Integrated circuit package system with bonding lands

Cap layer for an aluminum copper bond pad

Integrated circuit architecture for reducing interconnect parasitics

Apparatus for integrated input/output circuit and verification method thereof

Ball grid array package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic circuit, a semiconductor device and a mounting substrate

Semiconductor package including transformer or antenna

Single-chip and multi-chip module for proximity communication

Integrated circuit package system with die on base package

Stacked integrated circuit package-in-package system with recessed spacer

Semiconductor module and method of manufacturing the same

Semiconductor device

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Facility and method for high-performance circuit board connection

Method of manufacturing circuit device

Wired circuit board and production method thereof

Hermetically sealed ceramic package

Low profile compliant leads

Printed board with a pin for mounting a component

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Method for manufacturing a substrate with cavity

Electronic device and method of manufacturing the same

Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor

Wafer level chip packaging

Integrated circuit package system with exposed interconnects

Method of manufacturing semiconductor device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Image sensor packaging structure and method of manufacturing the same

Positively radiation-sensitive resin composition

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME

Electronic assembly with detachable components

Semiconductor device having improved wire-bonding reliability and method of manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

Nanoscale probes for electrophysiological applications

Integrated circuit package system with heat sink

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Package on package design a combination of laminate and tape substrate, with back-to-back die combination

Connection structure and method for fabricating the same

Method of fabricating a 3-D package stacking system

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Patterned gold bump structure for semiconductor chip

Chip with bump structure

Package on package design a combination of laminate and tape substrate

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Coreless substrate and manufacturing thereof

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Wire bond and redistribution layer process

Method of producing a semiconductor device by forming an oxide film on a resin layer

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Component mounting method, component mounting apparatus, and ultrasonic bonding head

Printed wiring board with component mounting pin and electronic device using the same

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Ceramic multilayer substrate

Active area bonding compatible high current structures

Methods of forming metal layers using multi-layer lift-off patterns

Method for fabricating semiconductor package

Solder bump confinement system for an integrated circuit package

Method of fabricating wafer level package

Die attaching method

Nanoscale metal paste for interconnect and method of use

Apparatus and method for manufacturing semiconductor device

METHOD OF INSPECTING LAMINATED ASSEMBLY AND METHOD OF INSPECTING HEAT SPREADER MODULE

Image sensing microelectronic device with glass tilt control features, and various methods of making same

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

CHIP CONNECTOR

Integrated circuit package system including zero fillet resin

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Solder bump on a semiconductor substrate

Semiconductor device with an improved solder joint

Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device having through contact blocks with external contact areas

Module part

Stacked integrated circuit package system with face to face stack configuration

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Integrated circuit package system with leadfinger support

Capacitor and manufacturing method thereof

Electronic module with stacked semiconductors

Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same

Semiconductor device having an antenna with anisotropic conductive adhesive

LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES

Magnetic alignment of integrated circuits to each other

Bond capillary design for ribbon wire bonding

Method for setting capillary contact position data and wire bonding apparatus using the same

Component mounting method and component mounting apparatus

Direct write# system

Electronic circuit module and method for fabrication thereof

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Fabrication of an integrated circuit package

Method of packaging semiconductor die without lead frame or substrate

Thermal enhanced package

Hybrid multilayer substrate and method for manufacturing the same

Micromechanical Getter Anchor

Method and apparatus for current and temperature measurement in an electronic power circuit

Probe For Semiconductor Devices

Circuit device

Low temperature co-fired ceramic module and method of manufacturing the same

Structure and method for bond pads of copper-metallized integrated circuits

Semiconductor device

Semiconductor device having tin-based solder layer and method for manufacturing the same

Bonding pad structure

Wafer level chip scale package having a gap and method for manufacturing the same

Thin integrated circuit device packages for improved radio frequency performance

Integrated circuit underfill package system

Semiconductor package

Waferscale package system

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Semiconductor module having a semiconductor chip stack and method

Semiconductor die assembly

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS

Multi-chips module package and manufacturing method thereof

Aluminum leadframes for semiconductor QFN/SON devices

Wafer level package having floated metal line and method thereof

Method of manufacturing multi-layer wiring board

Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device

Tooling for coupling multiple electronic chips

Mold flash removal process for electronic devices

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Apparatus for solder crack deflection

Semiconductor device and method for fabricating the same

Composite integrated device and methods for forming thereof

Semiconductor interconnect having adjacent reservoir for bonding and method for formation

