Post passivation interconnection schemes on top of IC chips

Post passivation interconnection schemes on top of IC chip

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Packaged integrated circuit having gold removed from a lead frame

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Method for forming filling paste structure of WL package

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Electronic module

THERMAL TRANSFER CONTAINER FOR SEMICONDUCTOR COMPONENT

Plastic overmolded packages with molded lid attachments

Circuit substrate and semiconductor device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process

Post passivation interconnection schemes on top of IC chip

Semiconductor chip structure

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

High performance system-on-chip using post passivation process

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Integrated circuit package and system interface

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

DIE PAD ARRANGEMENT AND BUMPLESS CHIP PACKAGE APPLYING THE SAME

Stackable ceramic FBGA for high thermal applications

Stacked semiconductor components with through wire interconnects (TWI)

Integrated circuit including clip

Integrated circuit package system with waferscale spacer

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Contact array layout for improving ESD capability of CMOS transistors

Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip

Semiconductor element and manufacturing method thereof

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

Interconnect for improved die to substrate electrical coupling

Semiconductor bonding and layer transfer method

Chip package and method for fabricating the same

Multipath soldered thermal interface between a chip and its heat sink

Thermal method to control underfill flow in semiconductor devices

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

INFORMATION RECORDING MEDIUM SUPPLY APPARATUS

Method for setting a reference potential of a current sensor and arrangement for determining the reference potential of a power semiconductor device

Solder elements with columnar structures and methods of making the same

Method for producing a component and device having a component

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Method for embedding a component in a base

Semiconductor integrated circuit device

Web process interconnect in electronic assemblies

Interconnection structure of integrated circuit chip

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

High density electronic packages

Bond Wireless Package

Package structure with leadframe on offset chip-stacked structure

Method of packaging and interconnection of integrated circuits

Electronic device and method for producing a device

Multi-chip structure

Method for producing a module with components stacked one above another

Packaging system for semiconductor devices

Integrated circuit package system with supported stacked die

Package with solder-filled via holes in molding layers

Process for precision placement of integrated circuit overcoat material

Lead frame with included passive devices

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Chip scale package for power devices and method for making the same

Wire-bonding apparatus and wire-bonding method thereof

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Mounting device for electrical component

Post passivation interconnection schemes on top of the IC chips

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

SEMICONDUCTOR MEMORY DEVICE

Structure and method of making sealed capped chips

Integrated circuit package system with down-set die pad and method of manufacture thereof

Thermally Enhanced BGA Package Substrate Structure and Methods

Chip scale package and method for manufacturing the same

METHOD OF PROVIDING INVERTED PYRAMID MULTI-DIE PACKAGE REDUCING WIRE SWEEP AND WEAKENING TORQUES

Method of fabricating microelectronic devices

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Method of assembling displays on substrates

Multiplexed RF isolator

Differential signaling system and method of controlling skew between signal lines thereof

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Power semiconductor devices having integrated inductor

Integrated circuit package-in-package system

Chip-stacked package structure

Side connectors for RFID chip

Carrier board structure with embedded semiconductor chip and fabrication method thereof

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Solder Interconnect Joints For A Semiconductor Package

Versatile Si-based packaging with integrated passive components for mmWave applications

METHOD FOR SEPARATING PACKAGE OF WLP

Integrated circuit component with a surface-mount housing

Integrated circuit package system with molding vents

Plate structure having chip embedded therein and the manufacturing method of the same

Semiconductor package device

Stackable multi-chip package system

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Integrated circuit package system including die stacking

Micro chip-scale-package system

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Integrated circuit package system employing wafer level chip scale packaging

Integrated circuit package-on-package stacking system

Electrical through contact

Method for placing material onto a target board by means of a transfer board

On-chip magnetic components

Post passivation interconnection schemes on top of the IC chips

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Methods of forming electronic structures including conductive shunt layers and related structures

Electronic system modules and method of fabrication

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Electronic packages with roughened wetting and non-wetting zones

Composite photoresist for modifying die-side bumps

Film splicer

Multiplexed RF isolator circuit

Substrate structure integrated with passive components

Display device

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Microelectronic device connection structure

Semiconductor device

Solder bumps in flip-chip technologies

Contact structure having a compliant bump and a test pad

Contact structure having a compliant bump and a testing area

Semiconductor device having bumps in a same row for staggered probing

Substrate structure integrated with passive components

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Package structure having semiconductor chip embedded therein and method for fabricating the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Stress-free lead frame

Array-Processed Stacked Semiconductor Packages

Integrated circuit module and method of forming the same

Memory element and semiconductor device

Nonvolatile memory apparatus

Method for producing an electronic device

Method for self-assembling microstructures

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Single chip USB packages by various assembly methods

Pad structure design with reduced density

Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle

Multi Lead Frame Power Package

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Structure of image sensor module and a method for manufacturing of wafer level package

Method to build robust mechanical structures on substrate surfaces

Electronic component module and radio comunications equipment

Method and apparatus for precisely aligning integrated circuit chips

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip chip mounting process and flip chip assembly

