212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
DOUBLE-SIDED MONOLITHICALLY INTEGRATED OPTOELECTRONIC MODULE WITH TEMPERATURE COMPENSATION
#11402Integrated circuit devices with stacked package interposers
#11403Power semiconductor component, power semiconductor device as well as methods for their production
#11404IC chip package with minimized packaged-volume
#11405SEMICONDUCTOR DEVICE
#11406Wafer level semiconductor module and method for manufacturing the same
#11407Hard disk drive preamp heat dissipation methods
#11408Utra-thin substrate package technology
#11409Semiconductor components having encapsulated through wire interconnects (TWI)
#11410Embedded integrated circuit package-on-package system
#11411Leadframe enhancement and method of producing a multi-row semiconductor package
#11412Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#11413Embedded integrated circuit package system
#11414MULTI-DIE INDUCTOR
#11415Fill head for injection molding of solder
#11416Universal mold for injection molding of solder
#11417Tail wire cutting method and bonding apparatus
#11418Method for Electroplating and Contact Projection Arrangement
#11419Fabrication method for electronic system modules
#11420FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
#11421Method for manufacturing a programmable system in package
#11422Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test
#11423Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
#11424Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#11425Flip-chip mounting method and bump formation method
#11426Method of wafer level chip size packaging
#11427Electronic device with lead-free metal thin film formed on the surface thereof
#11428Semiconductor memory device and defect remedying method thereof
#11429Configurable IC's with logic resources with offset connections
#11430Chip package
#11431Solder joint flip chip interconnection having relief structure
#11432Programmable system in package
#11433Conductive structures including titanium-tungsten base layers
#11434Conductive structure for electronic device
#11435Stacked integrated circuit package-in-package system
#11436Electronic component package
#11437Direct-write wafer level chip scale package
#11438Stacked integrated circuit package-in-package system
#11439MULTICHIP PACKAGE SYSTEM
#11440Optical display package and the method thereof
#11441Semiconductor device package with base features to reduce leakage
#11442Etched leadframe flipchip package system
#11443Methods and systems for releasably attaching support members to microfeature workpieces
#11444Circuit device
#11445Methods of Fabricating Application Specific Integrated Circuit (ASIC) Devices that Include Both Pre-Existing and New Integrated Circuit Functionality and Related ASIC Devices
#11446Semiconductor device and method of producing the same
#11447NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
#11448Method for bonding a semiconductor substrate to a metal substrate
#11449Transfer tape strap process
#11450Apparatus and method for signal bus line layout in semiconductor device
#11451Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
#11452Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#11453Method for fabricating a transformer integrated with a semiconductor structure
#11454Bonding Wire and Integrated Circuit Device Using the Same
#11455Semiconductor die packages using thin dies and metal substrates
#11456Hybrid stacking package system
#11457INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
#11458Chip with power and signal pads connected to power and signal lines on substrate
#11459Space transformer having multi-layer pad structures
#11460High frequency IC package and method for fabricating the same
#11461Integrated circuit package system with wire bond pattern
#11462Single package wireless communication device
#11463Hybrid flip-chip and wire-bond connection package system
#11464Integrated circuit package system with heatspreader
#11465Integrated circuit package system with ground ring
#11466Packaged system of semiconductor chips having a semiconductor interposer
#11467Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation
#11468Integrated circuit package system with net spacer
#11469Method, system, and apparatus for filling vias
#11470Chip scale surface mount package for semiconductor device and process of fabricating the same
#11471Semiconductor device and method of manufacturing the same
#11472SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION
#11473Wire bonding capillary tool having multiple outer steps
#11474Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#11475Multichip package system
#11476Multiple flip-chip integrated circuit package system
#11477Method for fabricating a transformer integrated with a semiconductor structure
#11478Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
#11479Semiconductor device having adhesion increasing film to prevent peeling
#11480Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#11481Method for forming passivation layer
#11482Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#11483Methods and materials useful for chip stacking, chip and wafer bonding
#11484Room temperature metal direct bonding
#11485Cured mold compound spacer for stacked-die package
#11486Semiconductor device manufacturing method
#11487Method of manufacturing semiconductor device
#11488Flexible interconnect pattern on semiconductor package
#11489Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
#11490Barrier for use in 3-D integration of circuits
#11491Fabrication method of semiconductor integrated circuit device
#11492Conductor structure on dielectric material
#11493Semiconductor Module with Serial Bus Connection to Multiple Dies
#11494Semiconductor Module with Serial Bus Connection to Multiple Dies
#11495Adjustable thickness thermal interposer and electronic package utilizing same
#11496Circuit device
#11497Integrated phased array antenna
#11498Stacked integrated circuit package system with connection protection
#11499Carbon nanotube via interconnect
#11500Piezoelectric device and method for manufacturing the same
