Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Multilayered printed circuit board and method for manufacturing the same

Method for mounting electronic component

Bond Surface Conditioning System for Improved Bondability

Relay module and electrical component unit

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Semiconductor heat-transfer method

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Methods and apparatuses for fluidic self assembly

Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink

Semiconductor device with improved encapsulation

Integrated circuit package encapsulating a hermetically sealed device

Plastic packaged device with die interface layer

Semiconductor device with reduced package cross-talk and loss

Semiconductor device and method for producing the same

Semiconductor package with controlled solder bump wetting

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Closed loop thermally enhanced flip chip BGA

Chip-packaging composition of resin and cycloaliphatic amine hardener

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Integrated chip device in a package

Semiconductor device that attains a high integration

Semiconductor component and methods to produce a semiconductor component

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Thin package system with external terminals

Wafer-to-wafer stack with supporting pedestal

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

I/O driver power distribution method for reducing silicon area

Method for forming solder contacts on mounted substrates

Mica tape having maximized mica content

System including a buffered memory module

Method for forming improved bump structure

Method for applying a structure of joining material to the back surfaces of semiconductor chips

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

Underfill aiding process for a tape

CHIP PACKAGE METHOD

Method of improving power distribution in wirebond semiconductor packages

Printed wiring board

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

Molded integrated circuit package with exposed active area

Semiconductor device with multiple designation marks

Re-enforced ball-grid array packages for semiconductor products

Method for manufacture of wafer level package with air pads

Semiconductor device having a semiconductor chip, and method for the production thereof

Chip packaging process

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Semiconductor device and communication system using the semiconductor device

Integrated circuit package system using etched leadframe

Semiconductor insulation structure

Method for producing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate

Lead pin, circuit, semiconductor device, and method of forming lead pin

Decoupling capacitor closely coupled with integrated circuit

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Stacked-type chip package structure

STACKED DIE PACKAGING SYSTEM

Semiconductor device and fabrication method thereof

Conductor substrate, semiconductor device and production method thereof

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Apparatus and method for providing bypass capacitance and power routing in QFP package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Semiconductor device and manufacturing method thereof

Method and apparatus for manufacturing IC chip packaged device

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Low stress conductive polymer bump

Apparatus for block assembly process

Dual-stage wafer applied underfills

Package for high frequency waves containing high frequency electronic circuit

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Universal chip package structure

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

Hybrid module and method of manufacturing the same

SEMICONDUCTORS AND METHODS OF MAKING

Intermetallic solder with low melting point

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor module having a coupling substrate, and methods for its production

Integrated circuit package system

Flexible substrate for package of die

Lead frame package structure with high density of lead pins arrangement

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Microelectronic interconnect substrate and packaging techniques

Wiring board, semiconductor device, and method of manufacturing the same

Methods and apparatuses relating to block receptor configurations and block assembly processes

Microelectronic package having multiple conductive paths through an opening in a support substrate

Method of manufacturing a semiconductor device including a bump forming process

Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device

Manufacturing method of semiconductor device

Microelectronic packages and methods therefor

Wiring board and capacitor

Chip embedded packaging structure

Electronic device with conductive connection structure

Module type multiphase inverter

Hard disk drive and wireless data terminal using the same

Method of forming a magnetic device having a conductive clip

Contact carriers (tiles) for populating larger substrates with spring contacts

Optical imaging device for optical proximity communication

Resonator system for optical proximity communication

Method and apparatus for facilitating proximity communication and power delivery

CHIP PACKAGE STRUCTURE

Package board and semiconductor device

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Semiconductor chip and semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Ultra-thin wafer system and method of manufacture thereof

Microelectronic package having direct contact heat spreader and method of manufacturing same

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Semiconductor device for radio frequency applications and method for making the same

Semiconductor device and radiation detector employing it

Integrated circuit package system with multi-surface die attach pad

Attachment system incorporating a recess in a structure

Electronic device and method of manufacturing thereof

Printed circuit board and manufacturing method thereof

Method of forming a power module with a magnetic device having a conductive clip

Metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors

Metal salts of quinolinols and quinolinol derivatives in curable compositions

Semiconductor device and method for manufacturing the same

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor constructions comprising multi-level patterns of radiation-imageable material

Method for separating package of WLP

Methods for protecting metal surfaces

Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology

Contacts to microdevices

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Modular bonding pad structure and method

Stackable device, device stack and method for fabricating the same

CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS

Component with chip through-contacts

Semiconductor device having shield structure

Packaged die on PCB with heat sink encapsulant and methods

Cavity chip package

Semiconductor IC-embedded substrate and method for manufacturing same

Gel package structural enhancement of compression system board connections

Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip

Bumpless chip package and fabricating process thereof

Integrated circuit solder bumping system

Molded semiconductor package

Radio recognition semiconductor device and its manufacturing method

Semiconductor device comprising a plurality of semiconductor constructs

Composite semiconductor light-emitting device

LSI design support apparatus and LSI design support method

Electric contact and method for producing the same and connector using the electric contacts