Semiconductor integrated circuit device

Semiconductor device with reduced contact resistance

Electronic component of VQFN design and method for producing the same

BLM structure for application to copper pad

Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Chip having two groups of chip contacts

Heat dissipating semiconductor package and heat dissipating structure thereof

Electronic circuit in a package-in-package configuration and production method

Pillar Bump Package Technology

Hybrid Microelectronic Package

Integrated circuit package system with laminate base

Chip package structure

Interconnect structure for semiconductor package

Integrated circuit package system with offset stacked die

CIRCUIT HAVING A SCHOTTKY CONTACT COMPONENT

Image sensor unit and image sensor apparatus

Structure of image sensor module and a method for manufacturing of wafer level package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Methods and apparatus for packaging integrated circuit devices

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Semiconductor device and an information management system therefor

Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package

Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof

Automatic level adjustment for die bonder

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Integrated circuit mount system with solder mask pad

DEVICE AND METHOD FOR THE PROCESSING OF WAFERS

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

System and method of attenuating electromagnetic interference with a grounded top film

Process for manufacture of thin wafer

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Integrated circuit module

Method for producing a dielectric layer for an electronic component

ESD protection circuit for semiconductor device

Component and method for producing a component

Chip structure

Semiconductor chip structure

Chip structure with redistribution traces

Semiconductor component and method for producing the same

Semiconductor device having pillar-shaped terminal

Methods and apparatus for packaging integrated circuit devices

Semiconductor device, electronic card and pad rearrangement substrate

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor Package Having Improved Adhesion and Solderability

Integrated circuit package system with flashless leads

Electronic assembly and manufacturing method having a reduced need for wire bonds

Integrated circuit package system employing an exposed thermally conductive coating

Post passivation interconnection schemes on top of the IC chips

Arrangement for solder bump formation on wafers

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Compressible films surrounding solder connectors

Structure of high performance combo chip and processing method

Integrated circuit package, panel and methods of manufacturing the same

Advanced Thin Flexible Microelectronic Assemblies and Methods for Making Same

Multilayer printed circuit board

Load driving device

Thermally conductive composite and uses for microelectronic packaging

Misalignment detection devices

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Semiconductor package including dummy board and method of fabricating the same

Stack die packages

Post passivation interconnection schemes on top of the IC chips

Integrated circuit and method for fabricating the same

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Method for bonding wafers to produce stacked integrated circuits

Solderability Improvement Method for Leaded Semiconductor Package

Flip chip package including a non-planar heat spreader and method of making the same

Integrated circuit package system with ground bonds

Composite multi-layer substrate and module using the substrate

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package system with stiffener

Integrated circuit package-in-package system

Electronic module with switching functions and method for producing the same

Thermal release adhesive-backed carrier tapes

Integrated circuit packaging system with ultra-thin die

Flip chip package and method of fabricating the same

Chip package structure and fabricating method thereof

Semiconductor device

Method for production of an integrated circuit bar arrangement, in particular comprising a capacitor assembly, as well as an integrated circuit arrangement

Semiconductor light detecting element includes film which covers light receiving region near main surface of multilayer structure and electrode on main surface

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Bond and method for bonding two contact surfaces

Bonding pad structure and method for making the same

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of IC chip

Method of providing mixed size solder bumps on a substrate using a solder delivery head

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Semiconductor package substrate for flip chip packaging

Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method

Detachable stiffener for ultra-thin die

Method for fabricating a wafer level package with device wafer and passive component integration

Transfer mold solution for molded multi-media card

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices

Wafer-level bonding for mechanically reinforced ultra-thin die

Wafer-level assembly of heat spreaders for dual IHS packages

Singulation Process for Block-Molded Packages

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Semiconductor device and method of manufacturing the semiconductor device

Tapered die-side bumps

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

Sensor unit, especially for fingerprint sensors

Secure electronic entity such as a passport

Integrated circuit incorporating wire bond inductance

Semiconductor device

Stacked, interconnected semiconductor packages

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Multiple-dies semiconductor device with redistributed layer pads

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Integrated circuit (IC) chip and method for fabricating the same

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

Semiconductor device having an inductor

IC chip, antenna, and manufacturing method of the IC chip and the antenna

Chip stack, chip stack package, and method of forming chip stack and chip stack package

System-in-package structure

Flipped, stacked-chip IC packaging for high bandwidth data transfer buses

Flexible joint methodology to attach a die on an organic substrate

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Electronic package and semiconductor device using the same

Exposed top side copper leadframe manufacturing

Method of fabricating an integrated circuit with etched ring and die paddle

Printed circuit board and method of manufacturing the same

COMPLIANT ELECTRICAL CONTACTS

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods of operating electronic devices, and methods of providing electronic devices

Capping of metal interconnects in integrated circuit electronic devices

Manufacturing method for a leadless multi-chip electronic module

Method for bonding semiconductor chip

Diamond composite heat spreader and associated methods