212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
MOSFET package
#12602MOSFET package
#12603High current semiconductor device system having low resistance and inductance
#12604Semiconductor connection component
#12605Integrated circuit device
#126063D IC method and device
#12607Method and apparatus for fine pitch solder joint
#12608Manufacturing method of semiconductor device
#12609Semiconductor device and a manufacturing method of the same
#12610Multichip packages with exposed dice
#12611Thickness tapered substrate launch
#12612Bonding pad structure to minimize IMD cracking
#12613Semiconductor chip and multi-chip package
#12614Bonded structure and bonding method
#12615Tier structure with tier frame having a feedthrough structure
#12616Semiconductor device with improved contacts
#12617Semiconductor device and method of manufacturing the same
#12618Semiconductor component and method of manufacture
#12619Mount for a programmable electronic processing device
#12620Multi-chip semiconductor device package
#12621Thin IC package for improving heat dissipation from chip backside
#12622Differential chip performance within a multi-chip package
#12623Semiconductor device electronic component, circuit board, and electronic device
#12624Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector
#12625Semiconductor assembly and packaging for high current and low inductance
#12626Microelectronic imaging units
#12627Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#12628Method and apparatus for removing encapsulating material from a packaged microelectronic device
#12629Packaged integrated circuit having a heat spreader and method therefor
#12630Apparatuses and methods facilitating functional block deposition
#12631Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material
#12632Copper-metallized integrated circuits having electroless thick copper bond pads
#12633Solder composition for electronic devices
#12634Method of making a conformal electromagnetic interference shield
#12635Liquid crystal display devices
#12636Display device having an anisotropic-conductive adhesive film
#12637Self assembling display with substrate
#12638Method for fabricating semiconductor package with heat sink
#12639Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#12640Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#12641Semiconductor device
#12642Semiconductor device
#12643Integrated circuit with low-stress under-bump metallurgy
#12644Integrated circuit package and method of assembling the same
#12645Multilayered circuit substrate and semiconductor package structure using the same
#12646Power plane design and jumper wire bond for voltage drop minimization
#12647Application of autonomic self healing composites to integrated circuit packaging
#12648Semiconductor device and method of manufacturing the same
#12649Enhanced multi-die package
#12650Radio frequency over-molded leadframe package
#12651Semiconductor device
#12652Fluxless bumping process
#12653Semiconductor device and electronic instrument
#12654Semiconductor device and electronic instrument
#12655High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#12656METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#12657Method for manufacturing semiconductor device
#12658Metal pad or metal bump over pad exposed by passivation layer
#12659No flow underfill device and method
#12660Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#12661Method of making a stacked die package
#12662Scalable subsystem architecture having integrated cooling channels
#12663Multi-channel radiometer imaging system
#12664Technique for efficiently patterning an underbump metallization layer using a dry etch process
#12665Planar bond pad design and method of making the same
#12666Semiconductor element with conductive bumps and fabrication method thereof
#12667Semiconductor device and method of manufacturing the same
#12668Flip chip package with reduced thermal stress
#12669Bonding pad on IC substrate and method for making the same
#12670Technique for forming a copper-based contact layer without a terminal metal
#12671ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#12672Method of fabricating self-assembled electrical interconnections
#12673Self-assembled interconnection particles
#12674Electro-optic interconnection apparatus and method
#12675Semiconductor device, electronic module, and method of manufacturing electronic module
#12676Semiconductor package with ferrite shielding structure
#12677Microelectronic bond pad
#12678Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#12679Integrated circuit chip and integrated device
#12680Semiconductor device, power amplifier device and PC card
#12681Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
#12682Substrate based IC-package
#12683Copper substrate with feedthroughs and interconnection circuits
#12684Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package
#12685METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#12686Method of manufacturing an IC card
#12687Packaged integrated circuit with enhanced thermal dissipation
#12688IC with on-die power-gating circuit
#12689Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package
#12690Semiconductor device and oscillator
#12691Method of making an electronic assembly
#12692Packaging method
#12693Method and system for customized radio frequency shielding using solder bumps
#12694Biocompatible bonding method and electronics package suitable for implantation
#12695Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#12696Methods for forming flexible column die interconnects and resulting structures
#12697Self alignment features for an electronic assembly
#12698Forming of conductive bumps for an integrated circuit
#12699Method of forming a connecting conductor and wirings of a semiconductor chip
#12700Method for forming high reliability bump structure
#12701Semiconductor device and a method of manufacturing the same
