Semiconductor device, manufacturing method thereof, and electronic apparatus

3D semiconductor device and structure

Sawing underfill in packaging processes

Methods for surface attachment of flipped active components

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Pattern decomposition lithography techniques

Fabrication method of semiconductor package

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

Electronic component-containing module

Semiconductor device and portable apparatus using the same

Method and device for improved die bonding

Via structure for packaging and a method of forming

Leadless electronic packages for GAN devices

Underfill control structures and method

Printed adhesion deposition to mitigate integrated circuit package delamination

Integrated circuit package and method of forming same

Method for aligning micro-electronic components

Trace design for bump-on-trace (BOT) assembly

Bond structures and the methods of forming the same

Scalable high-bandwidth connectivity

Semiconductor device for wafer-scale integration

Self-aligned under bump metal

STACKED INDUCTOR-ELECTRONIC PACKAGE ASSEMBLY AND TECHNIQUE FOR MANUFACTURING SAME

Integrated circuit

Leadframe strip assembly and method of processing

Semiconductor package having a leadframe with multi-level assembly pads

Component-embedded substrate and substrate flaw detecting method

Multilayer wiring board for an electronic device

Memory devices with controllers under memory packages and associated systems and methods

Multilayer pillar for reduced stress interconnect and method of making same

Three dimensional device integration method and integrated device

Semiconductor package having a variable redistribution layer thickness

CHIP CARRIER HAVING VARIABLY-SIZED PADS

Flex circuit for accessing pins of a chip carrier

Integrated circuit package substrate

Compact system with memory and PMU integration

Integrated circuit comprising a metal-insulator-metal capacitor and fabrication method thereof

Extrusion-resistant solder interconnect structures and methods of forming

Electrical package including bimetal lid

Semiconductor device having polyimide layer

Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure

Package system for integrated circuits

Electrical package including bimetal lid

Display device

Single-package wireless communication device

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Distribution of electronic circuit power supply potentials

Electronic component package and electronic device including the same

IC die, ultrasound probe, ultrasonic diagnostic system and method

Multilayer pillar for reduced stress interconnect and method of making same

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD

Electronic component package and method of manufacturing the same

Coating electronic component

Stitched devices

Chip-stacked semiconductor package and method of manufacturing the same

Recessed and embedded die coreless package

Integrated circuit, electronic device and method for transmitting data in electronic device

System in package

Integrated circuit package comprising surface capacitor and ground plane

Semiconductor systems having premolded dual leadframes

System and method for dual-region singulation

Pad structure for front side illuminated image sensor

Circuit package with segmented external shield to provide internal shielding between electronic components

Interposer-less stack die interconnect

Semiconductor device and process for fabricating the same

Electronic device

Illumination apparatus

Semiconductor chips including redistribution interconnections and related semiconductor packages

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Stacked silicon package assembly having an enhanced lid

Electronic device provided with an integral conductive wire and method of manufacture

Semiconductor device and a method of manufacturing the same

Package structures and method of forming the same

Semiconductor package structure and method for forming the same

Pillar design for conductive bump

Designs and methods for conductive bumps

Cu pillar bump with L-shaped non-metal sidewall protection structure

Dummy metal with zigzagged edges

METHOD FOR MAKING IC WITH STEPPED SIDEWALL AND RELATED IC DEVICES

Wireless communication with dielectric medium

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor device including semiconductor chip, wiring, conductive material, and contact part

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

Anisotropic conductive film including oblique region having lower curing ratio

Monolithic microwave integrated circuits

Fully molded miniaturized semiconductor module

Semiconductor device having terminals directly attachable to circuit board

Circuit board structure and method for manufacturing a circuit board structure

Non-volatile memory and devices that use the same

Projection display system

Wafer-level packaging using wire bond wires in place of a redistribution layer

Radio frequency integrated circuit module

Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components

Semiconductor device packages, packaging methods, and packaged semiconductor devices

METHOD AND STRUCTURE FOR LOW-K FACE-TO-FACE BONDED WAFER DICING

Semiconductor package with integrated semiconductor devices and passive component

