212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Au bonding wire for semiconductor device
#11102Isolated conductive leads extending across to opposite sides of IC
#11103SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#11104Integrated circuit package system with offset stack
#11105SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#11106RF power transistor having an encapsulated chip package
#11107Three dimensional integrated circuit and method of making the same
#11108Compliant integrated circuit package substrate
#11109Semiconductor package having functional and auxiliary leads, and process for fabricating it
#11110Integrated Circuits Having Controlled Inductances
#11111RF INTEGRATED CIRCUIT WITH ESD PROTECTION AND ESD PROTECTION APPARATUS THEREOF
#11112Micro universal serial bus (USB) memory package
#11113Molding methods to manufacture single-chip chip-on-board USB device
#11114Top layers of metal for high performance IC's
#11115Top layers of metal for high performance IC's
#11116Microelectronic assembly with back side metallization and method for forming the same
#11117Method for manufacturing semiconductor device
#11118Manufacturing method of semiconductor device
#11119METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE
#11120IC packages with internal heat dissipation structures
#11121Interposer containing bypass capacitors for reducing voltage noise in an IC device
#11122Micro power converter and method of manufacturing same
#11123Integrated circuit and method for writing information
#11124NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
#11125Integrated circuit (IC) package stacking and IC packages formed by same
#11126Multilayer bonding ribbon
#11127Resin Paste For Die Bonding And Its Use
#11128Top layers of metal for high performance IC's
#11129INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#11130Via layout with via groups placed in interlocked arrangement
#11131Top layers of metal for high performance IC's
#11132Top layers of metal for high performance IC's
#11133Top layers of metal for high performance IC's
#11134Top layers of metal for high performance IC's
#11135Top layers of metal for high performance IC's
#11136Top layers of metal for high performance IC's
#11137Top layers of metal for high performance IC's
#11138Top layers of metal for high performance IC's
#11139Top layers of metal for high performance IC's
#11140Top layers of metal for high performance IC's
#11141Top layers of metal for high performance IC's
#11142Method for manufacturing an electronic component and corresponding electronic component
#11143Printed circuit board for package of electronic components and manufacturing method thereof
#11144CHIP STRUCTURE
#11145Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#11146Electrically conductive connection, electronic component and method for their production
#11147Stacking structure of chip package
#11148Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
#11149Surface mounting structure and packaging method thereof
#11150Thermal improvement for hotspots on dies in integrated circuit packages
#11151DIE STACK CAPACITORS, ASSEMBLIES AND METHODS
#11152Carrier for stacked type semiconductor device and method of fabricating the same
#11153Nested integrated circuit package on package system
#11154IC chip package, and image display apparatus using same
#11155Package-on-package system
#11156Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
#11157Coreless cavity substrates for chip packaging and their fabrication
#11158Top layers of metal for high performance IC's
#11159Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#11160Fabrication method of semiconductor integrated circuit device
#11161Electronic device and production method thereof
#11162Semiconductor package and method of assembling the same
#11163Method of manufacturing an integrated circuit
#11164Methods of manufacturing microelectronic imaging units on a microfeature workpiece
#11165Method for manufactuing a semiconductor integrated circuit device
#11166Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
#11167Wiring module
#11168Magnetic shielding for magnetic random access memory
#11169Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#11170Chip and flat panel display apparatus comprising the same
#11171Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag
#11172STACKED CHIP PACKAGE
#11173Top layers of metal for high performance IC's
#11174Top layers of metal for high performance IC's
#11175Top layers of metal for high performance IC's
#11176Top layers of metal for high performance IC's
#11177Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#11178Semiconductor device having improved contacts
#11179Top layers of metal for high performance IC's
#11180Method of making thermally enhanced substrate-base package
#11181Flip-chip bonding structure using multi chip module-deposited substrate
#11182Integrated circuit package system with post-passivation interconnection and integration
#11183Mounting integrated circuit dies for high frequency signal isolation
#11184Semiconductor device
#11185Stacked die package system
#11186DEVICE EMBEDDED WITH SEMICONDUCTOR CHIP AND STACK STRUCTURE OF THE SAME
#11187Semiconductor integrated circuit device, and method of designing and manufacturing the same
#11188Methods and apparatus for thermal management in a multi-layer embedded chip structure
#11189Semiconductor device with improved high current performance
#11190Interconnections resistant to wicking
#11191Methods and apparatus for a semiconductor device package with improved thermal performance
#11192Semiconductor device having a bonding pad and fuse and method for forming the same
#11193SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#11194INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#11195Wire bonding method for forming low-loop profiles
#11196HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#11197SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
#11198Resonating conductive traces and methods of using same for bonding components
#11199Structure comprising 3-dimensional integrated circuit architecture, circuit structure, and instructions for fabrication thereof
