Sawn power package and method of fabricating same

Stacked chip package and method for forming the same

Low profile ball grid array (BGA) package with exposed die and method of making same

INTEGRATED CIRCUIT STRUCTURE, DISPLAY MODULE, AND INSPECTION METHOD THEREOF

Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays

Single chip USB packages with swivel cover

Partial Solder Mask Defined Pad Design

Semiconductor package and fabrication process thereof

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

Potted integrated circuit device with aluminum case

High density IC module

Packaging for high power integrated circuits

Cooled Integrated Circuit

Integrated circuit component with passivation layer

Stackable micropackages and stacked modules

Passive placement in wire-bonded microelectronics

Encapsulation type semiconductor device and manufacturing method thereof

Single chip USB packages with contact-pins cover

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip-chip assembly of protected micromechanical devices

Semiconductor Device and Method of Fabricating the Same

Probe arrays and method for making

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Electronic device handler for a bonding apparatus

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Electronic device handler for a bonding apparatus

Systems for testing and packaging integrated circuits

Terminal pad structures and methods of fabricating same

Process for fabricating electronic components using liquid injection molding

Semiconductor device manufacturing method and manufacturing apparatus

Stacked Modules and Method

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Xerographic micro-assembler

Bond pad structures and integrated circuit chip having the same

Semiconductor device and method for manufacturing the same

Stacked Modules and Method

Semiconductor device having a specified terminal layout pattern

Structure and manufacturing method of a chip scale package

CHIP WITH BUMP STRUCTURE

Electronic device with integrated micromechanical contacts and cooling system

I/O Architecture for integrated circuit package

SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT

Device having several contact areas

SIP package with small dimension

WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS

Stacked modules and method

Semiconductor integrated circuit device having reduced terminals and I/O area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device having recessed connector portions

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Materials, structures and methods for microelectronic packaging

Bumping electronic components using transfer substrates

Post passivation interconnection schemes on top of IC chips

Post passivation interconnection schemes on top of IC chips

Method of providing solder bumps on a substrate using localized heating

UNDERFILL DISPENSE AT SUBSTRATE APERTURE

Microbump function assignment in a buck converter

Semiconductor device and an information management system therefor

Gold-Tin Solder Joints Having Reduced Embrittlement

Bonding and probing pad structures

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

Thermally Enhanced BGA Packages and Methods

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device

Edge connect wafer level stacking

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Microelectronic component assemblies and microelectronic component lead frame structures

Dual layer dielectric stack for microelectronics having thick metal lines

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUFACTURING METHOD THEREOF

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Electronic device including a nickel-palladium alloy layer

Memory system topologies including a buffer device and an integrated circuit memory device

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

LAYER FOR CHIP CONTACT ELEMENT

Substrate slot design for die stack packaging

Integrated circuit package system with pad to pad bonding

Semiconductor element comprising a supporting structure and production method

Managing forces of semiconductor device layers

Electronic device and method of manufacturing the same

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

PACKAGE FOR MIXED SIGNAL MCU WITH MINIMAL PIN COUNT

Semiconductor-embedded substrate and manufacturing method thereof

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Pin Array No Lead Package and Assembly Method Thereof

INTERDIGITATED LEADFINGERS

Process of forming an electronic device including an inductor

Fingerprint Sensor and Interconnect

CHIP STRUCTURE

Method of assembling carbon nanotube reinforced solder caps

Device mounting board and semiconductor module

Copper bonding or superfine wire with improved bonding and corrosion properties

Method to form decoupling capacitors on IC chip and the structure thereof

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Apparatus and method incorporating discrete passive components in an electronic package

Wire Bump Material

Elimination of RDL using tape base flip chip on flex for die stacking

Electronic controller

Methods of connecting an antenna to a transponder chip

Semiconductor die module and package and fabricating method of semiconductor package

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

Electronic device and method for production

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Method of identifying and/or programming an integrated circuit

Semiconductor device having sealing film and manufacturing method thereof

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Integrated circuit package system for chip on lead

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

CHIP PACKAGE AND CHIP PACKAGE ARRAY

ELECTRONIC DEVICE AND PRODUCTION METHOD

Semiconductor package and semiconductor system in package using the same

Integrated circuit package system with stacked die

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Module with a shielding and/or heat dissipating element