#12702Circuit board structure integrated with semiconductor chip and method of fabricating the same
#12703Low profile, chip-scale package and method of fabrication
#12704Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
#12705Semiconductor device having a ferroelectric capacitator
#12706IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base
#12707IC chip mounting method
#12708Sub-mount for mounting optical component, manufacturing method thereof, and light transmission and reception module
#12709Device, system and electric element
#12710Integrated circuit pad with separate probing and bonding areas
#12711Relay board with bonding pads connected by wirings
#12712Security apparatus
#12713SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF
#12714Dummy structures extending from seal ring into active circuit area of integrated circuit chip
#12715Semiconductor integrated circuit device and process for manufacturing the same
#12716Wafer-level-chip-scale package and method of fabrication
#12717Reduced inductance in ball grid array packages
#12718Multi-component integrated circuit contacts
#12719Electronic component and electronic configuration
#12720Semiconductor device and method of manufacturing the same
#12721Packaging for high speed integrated circuits
#12722Composite metal column for mounting semiconductor device
#12723Apparatus and method for testing a multi-stack integrated circuit package
#12724Memory module with stacked semiconductor devices
#12725Stacked semiconductor package having adhesive/spacer structure and insulation
#12726Packaging for high speed integrated circuits
#12727Packaging for high speed integrated circuits
#12728Packaging for high speed integrated circuits
#12729Large die package structures and fabrication method therefor
#12730Packaging for high speed integrated circuits
#12731Packaging for high speed integrated circuits
#12732Electronic device and carrier substrate for same
#12733Split control pad for multiple signal
#12734High-frequency device including high-frequency switching circuit
#12735Semiconductor device and manufacturing method thereof
#12736Method and apparatus for providing a solder area on a leadframe
#12737Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#12738Electrically connecting substrate with electrical device
#12739Process for making a semiconductor device having a roughened surface
#12740Fabrication method of semiconductor circuit device
#12741Method and structure for interfacing electronic devices
#12742Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#12743Adhesive/spacer island structure for multiple die package
#12744Method for forming bump protective collars on a bumped wafer
#12745Closed ring structure of electrostatic discharge circuitry
#12746Semiconductor device and a manufacturing method of the same
#12747ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE
#12748Die pad arrangement and bumpless chip package applying the same
#12749Integrated circuit device and electronic instrument
#12750Method and structure for reduction of soft error rates in integrated circuits
#12751Probing pads in kerf area for wafer testing
#12752Electronic component unit
#12753Self alignment features for an electronic assembly
#12754Semiconductor device
#12755Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation
#12756Semiconductor power module with SiC power diodes and method for its production
#12757Multicolor LED assembly with improved color mixing
#12758MEMS packaging method for enhanced EMI immunity using flexible substrates
#12759Packaged integrated circuits and methods of producing thereof
#12760Packaging of a microchip device
#12761MEMS package using flexible substrates, and method thereof
#12762Method of making an electronic device using an electrically conductive polymer, and associated products
#12763Micro-package, multi-stack micro-package, and manufacturing method therefor
#12764Electronic component package including joint material having higher heat conductivity
#12765Method of selling integrated circuit dies for multi-chip packages
#12766Temperature dependent semiconductor module connectors
#12767Manufacturing method improving the reliability of a bump electrode
#12768Micro-optics on optoelectronics
#12769Integrated circuit for driving semiconductor device and power converter
#12770Semiconductor package having dual interconnection form and manufacturing method thereof
#12771Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#12772Seedless wirebond pad plating
#12773Semiconductor device
#12774Ball grid array package enhanced with a thermal and electrical connector
#12775SEMICONDUCTOR MULTI-CHIP PACKAGE
#12776Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#12777Surface mount package
#12778Multi-layered substrate assembly with vialess electrical interconnect scheme
#12779Advanced leadframe having predefined bases for attaching passive components
#12780Cavity ball grid array apparatus having improved inductance characteristics
#12781RFID tag and manufacturing method thereof
#12782Wafer-level, polymer-based encapsulation for microstructure devices
#12783Method for self-assembling microstructures
#12784Biocompatible bonding method and electronics package suitable for implantation
#12785Substrate warpage control and continuous electrical enhancement
#12786Method of reducing warpage in an over-molded IC package
#12787Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#12788Underfill device and method
#12789Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#12790Image display and manufacturing method thereof having particular internal wiring structure
#12791Apparatuses and methods for forming assemblies
#12792Soldering a die to a substrate
#12793Method of interconnecting terminals and method of mounting semiconductor devices
#12794Thermal interface material with carbon nanotubes and particles