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Electronic plug unit

Package having balls designed to reduce contact resistance, test apparatus for testing the package, and method of manufacturing the package

Semiconductor device and a method of manufacturing the same

Method for patterning and etching a passivation layer

Method for manufacturing substrate with cavity

Semiconductor manufacturing method

Method of forming an electrical contact

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Method for manufacturing substrate with cavity

Method of forming a semiconductor device

Method for manufacturing substrate with cavity

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Decoupling capacitor closely coupled with integrated circuit

Ceramic capacitor

Wire sweep resistant semiconductor package and manufacturing method therefor

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Semiconductor device

Chip package structure and bumping process

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

Semiconductor package with internal shunt resistor

Integrated circuit package system with planar interconnects

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Chip package structure and bumping process

Integrated circuit protruding pad package system

Integrated circuit package system with adhesive restraint

Electronic assembly that includes pads having a bowl shaped upper section

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Method for manufacturing electronic modules

Monitoring deformation and time to logically constrain a bonding process

INDUCTIVE STRUCTURE

Semiconductor integrated circuit and layout designing method of the same

Flexible assembly of stacked chips

Rigid-flexible printed circuit board for package on package and manufacturing method

Method of forming an electrical contact

Fan out type wafer level package structure and method of the same

Apparatuses and methods for high speed bonding

Semiconductor chip having bond pads

Integrated circuit die configuration for packaging

Semiconductor device

Semiconductor device

Semiconductor chip having bond pads and multi-chip package

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Integrated circuit package and method of manufacture thereof

System in package (SIP) structure

Structure of IC packaging and method forming the same

Power semiconductor device and method therefor

Double-sided package for power module

Component mounting method and component-mounted body

Power connection for a thin film thermoelectric cooler

Bonding structure with buffer layer and method of forming the same

Method for fabricating a contact grid array

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Metal duplex method

Manufacturing method of electronic device

Electronic circuit module and manufacturing method thereof

Elastomer interposer with voids in a compressive loading system

Flip-chip packaging process using copper pillar as bump structure

Semiconductor device and method for fabricating the same

Metal duplex method

Integrated circuit chip and manufacturing process thereof

Electronic device and method of manufacturing thereof

Electronic device and method of manufacturing same

Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same

High density interconnect assembly comprising stacked electronic module

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Die pad for semiconductor packages and methods of making and using same

Quinolinols as fluxing and accelerating agents for underfill compositions

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Module, method of manufacturing module, and electronic apparatus using module

Method for producing means of connecting and/or soldering a component

Bumping process and structure thereof

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Stacked chip package using photosensitive polymer and manufacturing method thereof

Radiant energy heating for die attach

Multi-chip package type semiconductor device

Microfeature workpieces, carriers, and associated methods

Wafer-level package and IC module assembly method for the wafer-level package

Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Computing device including a stacked semiconductor device

Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods

Lithographic type microelectronic spring structures with improved contours

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Pad open structure

Chip package and bump connecting structure thereof

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Method for forming a double embossing structure

Wafer structure with a multi-layer barrier in an UBM layer network device with power supply

Alpha particle shields in chip packaging

Lead-containing solder bumps

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Lead-containing solder paste

Lead-containing anodes

Semiconductor device and semiconductor chip

Stacked chip package using warp preventing insulative material and manufacturing method thereof

Chip package structure

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Copper bump barrier cap to reduce electrical resistance

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Wiring board construction including embedded ceramic capacitors(s)

Printed circuit board assembly with strain-alleviating structures

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Quad flat pack (QFP) package and flexible power distribution method therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Reversible-multiple footprint package and method of manufacturing

Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure

Display panel package

Structures and methods for a flexible bridge that enables high-bandwidth communication

Semiconductor device and method of manufacturing the same

BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Integrated circuit device

Semiconductor device having reduced effective substrate resistivity and associated methods

Chip package and package process thereof

Method for producing semiconductor device and semiconductor device

Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system

Ternary alloy column grid array

Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate

High frequency package, transmitting and receiving module and wireless equipment

RFID inlays and methods of their manufacture

RFID inlays and methods of their manufacture

Two layer substrate ball grid array design

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method of packaging and interconnection of integrated circuits

Thermally enhanced cavity down ball grid array package

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Heat-conducting packaging of electronic circuit units

Bumpless chip package

Method of packaging and interconnection of integrated circuits

Semiconductor die package

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Semiconductor device