Semiconductor device

INTEGRATED CIRCUIT WITH ON-DIE POWER DISTRIBUTION BARS

Semiconductor device

Method of processing wafer

High quality electrical contacts between integrated circuit chips

STRUCTURE AND LAYOUT OF BALL GRID ARRAY PACKAGES

Packaged device with additive substrate surface modification

Electrically conductive barriers for integrated circuits

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies

Method for packaging circuits

Stack frame for electrical connections and the method to fabricate thereof

Packaging structure

Formation of solder and copper interconnect structures and associated techniques and configurations

Packaging devices and methods of manufacture thereof

Opening in a multilayer polymeric dielectric layer without delamination

Semiconductor device and a method of manufacturing the same

Redistribution lines having stacking vias

Hybrid computing module

Hybrid computing module

Hybrid computing module

Self-destructing chip

Electric magnetic shielding structure in packages

Heatsink very-thin quad flat no-leads (HVQFN) package

Module substrate

Micro device transfer head heater assembly and method of transferring a micro device

Electronic device module and method of manufacturing the same

Protrusion bump pads for bond-on-trace processing

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

Interposer and circuit substrate

THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES

Semiconductor device

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

Stacked semiconductor device assembly in computer system

Methods of making semiconductor device packages and related semiconductor device packages

Anisotropic conductive film and production method of the same

Insulated die

Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Wafer backside interconnect structure connected to TSVs

Chip package

Semiconductor device and a method of manufacturing the same

Semiconductor device and bump formation process

Semiconductor integrated circuit device

Laminated interposers and packages with embedded trace interconnects

Multilayer semiconductor integrated circuit device

Semiconductor device and method of manufacture thereof

REMOVABLE SUBSTRATE FOR CONTROLLING WARPAGE OF AN INTEGRATED CIRCUIT PACKAGE

Semiconductor package in package

Apparatus, system, and method for wireless connection in integrated circuit packages

Semiconductor packages including interposer and methods of manufacturing the same

Light emitting device and method of manufacturing the same

Electronic device with periphery contact pads surrounding central contact pads

Semiconductor device package for debugging and related fabrication methods

Jig for fabricating semiconductor device

Electrically testable microwave integrated circuit packaging

Semiconductor chip with redundant thru-silicon-vias

Grid array connection device and method

Semiconductor device and manufacturing method thereof

Stacked semiconductor device

Apparatus for stacked semiconductor packages and methods of fabricating the same

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Shielded electronic component package

Electronic component package including electronic component, metal member, and sealing resin

Package for a surface-mount semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Limiting electronic package warpage with semiconductor chip lid and lid-ring

Semiconductor device, manufacturing method thereof, and electronic apparatus

Mechanisms of forming connectors for package on package

System, apparatus, and method for embedding a 3D component with an interconnect structure

Multi-functional composite structures

Semiconductor device

Conductive connections, structures with such connections, and methods of manufacture

Semiconductor package, printed circuit board substrate and semiconductor device

Method for forming crack-stopping structures

Semiconductor device and method of forming a thin wafer without a carrier

Circuit packages including modules that include at least one integrated circuit

Rigid-flex electronic module

MOSCAP-based circuitry for wireless communication devices, and methods of making and using the same

Semiconductor device, manufacturing method thereof, and electronic apparatus

Power semiconductor device and method therefor

Ball bonding metal wire bond wires to metal pads

Semiconductor structure with sacrificial anode and method for forming

Through-hole electrode substrate

Stacking arrangement for integration of multiple integrated circuits

Electronic device including a metal substrate and a semiconductor module embedded in a laminate

Double layer release temporary bond and debond processes and systems

Methods and apparatus for measuring analytes using large scale FET arrays

Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability

Method for low temperature bonding and bonded structure

Tooling for coupling multiple electronic chips

Method for permanent connection of two metal surfaces

Light sensitive switch for semiconductor package tamper detection

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Semiconductor device and method for manufacturing the same

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

Semiconductor device

Package on package (POP) device comprising solder connections between integrated circuit device packages

Laser die backside film removal for integrated circuit (IC) packaging

Methods for packaging integrated circuits

Methods of forming multiple conductive features in semiconductor devices in a same formation process