#11501UNIVERSAL CHIP PACKAGE STRUCTURE
#11502Isolating chip-to-chip contact
#11503Semiconductor device with guard rings that are formed in each of the plural wiring layers
#11504Semiconductor chip comprising a metal coating structure and associated production method
#11505Ball grid array housing having a cooling foil
#11506Semiconductor packaging unit with sliding cage
#11507Semiconductor chip having fine pitch bumps and bumps thereon
#11508Interconnect structure with stress buffering ability and the manufacturing method thereof
#11509Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer
#11510Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#11511Stacked integrated circuit
#11512MEMS device wafer-level package
#11513Integrated circuit die with pedestal
#11514Semiconductor device with lead frames
#11515Semiconductor device including a DC-DC converter
#11516Edge coating a microelectronic device
#11517Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
#11518Integrated-circuit chip with offset external pads and method for fabricating such a chip
#11519Grounding structure of semiconductor device including a conductive paste
#11520Semiconductor module with current connection element
#115213-dimensional integrated circuit architecture, structure and method for fabrication thereof
#11522Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#11523Method and arrangement for forming a microelectronic package
#11524Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#11525Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#11526Solder layer and electronic device bonding substrate and submount using the same
#11527Connecting device for electronic components
#11528Multilayer printed circuit board
#11529HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#11530Method of packaging integrated circuit devices using preformed carrier
#11531Resin Paste for Die Bonding
#11532System for making a semiconductor device using bump material including liquid
#11533Semiconductor device and medium of fabricating the same
#11534Single passivation layer scheme for forming a fuse
#11535Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste
#11536Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#11537Reactive foil assembly
#11538Semiconductor Module with Serial Bus Connection to Multiple Dies
#11539On-die bond wires system and method for enhancing routability of a redistribution layer
#11540Semiconductor device and fabrication process thereof
#11541Semiconductor integrated circuit device
#11542Structure and method to improve current-carrying capabilities of C4 joints
#11543Chip package
#11544Method for precision assembly of integrated circuit chip packages
#11545Semiconductor Module With Serial Bus Connection to Multiple Dies
#11546Semiconductor components with through wire interconnects
#11547Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions
#11548Semiconductor device and a method of manufacturing the same
#11549Semiconductor devices and electrical parts manufacturing using metal coated wires
#11550Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#11551Crystalline semiconductor film, semiconductor device, and method for manufacturing thereof
#11552Semiconductor integrated circuit device
#11553Semiconductor component having test pads and method and apparatus for testing same
#11554Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11555Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#11556Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
#11557Stacked integrated circuit package-in-package system
#11558Method for manufacturing bump of wafer level package
#11559Semiconductor wafer coat layers and methods therefor
#11560Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
#11561INTEGRATED CIRCUIT PACKAGE HAVING STACKED INTEGRATED CIRCUITS AND METHOD THEREFOR
#11562Microelectronic devices and methods for manufacturing microelectronic devices
#11563Semiconductor component having test pads and method and apparatus for testing same
#11564Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#11565Wafer level packaging structure with inductors and manufacture method thereof
#11566Fiducial scheme adapted for stacked integrated circuits
#11567Flip-chip type semiconductor device
#11568Low thermal resistance assembly for flip chip applications
#11569Carrierless chip package for integrated circuit devices, and methods of making same
#11570Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
#11571Integrated Circuit Chip With Electrostatic Discharge Protection Device
#11572METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#11573Integrated circuit package system
#11574Low profile semiconductor package-on-package
#11575Multichip package system
#11576Integrated circuit package on package system
#11577Integrated circuit package-in-package system
#11578Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#11579Semiconductor device
#11580Semiconductor package containing multi-layered semiconductor chips
#11581Connecting a plurality of bond pads and/or inner leads with a single bond wire
#11582Chip Package Structure
#11583Chip package and wafer treating method for making adhesive chips
#11584Method for making QFN package with power and ground rings
#11585Semiconductor chip assembly
#11586Chip packaging structure for improving reliability
#11587Semiconductor chip for producing a controllable frequency
#11588GaAs integrated circuit device and method of attaching same
#11589Method of self-assembly on a surface
#11590Wire bonding method for preventing polymer cracking
#11591Method, system, and apparatus for gravity assisted chip attachment
#11592Method and structure for improving bonding reliability in bond pads
#11593Method for planarizing vias formed in a substrate
#11594Method for fabricating a semiconductor package
#11595Method for manufacturing semiconductor device
#11596Method and device including reworkable alpha particle barrier and corrosion barrier
#11597Method for manufacturing semiconductor device
#11598Perforated embedded plane package and method
