Leadless semiconductor package

Semiconductor arrangement and method for producing a semiconductor arrangement

Bond capillary design for ribbon wire bonding

Membrane-based chip tooling

Mounting device and method thereof

Capping copper bumps

Nickel bonding cap over copper metalized bondpads

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Superimposed displays

Electronic circuit protection device

Silicon wafer with solderable coating on its wafer rear side, and process for producing it

Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film

Semiconductor device having reduced number of external pad portions

Locking mechanism for die assembly

Semiconductor package and fabrication method thereof

Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method

Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor

Electronic package structures and methods

Stacked chip security

Lead frame with attached components

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip

Image sensor chip package and method of manufacturing the same

Heating apparatus

Wiring board and manufacturing method of wiring board

Biomarkers sensing

Semiconductor package and method for forming the same

Method for manufacturing antenna and method for manufacturing semiconductor device

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Semiconductor device and method for manufacturing the same

Method for connecting a semiconductor chip onto an interconnection support

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method of assembling semiconductor devices with LEDs

Method for fabricating sensor semiconductor device

Method and circuit structure employing a photo-imaged solder mask

Method and apparatus for moving blocks

Nanotube materials for thermal management of electronic components

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Methods for packaging an image sensor and a packaged image sensor

RFID tags and processes for producing RFID tags

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor element and manufacturing method thereof

Integrated-circuit die having redundant signal pads and related integrated circuit, system, and method

Semiconductor device

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Stackable tier structure comprising prefabricated high density feedthrough

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Structure and method for bond pads of copper-metallized integrated circuits

Method of making an electronic device using an electrically conductive polymer, and associated products

HIGH PERFORMANCE INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING THE SAME

Integrated circuit device

Taped semiconductor device and method of manufacture

Semiconductor device having capacitive insulation means and communication terminal using the device

Circuit device and method of manufacturing the same

Varied-thickness heat sink for integrated circuit (IC) package

Graded liquid crystal polymer package

Redistribution layer with microstrips

System for assembling electronic components of an electronic system

Integrated circuit package having stacked integrated circuits and method therefor

Semiconductor device modules, semiconductor devices, and microelectronic devices

Method for efficiently producing removable peripheral cards

Lead frame, semiconductor device, method for producing semiconductor device, and injection mold

Methods of making integrated circuits

Solder joints for copper metallization having reduced interfacial voids

Semiconductor bond pad structures and methods of manufacturing thereof

Self assembly of elements for displays

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Semiconductor device

Integrated circuit with substantially perpendicular wire bonds

Die-wafer package and method of fabricating same

Offset solder bump method and apparatus

Method and apparatus for RFID device assembly

Semiconductor device

System and method for die attach using a backside heat spreader

Semiconductor chip with coil element over passivation layer

Semiconductor integrated circuit device

Methods and apparatuses for encapsulating microelectronic devices

Chip structure with bevel pad row

Chip structure with arrangement of side pads

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Wafer level pre-packaged flip chip

Multilayer module and method of manufacturing the same

Sealing membrane for thermal interface material

Semiconductor device

Stacked chip package with redistribution lines

Micromodule, particularly for chip card

System-in-a-package based flash memory card

Semiconductor package and stack arrangement thereof

Leadframeless package structure and method

Backside method for fabricating semiconductor components with conductive interconnects

Microelectronic imagers and methods of packaging microelectronic imagers

Method and device for producing a bondable area region on a carrier

Low range bonding tool

Thermal management of systems having localized regions of elevated heat flux

NANO IC

Screen mask

Method of reducing process steps in metal line protective structure formation

Ball film for integrated circuit fabrication and testing

Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof

Electrical/optical integration scheme using direct copper bonding

Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

Method for manufacturing electronic component-embedded printed circuit board

Wafer level pre-packaged flip chip

Method and system for solder die attach

Wafer-level electro-optical semiconductor manufacture fabrication method

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Electronic assembly with controlled solder joint thickness

Wafer level pre-packaged flip chip system

Flip chip interconnect solder mask

Semiconductor device chip and semiconductor device chip package

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Stacked modules and method

Composite multi-layer substrate and module using the substrate

Semiconductor device with sealed semiconductor chip

Intelligent textile technology based on flexible semiconductor skins

Methods of packaging and testing microelectronic imaging devices

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Temperature measurement device of power semiconductor device