High-frequency device including high-frequency switching circuit

Structure and method to minimize warpage of packaged semiconductor devices

Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement

Semiconductor package with conductive clip

Reliable microstrip routing for electronics components

Semiconductor devices

Chip package and method for fabricating the same

Integrated circuit structure and method of forming

Semiconductor device and power supply unit utilizing the same

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor device and method of forming wafer level ground plane and power ring

Guard structure for signal isolation

Semiconductor device and a method of manufacturing the same

Circuit assemblies with multiple interposer substrates, and methods of fabrication

Die-on-interposer assembly with dam structure and method of manufacturing the same

Semiconductor device having electrode pads arranged between groups of external electrodes

Semiconductor device with sloped sidewall and related methods

Glass interposer with embedded thermoelectric devices

Semiconductor package with integrated output inductor using conductive clips

Semiconductor devices having insulating substrates and methods of formation thereof

3D pillar inductor

Electronic device and method for production

Metal bond pad with cobalt interconnect layer and solder thereon

Semiconductor device and a method of manufacturing the same

Staged via formation from both sides of chip

Methods and devices for fabricating and assembling printable semiconductor elements

Wiring board and mounting structure using the same

Semiconductor package assembly

Bumpless build-up layer package with pre-stacked microelectronic devices

Cooling channels in 3DIC stacks

Integrated circuit package having wirebonded multi-die stack

Window clamp

Chip part and method of making the same

Semiconductor device

Semiconductor device and wafer level package including such semiconductor device

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

Through-hole electrode substrate and semiconductor device using through-hole electrode substrate

Non-vertical through-via in package

System and method for dual-region singulation

METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES

Thermally-enhanced provision of underfill to electronic devices using a stencil

Methods and apparatus for measuring analytes using large scale FET arrays

Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module

Semiconductor device

Fan-out pop stacking process

Interconnect structure with redundant electrical connectors and associated systems and methods

Reducing wafer warpage during wafer processing

Stacked half-bridge package

Fan out system in package and method for forming the same

Embedded circuit package

Systems and Methods for Main Distribution on an Integrated Circuit

Laser drilling encapsulated semiconductor die to expose electrical connection therein

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Sealing epoxy resin composition, hardened product, and semiconductor device

Semiconductor device for preventing crack in pad region and fabricating method thereof

Integrated circuit array and method for manufacturing an array of integrated circuits

3D semiconductor package interposer with die cavity

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Packaging devices and methods of manufacture thereof

Semiconductor device security

Semiconductor device security

Integrated circuit package and method of making the same

Semiconductor module with mounting case and method for manufacturing the same

Stack package and semiconductor integrated circuit device including a variable voltage

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Integrated circuit underfill scheme

3D shielding case and methods for forming the same

Hybrid circuit device

Chip-on-wafer package and method of forming same

Leadless electronic packages for GaN devices

Semiconductor dies with recesses, associated leadframes, and associated systems and methods

Build-up package for integrated circuit devices, and methods of making same

Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

Electrostatic discharge protection for a balun

Low profile zero/low insertion force package top side flex cable connector architecture

Light-emitting apparatus

Integrated circuit packaging substrate, semiconductor package, and manufacturing method

Integrated antennas in wafer level package

Magnetically coupled galvanically isolated communication using lead frame

Switched power stage with integrated passive components

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection

Integrated circuit, electronic device and method for transmitting data in electronic device

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Laminated chip having microelectronic element embedded therein

Semiconductor device

Multiple die stacking for two or more die

Electronic assembly that includes stacked electronic devices

Coreless multi-layer circuit substrate with minimized pad capacitance

Repackaged integrated circuit and assembly method

Multi-die memory device

Integrated circuit with back side inductor

Organic light-emitting diode display and method of manufacturing the same with no cladding process

3D package with through substrate vias

Antenna cavity structure for integrated patch antenna in integrated fan-out packaging

Semiconductor package with embedded components and method of making the same

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Glass frit wafer bond protective structure

Circuit module and method of manufacturing the same

Method of manufacturing a circuit device

Electrical interconnect for an integrated circuit package and method of making same

Crosstalk reduction in electrical interconnects

Package with low stress region for an electronic component

Semiconductor device and method of manufacturing the same