#11599Wafer level chip scale package system with a thermal dissipation structure
#11600Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
#11601Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
#11602MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
#11603Semiconductor device packaging
#11604SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#11605Composite bump
#11606Multi-chip package
#11607Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#11608Method of forming a bump and a connector structure having the bump
#11609Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems
#11610Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
#11611Integrated circuit package on package system
#11612Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#11613Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods
#11614Semiconductor device
#11615Integrated circuit package system having interconnect stack and external interconnect
#11616Stacked microelectronic device assemblies
#11617Integrated device having a plurality of chip arrangements and method for producing the same
#11618Stacked integrated circuits package system with passive components
#11619Package structure for electronic device
#11620Warp compensated package and method
#11621Gold-bumped interposer for vertically integrated semiconductor system
#11622Integrated circuit package system
#11623Integrated circuit package in package system
#11624Embedded chip package structure with chip support protruding section
#11625Semiconductor package system with substrate having different bondable heights at lead finger tips
#11626GaAs power transistor
#11627Stacked image sensor optical module and fabrication method
#11628Integrated circuit leaded stacked package system
#11629Combined board level EMI shielding and thermal management
#11630Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#11631Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#11632Ball grid array substrate having window and method of fabricating same
#11633Method for forming reinforced interconnects on a substrate
#11634Wafer bonding of damascene-patterned metal/adhesive redistribution layers
#11635SiP module with a single sided lid
#11636PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES
#11637FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#11638Optical device and method for manufacturing the same
#11639Method for embedding a component in a base
#11640Integrating a heat spreader with an interface material having reduced void size
#11641Electronic substrate, semiconductor device, and electronic device
#11642Semiconductor device
#11643Chip package and method for fabricating the same
#11644Stacked semiconductor device and device stacking method
#11645Layer between interfaces of different components in semiconductor devices
#11646Composite board with semiconductor chips and plastic housing composition and method
#11647Solder bump structure for flip chip package and method for manufacturing the same
#11648Bond pad structure for wire bonding
#11649Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means
#11650Chip-size package structure and method of the same
#11651Semiconductor package structure and method for manufacturing the same
#11652MEMS microphone with a stacked PCB package and method of producing the same
#11653Active matrix display in which LDD regions in the driver circuit and the storage capacitor in the pixel section have the same dopant concentration
#11654Adhesive compositions containing cyclic siloxanes and methods for use thereof
#11655Compliant wirebond pedestal
#11656Circuit device and method of manufacturing the same
#11657TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS
#11658STACKED CONTACT BUMP
#11659MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#11660Semiconductor packaging method
#11661Capacitor attachment method
#11662Semiconductor package
#11663Method for fabricating stacked semiconductor components with through wire interconnects
#11664Discrete bootstrapping in an optical receiver to prevent signal feedback
#11665Semiconductor device with semiconductor device components embedded in plastic package compound
#11666Stackable integrated circuit package system with multiple interconnect interface
#11667System for fabricating semiconductor components with through wire interconnects
#11668Electronic assembly and method for forming the same
#11669Stacked integrated circuit package system
#11670Post passivation interconnection schemes on top of the IC chips
#11671Redistribution connecting structure of solder balls
#11672Flip-Chip Device Having Underfill in Controlled Gap
#11673Bond pad structures with reduced coupling noise
#11674Stackable integrated circuit package system
#11675Chip underfill in flip-chip technologies
#11676Heat sink for semiconductor package
#11677Thermally-enhanced ball grid array package structure and method
#11678Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
#11679Chip stack package
#11680Board strip and method of manufacturing semiconductor package using the same
#11681INTEGRATED CIRCUIT CHIP AND PACKAGE
#11682Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#11683No lead package with heat spreader
#11684Multi-row lead frame
#11685Integrated circuit package system including die stacking
#11686Transmission line substrate and semiconductor package
#11687Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
#11688CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE
#11689Entire encapsulation of Cu interconnects using self-aligned CuSiN film
#11690Wafer-leveled chip packaging structure and method thereof
#11691Processed wafer via
#11692Flip chip in package using flexible and removable leadframe
#11693Method of resin sealing electronic part
#11694Semiconductor device and manufacturing the same
#11695Stacked chip-based system and method
#11696Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
#11697Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
#11698DC/DC converter
#11699Method of obtaining enhanced localized thermal interface regions by particle stacking
#11700Integrated circuit package system with L-shaped leadfingers