#11200Advanced multilayer coreless support structures and method for their fabrication
#11201Top layers of metal for high performance IC's
#11202Top layers of metal for high performance IC's
#11203Top layers of metal for high performance IC's
#11204Top layers of metal for high performance IC's
#11205METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#11206Multiple row exposed leads for MLP high density packages
#11207Chip stack package and manufacturing method thereof
#11208Semiconductor device encapsulated with resin composition
#11209Self assembly of elements for displays
#11210On-chip inductor using redistribution layer and dual-layer passivation
#11211Slew-rate control apparatus and methods for a power transistor to reduce voltage transients during inductive flyback
#11212Stacked contact bump
#11213Microelectronic element chips
#11214Semiconductor device
#11215Top layers of metal for high performance IC's
#11216Top layers of metal for high performance IC's
#11217Top layers of metal for high performance IC's
#11218Top layers of metal for high performance IC's
#11219Top layers of metal for high performance IC's
#11220Top layers of metal for high performance IC's
#11221Top layers of metal for high performance IC's
#11222Top layers of metal for high performance IC's
#11223Interlayer dielectric and pre-applied die attach adhesive materials
#11224Top layers of metal for high performance IC's
#11225Process to reform a plastic packaged integrated circuit die
#11226Ball grind array package structure
#11227Multilayer electronic component, electronic device, and method for producing multilayer electronic component
#11228Semiconductor circuit arrangement
#11229Semiconductor package structure having enhanced thermal dissipation characteristics
#11230Integrated circuit package system with edge connection system
#11231Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
#11232Chip stack, method of fabrication thereof, and semiconductor package having the same
#11233Modular bonding pad structure and method
#11234Electronic assemblies and systems with filled no-flow underfill
#11235Semiconductor integrated circuit device
#11236Multiple die stack apparatus employing T-shaped interposer elements
#11237Semiconductor device having a bonding wire and method for manufacturing the same
#11238Stacked package electronic device
#11239Stackable multi-chip package system
#11240Side stacking apparatus and method
#11241Circuit Arrangement, System Carrier and Methods for Producing Same
#11242Microelectronic package having solder-filled through-vias
#11243Leadframe IC packages having top and bottom integrated heat spreaders
#11244Self-aligned wafer level integration system
#11245Method and structure for improving the reliability of leadframe integrated circuit packages
#11246Electric circuit device and related manufacturing method
#11247Semiconductor device with reduced parasitic inductance
#11248Spring connector for making electrical contact at semiconductor scales
#11249Contact surrounded by passivation and polymide and method therefor
#11250Fabrication method of semiconductor device
#11251Separation method of semiconductor device
#11252Non-cyanide gold electroplating for fine-line gold traces and gold pads
#11253Integrated circuit, and a mobile phone having the integrated circuit
#11254Semiconductor integrated circuit device with power lines improved
#11255Interconnect structure and formation for package stacking of molded plastic area array package
#11256Semiconductor component with connecting elements and method for producing the same
#11257Top layers of metal for high performance IC's
#11258Top layers of metal for high performance IC's
#11259Top layers of metal for high performance IC's
#11260Top layers of metal for high performance IC's
#11261Top layers of metal for high performance IC's
#11262Top layers of metal for high performance IC's
#11263Top layers of metal for high performance IC's
#11264Top layers of metal for high performance IC's
#11265Top layers of metal for high performance IC's
#11266Top layers of metal for high performance IC's
#11267Method of wire bonding over active area of a semiconductor circuit
#11268Device Comprising Circuit Elements Connected By Bonding Bump Structure
#11269Integrated circuit package having exposed thermally conducting body
#11270Semiconductor device
#11271Double sided semiconduction device with edge contact and package therefor
#11272Semiconductor device
#11273SYSTEM IN PACKAGE MODULE
#11274METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#11275Multilayer dielectric substrate and semiconductor package
#11276SENSOR SEMICONDUCTOR DEVICE
#11277Power semiconductor module
#11278Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device
#11279Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#11280System and Method for Low Temperature Plasma Enhanced Bonding
#11281High density integrated circuit apparatus, test probe and methods of use thereof
#11282Ball grid array rework using a continuous belt furnace
#11283Electronic components with plurality of contoured microelectronic spring contacts
#11284Method of providing solder bumps using reflow in a forming gas atmosphere
#11285Semiconductor device having post-mold nickel/palladium/gold plated leads
#11286Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#11287Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
#11288Method and apparatus for forming an electrical connection to a semiconductor substrate
#11289METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#11290Conductive lithographic polymer and method of making devices using same
#11291Electronic device substrate, electronic device and methods for making same
#11292Multi-channel optical receiver module
#11293Electronic device substrate, electronic device and methods for fabricating the same
#11294Heat sink electronic package having compliant pedestal
#11295SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
#11296Stub-tuned wirebond package
#11297Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#11298Integrated circuit package and multi-layer lead frame utilized
#11299Integrated circuit having pads and input/output (I/O) cells
#11300Metallization layer for a power semiconductor device