#12795Semiconductor device advantageous in improving water resistance and oxidation resistance
#12796Under bump metallization design to reduce dielectric layer delamination
#12797Adhesive layer forming a capacitor dielectric between semiconductor chips
#12798BUMP FOR OVERHANG DEVICE
#12799Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#12800Anti-warp heat spreader for semiconductor devices
#12801System and method for venting pressure from an integrated circuit package sealed with a lid
#12802Apparatus having reduced warpage in an over-molded IC package
#12803Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#12804Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#12805Semiconductor die package and method for making the same
#12806Semiconductor device
#12807Die package with asymmetric leadframe connection
#12808Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion
#12809Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#12810Semiconductor device and method of manufacturing the same
#12811Bonding apparatus and method
#12812System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects
#12813Adhesive substrate and method for using
#12814Methods of operating electronic devices, and methods of providing electronic devices
#12815Circuitry component and method for forming the same
#12816Spacer die structure and method for attaching
#12817Wafer processing method
#12818Methods for bonding and micro-electronic devices produced according to such methods
#12819Method and apparatus for bonding wafers
#12820Method of manufacturing a semiconductor device
#12821Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#12822Standoffs for centralizing internals in packaging process
#12823Three dimensional device integration method and integrated device
#12824Grid array connection device and method
#12825Semiconductor integrated circuit device
#12826Mechanical integrity evaluation of low-k devices with bump shear
#12827Printed circuit board having embedded RF module power stage circuit
#12828Post passivation structure for a semiconductor device and packaging process for same
#12829Radio frequency receiver chip with improved electrostatic discharge level
#12830Semiconductor device
#12831Systems of miniaturized compatible radio frequency wireless devices
#12832Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor
#12833Molded stiffener for thin substrates
#12834Method of embedding semiconductor chip in support plate
#12835Multi-chip device and method for producing a multi-chip device
#12836Semiconductor device
#12837Semiconductor device and a method of manufacturing the same
#12838Intrinsic thermal enhancement for FBGA package
#12839In-package connection between integrated circuit dies via flex tape
#12840Packaging logic and memory integrated circuits
#12841Lead-free semiconductor package
#12842Reliable integrated circuit and package
#12843Semiconductor device
#12844Semiconductor device having firmly secured heat spreader
#12845Method of manufacturing semiconductor device
#12846Transmission-line spring structure
#12847Multi-chip device and method for producing a multi-chip device
#12848Semiconductor wafer package and manufacturing method thereof
#12849Method of manufacturing a semiconductor device
#12850Breakable interconnects and structures formed thereby
#12851Semiconductor packages and methods of manufacturing thereof
#12852Signal isolation in a package substrate
#12853Anodic bonding process for ceramics
#12854Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#12855Semiconductor integrated circuit device, electronic component mounting board and layout designing method for the semiconductor integrated circuit device
#12856Low stress chip attachment with shape memory materials
#12857Flip chip packaging using recessed interposer terminals
#12858Integrated circuit package and integrated circuit module
#12859Component with sensitive component structures and method for the production thereof
#12860Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
#12861Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit
#12862CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#12863Module having stacked chip scale semiconductor packages
#12864Manufacturing method for a semiconductor device
#12865Power semiconductor module
#12866Metal salts of maleimide compounds as conductivity promoters
#12867Positioning flowable solder for bonding integrated circuit elements
#12868Wiring board, method for manufacturing same, and semiconductor package
#12869Load compensator with pre-load compression
#12870Remote chip attachment
#12871Coaxial through chip connection
#12872Post-attachment chip-to-chip connection
#12873Tack & fuse chip bonding
#12874Routingless chip architecture
#12875Semiconductor device and method for manufacturing the same
#12876Rigid-backed, membrane-based chip tooling
#12877Through chip connection
#12878Packaging method and package using the same
#12879Chip-based thermo-stack
#12880Non-contact ID card and manufacturing method thereof
#12881Semiconductor device and method for manufacturing semiconductor device
#12882Probe card assembly and kit
#12883Pre-solder structure on semiconductor package substrate and method for fabricating the same
#12884Substrate for pre-soldering material and fabrication method thereof
#12885Chip spanning connection
#12886Inverse chip connector
#12887Chip connector
#12888Post & penetration interconnection
#12889Stack circuit member and method
#12890Triaxial through-chip connection
#12891Profiled contact
#12892Chip capacitive coupling
#12893Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#12894Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
#12895Electronic chip contact structure
#12896Patterned contact
#12897Ball grid array package with thermally-enhanced heat spreader
#12898Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
#12899Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
#12900Contact-based encapsulation