Multilayer integrated circuit for RF communication and method for assembly thereof

Silicon-diamond composite heat spreader and associated methods

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Low profile semiconductor system having a partial-cavity substrate

Integrated circuit package system including wide flange leadframe

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Integrated circuit package system

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device having flange structure

Padless die support integrated circuit package system

Integrated circuit package system with multiple molding

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Integrated circuit capable of operating at different supply voltages

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Semiconductor devices and methods of manufacture thereof

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Circuit board and package structure thereof

Multi-chip stack package and fabricating method thereof

Electronic component and method for its assembly

Method of forming a microelectronic package and microelectronic package formed according to the method

Dicing/die bonding film and method of manufacturing the same

Nonvolatile memory system

Interconnection pattern design

Semiconductor device and electric apparatus

Circuit device

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Power configuration method for structured ASICs

BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Semiconductor package and fabricating method thereof

Integrated circuit having second substrate to facilitate core power and ground distribution

Method of wire bonding over active area of a semiconductor circuit

Interconnects with interlocks

Semiconductor device having alignment post electrode and method of manufacturing the same

Semiconductor wafer scale package system

Managed memory component

Wireless IC device and component for wireless IC device

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package with integrated heatsink and electromagnetic shield

Leadless lead-frame

Low cost method to produce high volume lead frames

Semiconductor package and process for making the same

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Strip for integrated circuit packages having a maximized usable area

Stacked module and manufacturing method thereof

Back-to-front via process

Methods of forming back side layers for thinned wafers

Method of manufacturing wiring substrate

Semiconductor device package and method for manufacturing same

Manufacturing method for electronic device

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Adhesion method using gray-scale photolithography

Printed circuit board and method of manufacturing semiconductor package using the same

Millimeter-wave radar apparatus and millimeter radar system using the same

Arrangement and method impedance matching

Semiconductor integrated circuit device having pads respectively provided with pad portions

Method for fabricating semiconductor package with build-up layers formed on chip

Inter-stacking module system

Semiconductor device having a plurality of semiconductor constructs

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Through-hole contacts in a semiconductor device

Thermally balanced via

Pad layout

Electrical connections made with dissimilar metals

Integrated circuit package system including stacked die

Connecting module having passive components

Managed memory component

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Contact spring application to semiconductor devices

Multi-chip ball grid array package and method of manufacture

Electronic circuit package

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Multi-chip package system

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Interconnected IC packages with vertical SMT pads

Overhang integrated circuit package system

Device for implementing an inverter having a reduced size

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Method for gluing a circuit component to a circuit substrate

Interconnect circuitry, multichip module, and methods of manufacturing thereof

Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

System and method for solder bumping using a disposable mask and a barrier layer

Method for manufacturing high-frequency module device

Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Wafer-level processing of chip-packaging compositions including bis-maleimides

Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Electronic component assemblies with electrically conductive bonds

Electronic circuit package

Micro electro mechanical system, semiconductor device, and manufacturing method thereof

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Methods including fluxless chip attach processes

Super high-density module with integrated wafer level packages

Forced heat transfer apparatus for heating stacked dice

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Stacked-type chip package structure

Multi-die package and method for fabricating same

Low stress stacked die packages

Dual die package with high-speed interconnect

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Method of fabricating passivation

Test pads on flash memory cards

Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same

System, apparatus, and method for advanced solder bumping

Electronic micromodule and method for manufacturing the same

System and method for flip chip substrate pad

Nanostructure-based package interconnect

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Microelectronic devices and methods for manufacturing microelectronic devices

Low temperature bumping process

Electronic circuit device and manufacturing method thereof

Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Semiconductor device having a metal plate conductor

Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency

Semiconductor device

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Super high-density module with integrated wafer level packages

Techniques for packaging multiple device components

Hermetically sealed integrated circuits and method

Package having exposed integrated circuit device

Plating bar design for high speed package design

Circuit board, semiconductor device, and manufacturing method of circuit board

Three-dimensional integrated circuit structure

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRICAL APPARATUS

Method for fabricating a probing pad of an integrated circuit chip

Methods of fabricating interconnects for semiconductor components

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Method for manufacturing IC-embedded substrate

Leadframe and method of manufacturing the same

Stackable molded packages and methods of making the same

Chip on a board

Wafer-level flipchip package with IC circuit isolation

Semiconductor chip, film substrate, and related semiconductor chip package

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Schottky Diode Device with Aluminum Pickup of Backside Cathode