

Component assembly

Semiconductor memory device and defect remedying method thereof

Package having a plurality of mounting orientations

Module board

Clocking architecture in stacked and bonded dice

Packaged integrated circuit

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor device

INTEGRATED CIRCUIT

Semiconductor integrated circuit device and fabrication method for the same

Integrated circuit with re-route layer and stacked die assembly

BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES

Semiconductor device and manufacturing method thereof

Stress buffer layer for packaging process

Semiconductor device and method of manufacturing the same

High frequency device module and manufacturing method thereof

Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component

Stackable integrated circuit package system with multiple interconnect interface

High current semiconductor power device SOIC package

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

Semiconductor components with conductive interconnects

Sensor-type semiconductor package and method for fabricating the same

High Frequency Switch With Low Loss, Low Harmonics, And Improved Linearity Performance

Wiring structure, forming method of the same and printed wiring board

Method for manufacturing a circuit board structure

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Method for fabricating an electronic device substrate

Integrated circuit device and electronic instrument

Conductive pattern formation method

Method and apparatus for manufacturing electronic integrated circuit chip

Leadframe enhancement and method of producing a multi-row semiconductor package

Method of assembling semiconductor devices with LEDS

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Semiconductor device and wire bonding method

Electronic package structure and method

Semiconductor device and method for manufacturing the same

Single-sided, flat, no lead, integrated circuit package

CHIP PACKAGE

BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS

Integrated circuit including conductive bumps

Conductive structure for a semiconductor integrated circuit and method for forming the same

Semiconductor device with resin layers and wirings and method for manufacturing the same

Module comprising a semiconductor chip comprising a movable element

Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package

Semiconductor module, portable device and method for manufacturing semiconductor module

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Integrated package circuit with stiffener

Packaging conductive structure for a semiconductor substrate having a metallic layer

Semiconductor device package with multi-chips and method of the same

Semiconductor device and semiconductor module using the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device

Apparatus for wire bonding and integrated circuit chip package

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Method of manufacturing semiconductor devices encapsulated in chip size packages