Technique for defining a wettable solder joint area for an electronic assembly substrate

Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate

Method for making a flat-top pad

Wiring-connecting material and wiring-connected board production process using the same

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Bond pad structure comprising multiple bond pads with metal overlap

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Metrology system and method for stacked wafer alignment

Stencil and method for depositing material onto a substrate

Bumpless semiconductor device

Device with area array pads for test probing

Terminal pad structures and methods of fabricating same

Semiconductor device with passivation layer covering wiring layer

Semiconductor device and fabrication method thereof

Method for fabricating structure of polymer-matrix conductive film

Large die package and method for the fabrication thereof

Bondwire utilized for coulomb counting and safety circuits

Dielectric isolation type semiconductor device and manufacturing method therefor

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

Spot heat wirebonding

Ball grid array assignment

Conductive bump structure for semiconductor device and fabrication method thereof

Methods of forming wire bonds for semiconductor constructions

Post bump passivation for soft error protection

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Stacked die package for peripheral and center device pad layout device

Three dimensional packaging optimized for high frequency circuitry

Methods for providing bias to a monolithic microwave integrated circuit

Power switching control device for electric systems

Method of fabricating a stacked integrated circuit package system

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Semiconductor device with a rewiring level and method for producing the same

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Multilayer printed wiring board

Fabrication of compliant spring contact structures and use thereof

Enhanced stress metal spring contactor

Gap control between interposer and substrate in electronic assemblies

Method of making a multi-chip electronic package having laminate carrier

Integrated circuit package and method for producing it

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Semiconductor integrated circuit device and its power supply wiring method

Circuit device

Microelectronic contact structure and method of making same

Carrying structure of electronic components

Semiconductor die edge reconditioning

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor package

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

System and method for enhancing wafer chip scale packages

Thermal enhanced low profile package structure

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor substrate

Semiconductor chip with fuse unit

Method for forming a metal layer in multiple steps

Multilayer printed wiring board

Semiconductor integrated circuit device and I/O cell for the same

Die attach adhesives with improved stress performance

Bumping process and bump structure

Increased stand-off height integrated circuit assemblies, systems, and methods

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Thin passivation layer on 3D devices

Underfill dispense at substrate aperture

Leadframe with encapsulant guide and method for the fabrication thereof

System for providing a redistribution metal layer in an integrated circuit

Method of forming a substrateless semiconductor package

Semiconductor device with self-aligning contactless interface

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Bonding pad for a packaged integrated circuit

Fan out type wafer level package structure and method of the same

Electronic devices including offset conductive bumps

Integrated circuit system for bonding

Thermally enhanced semiconductor package and fabrication method thereof

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Pillar grid array package

High density direct connect LOC assembly

Thin multiple semiconductor die package

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Semiconductor chip mounting body and manufacturing method thereof

Intermetallic Spring Structure

IC card

IC card

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating

Integrated heat spreader and method for using

Method of forming metal interconnect layers for flip chip device

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Ball grid array package stack

Semiconductor device and fabrication method thereof

Chip package

Multilayer circuit board and method of manufacturing the same

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Transferring die(s) from an intermediate surface to a substrate

Method of fabricating semiconductor chip assemblies

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor wafer coat layers and methods therefor

Integrated circuit edge protection method and apparatus

Leadless semiconductor package and manufacturing method thereof

Method of manufacturing enhanced thermal dissipation integrated circuit package

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Microelectronic imaging units having covered image sensors

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Self assembling display with substrate

Semiconductor device and an image sensing device

Boundary scan controller, semiconductor apparatus, semiconductor-circuit-chip identification method for semiconductor apparatus, and semiconductor-circuit-chip control method for semiconductor apparatus

Stacked die package

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

Semiconductor device

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Semiconductor device and method of manufacturing thereof

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Stacked semiconductor package

Vertically integrated system-in-a-package

Memory card with connecting portions for connection to an adapter

Memory card with connecting portions for connection to an adapter

IC card and method of manufacturing the same

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Controlling warping in integrated circuit devices

Lead frame for a magnetic sensor

Electronic package with a stepped-pitch leadframe