#11301INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
#11302Dual-sided chip attached modules
#11303Semiconductor device including electrically conductive bump and method of manufacturing the same
#11304Semiconductor device having low dielectric insulating film and manufacturing method of the same
#11305Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
#11306PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES
#11307Semiconductor device and method of manufacturing the same
#11308No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#11309Integrated circuit package system with different mold locking features
#11310Dual side cooling integrated power device module and methods of manufacture
#11311Integrated circuit having stress tuning layer
#11312Top layers of metal for high performance IC's
#11313Methods and apparatus having an integrated circuit attached to fused silica
#11314Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component
#11315Method and apparatus for automatically detecting and correcting misalignment of a semiconductor chip
#11316Integrated circuit chip packaging
#11317Method and apparatus for locating and/or forming bumps
#11318Micro-package, multi-stack micro-package, and manufacturing method therefor
#11319Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#11320Super high density module with integrated wafer level packages
#11321Semiconductor input control device
#11322Electronic subassembly, electronic assembly, and method for producing an electronic assembly
#11323Integrated circuit package system with contoured encapsulation
#11324Method for fabricating semiconductor package with multi-layer die contact and external contact
#11325Semiconductor device
#11326Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
#11327Semiconductor device and method of producing the same
#11328Top layers of metal for high performance IC's
#11329Top layers of metal for high performance IC's
#11330Top layers of metal for high performance IC's
#11331Top layers of metal for high performance IC's
#11332Top layers of metal for high performance IC's
#11333Top layers of metal for high performance IC's
#11334Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device
#11335Circuit board, method for manufacturing the same, and semiconductor device
#11336Stacked bump structure and manufacturing method thereof
#11337Heat sink structure for embedded chips and method for fabricating the same
#11338COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#11339Method of fabricating microelectronic devices
#11340THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#11341INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#11342Integrated circuit device with semiconductor device components embedded in plastic housing composition
#11343Semiconductor device having shifted stacked chips
#11344Devices and systems having at least one dam structure
#11345Integrated circuit encapsulation system with vent
#11346Thermoset polyimides for microelectronic applications
#11347Semiconductor Device
#11348Power semiconductor module
#11349Interconnection structure, electronic component and method of manufacturing the same
#11350Printed circuit board
#11351Inductor and electric power supply using it
#11352Semiconductor module
#11353SEMICONDUCTOR MODULE
#11354Increased interconnect density electronic package and method of fabrication
#11355METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL
#11356Semiconductor device including a buffer layer structure for reducing stress
#11357Process for forming bumps and solder bump
#11358CHIP PACKAGE
#11359Test pads on flash memory cards
#11360Wafer level stack structure for system-in-package and method thereof
#11361Multiple chip package module and method of fabricating the same
#11362Semiconductor device and method for manufacturing same
#11363System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
#11364Low resistance integrated MOS structure
#11365Transducer and method for mounting the same
#11366CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
#11367Method of making a radio frequency identification (RFID) tag
#11368Process for bonding and electrically connecting microsystems integrated in several distinct substrates
#11369Systems and methods for high density multi-component modules
#11370Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
#11371Method of forming stackable package
#11372Method of making wirebond electronic package with enhanced chip pad design
#113733D interconnect with protruding contacts
#11374Semiconductor package-on-package system including integrated passive components
#11375Encapsulation for particle entrapment
#11376Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown
#11377Attaching heat sinks to integrated circuit packages
#11378Array capacitors with voids to enable a full-grid socket
#11379Oriented self-location of microstructures with alignment structures
#11380Wirebond pad for semiconductor chip or wafer
#11381Method for forming C4 connections on integrated circuit chips and the resulting devices
#11382Circuit Apparatus
#11383Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#11384SEMICONDUCTOR DEVICE PACKAGE
#11385SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME
#11386PACKAGE-ON-PACKAGE STRUCTURES
#11387Stackable integrated circuit structures and systems devices and methods related thereto
#11388Molded SiP package with reinforced solder columns
#11389Circuit apparatus and method of fabricating the apparatus
#11390Packaging of integrated circuits to lead frames
#11391Light emitting diode package with direct leadframe heat dissipation
#11392System and method for providing a power bus in a wirebond leadframe package
#11393Semiconductor device
#11394Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#11395Electric circuit device, electric circuit module, and power converter
#11396Polymer matrices for polymer solder hybrid materials
#11397Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same
#11398Carrierless chip package for integrated circuit devices, and methods of making same
#11399Method of manufacturing a semiconductor package
#11400Semiconductor die package including multiple dies and a common node structure