Methods and materials useful for chip stacking, chip and wafer bonding

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Memory card

Method of testing bonded connections, and a wire bonder

Multi-part capillary

Methods and apparatus to dispense adhesive for semiconductor packaging

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Method of forming an inlay substrate having an antenna wire

Method of actuating implanted medical device

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Programmable system in package

Integrated circuit package system with encapsulation lock

Semiconductor assembly with component attached on die back side

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Pad over active circuit system and method with meshed support structure

Post passivation interconnection schemes on top of IC chip

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Wafer level chip package and a method of fabricating thereof

Modularized Die Stacking System and Method

Stacked die semiconductor device having circuit tape

Integrated circuit devices with multi-dimensional pad structures

Stacked multi-chip package with EMI shielding

METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR

Electronic component package with EMI shielding

Microelectronic component assemblies and microelectronic component lead frame structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Chip-mounted film package

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Chip Comprising at Least One Test Contact Configuration

Electronic packages with fine particle wetting and non-wetting zones

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

Process of fabricating a semiconductor package

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

Methods using die attach paddle for mounting integrated circuit die

Perimeter matrix ball grid array circuit package with a populated center

Extendable connector and network

Method for low temperature bonding and bonded structure

GNSS receiver package

Multi-layered printed circuit board having integrated circuit embedded therein

Pad over active circuit system and method with frame support structure

Wireless IC device and component for wireless IC device

Configurable IC with logic resources with offset connections

Bonding wire and bond using a bonding wire

Semiconductor Component Arrangement

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Post passivation interconnection schemes on top of IC chip

Packaging board, semiconductor module, and portable apparatus

Wafer level chip scale package and method for manufacturing the same

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Methods for packaging and sealing an integrated circuit die

Method for producing a circuit module comprising at least one integrated circuit

Stacked chip package structure with leadframe having bus bar

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Mounting structure for IC tag and IC chip for mounting

Die attach paddle for mounting integrated circuit die

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

INTEGRATED CIRCUIT PACKAGE

Electronic circuit package and fabricating method thereof

Stacked dual MOSFET package

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER

Circuit-connecting material and circuit terminal connected structure and connecting method

Post passivation interconnection schemes on top of IC chip

Semiconductor and method for manufacturing the same

Electrical conductivity bridge in a conductive multilayer article

CHIP LOCATION IDENTIFICATION

Modified chip attach process

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

Microelectronic devices and methods for manufacturing microelectronic devices

Mounting circuit and method for producing semiconductor-chip-mounting circuit

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Multimedia three-dimensional memory module (M3DMM) system

Lead pin for mounting semiconductor and printed wiring board

Printed circuit board

Passive component and electronic component module

High temperature operating package and circuit design

IC package with a protective encapsulant and a stiffening encapsulant

Semiconductor device, relay chip, and method for producing relay chip

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

Semiconductor apparatus and manufacturing method of semiconductor apparatus

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

Semiconductor chip and method for fabricating the same

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

Wire bonding method, wire bonding apparatus and semiconductor device

Multi-chip package with spacer for blocking interchip heat transfer

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Embedded package in package

Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers

Stacked-die electronics package with planar and three-dimensional inductor elements

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Apparatus and method for packaging circuits

Integrated circuit package system with interlock

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

Semiconductor package

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer

Device structures including backside contacts, and methods for forming same

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Circuit-connecting material and circuit terminal connected structure and connecting method

Microball placement solutions

Wire bonders and methods of wire-bonding

Method for low temperature bonding and bonded structure

Interposer bonding device

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Methods for attaching microfeature dies to external devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Methods for a multiple die integrated circuit package

Method for producing semiconductor device

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Au Alloy Bonding Wire

Semiconductor integrated circuit device including semiconductor integrated circuit board supplied with no high voltage

Electric power converter

Peripheral card with sloped edges

HIGH PERFORMANCE IC PACKAGE AND METHOD

Thin flip-chip method

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Top layers of metal for high performance IC's

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor package and method for manufacturing the same

Metal core foldover package structures

Stackable packages for three-dimensional packaging of semiconductor dice

Module and mounted structure using the same

Semiconductive device having improved copper density for package-on-package applications

Systems and methods for low profile die package

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Process of forming a laminate ceramic circuit board

Post passivation interconnection schemes on top of IC chip

Top layers of metal for integrated circuits

Post passivation interconnection schemes on top of IC chips

Method of wire bonding over active area of a semiconductor circuit