Flip chip metal bonding to plastic leadframe

Semiconductor chip stack structure and method for forming the same

Electronic device and method of manufacturing the same

Post passivation interconnection structures

Post passivation interconnection process and structures

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device having tin-based solder layer and method for manufacturing the same

Semiconductor device mounting structure for reducing thermal stress and warpage

Semiconductor device and method for manufacturing the same

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Semiconductor device, lead frame, and methods for manufacturing the same

Semiconductor device and wire bonding chip size package therefor

High density interconnect power and ground strap and method therefor

Module assembly for stacked BGA packages

Semiconductor device

Post passivation interconnection process and structures

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Method of making circuitized substrate

Method for reducing lead precipitation during wafer processing

Substrate grooves to reduce underfill fillet bridging

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Semiconductor chip packages and methods for fabricating the same

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Magnetic shielding for magnetic random access memory card

Methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Semiconductor chip, electrically connections therefor

Wire sweep resistant semiconductor package and manufacturing method thereof

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

Low stress conductive polymer bump

Semiconductor device having laminated structure

High-reliable semiconductor device using hermetic sealing of electrodes

Low temperature PB-free processing for semiconductor devices

Through-wafer interconnects for photoimager and memory wafers

Top layers of metal for high performance IC's

Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Structure and process of semiconductor package with an exposed heatsink

Structures and methods for heat dissipation of semiconductor integrated circuits

Semiconductor and method for producing a semiconductor

Air pocket resistant semiconductor package

Multichip module package and fabrication method

Apparatus for improved power distribution in wirebond semiconductor packages

Stacked packaging methods and structures

Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

Micro-electronic package structure and method for fabricating the same

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Bump structure of an opto-electronic chip

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Interposers for chip-scale packages and intermediates thereof

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Electronic device with a warped spring connector

Compressible films surrounding solder connectors

Method of forming vias on a wafer stack using laser ablation

Method for transferring a semiconductor body from a growth substrate to a support material

Method of making circuitized substrate

Attachment of integrated circuit structures and other substrates to substrates with vias

Method to build a wirebond probe card in a many at a time fashion

Methods for forming molds

Etched interposer for integrated circuit devices

Thermal fatigue resistant tin-lead-silver solder

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Electrode structure of a semiconductor device and method of manufacturing the same

Integrated inductors and compliant interconnects for semiconductor packaging

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Methods and systems for attaching die in stacked-die packages

Stacked wafer scale package

QFN package and method therefor

Multi-path bar bond connector for an integrated circuit assembly

Semiconductor device and resin structure therefor

Post passivation interconnection schemes on top of the IC chips

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Stretchable semiconductor elements and stretchable electrical circuits

Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages

High frequency module and manufacturing method thereof

Semiconductor element

Method and resulting structure for manufacturing semiconductor substrates

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Process and lead frame for making leadless semiconductor packages

Thermal protection for electronic components during processing

Methods and apparatuses for providing stacked-die devices

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Anisotropic conductive adhesive for fine pitch and COG packaged LCD module

Integrated circuit package including miniature antenna

Probe for semiconductor devices

Low profile, chip-scale package and method of fabrication

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Stacked packages

Multilayered anisotropic conductive adhesive for fine pitch

Wafer level package, multi-package stack, and method of manufacturing the same

Power gridding scheme

Fine pitch low-cost flip chip substrate

Hybrid integrated circuit device

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Systems and methods for wafer bonding by localized induction heating

Semiconductor device with sidewall wiring

Power gridding scheme

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Memory card with an adaptor

Electronic component packaging

Process and lead frame for making leadless semiconductor packages

Metal-metal bonding of compliant interconnect

Method for fabrication of semiconductor device

Wire bond with improved shear strength

Apparatus and method for printing micro metal structures

Method of manufacturing semiconductor wafer and method of manufacturing semiconductor device

System and method for low temperature plasma-enhanced bonding

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Programmable radio transceiver

Transmission-line spring structure

Packaged microelectronic devices and methods for packaging microelectronic devices

Selectively coating bond pads

Methods of forming lead free solder bumps

Apparatus for dividing an adhesive film mounted on a wafer

Method of fabricating semiconductor device

Semiconductor device and fabricating method thereof

Semiconductor device and fabricating method thereof

Method for fabricating semiconductor package with circuit side polymer layer

Intermetallic spring structure

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Structured integrated circuit device

Method and apparatus for contact resistance measurement

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits

Component arrangement having an evaluation circuit for detecting wear on connections

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Semiconductor package, method for fabricating the same, and semiconductor device

Method and apparatus for stacked die packaging

Stacked chip package with exposed lead-frame bottom surface

Semiconductor device

Stack type semiconductor apparatus package and manufacturing method thereof

Method and apparatus for forming metal contacts on a substrate

Method for forming metal contacts on a substrate

Bonding structure, wire bonding method, actuator device and liquid jet head

Optical or electronic module and method for its production

Manufacture of RFID tags and intermediate products therefor

No-flow underfill composition and method

Interconnect assemblies and methods

Surface treatment for oxidation removal in integrated circuit package assemblies

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Methods of forming wire bonds for semiconductor constructions

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Stacked chip electronic package having laminate carrier and method of making same

Power amplifier arrangement and method for processing a radiofrequency signal

Integrated circuit having an input/output terminal configurable within a given voltage range

Structured integrated circuit device

Semiconductor device with signal line having decreased characteristic impedance

Probe pad arrangement for an integrated circuit and method of forming

Front-end processing of nickel plated bond pads

Semiconductor device and method for manufacturing the same, package for LCD driver

Interconnects with interlocks

Electrical conducting structure and liquid crystal display device comprising the same

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Power semiconductor package having integral fluid cooling

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Methods of forming a multi-chip module having discrete spacers

Semiconductor device and manufacturing method thereof

Chip-under-tape package structure and manufacture thereof

Semiconductor package with stacked chips and method for fabricating the same

Solderable metal finish for integrated circuit package leads and method for forming

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

Metal bond pad for integrated circuits allowing improved probing ability of small pads

Apparatus and method for printing micro metal structures

Semiconductor package having a grid array of pin-attached balls

Die bonding apparatus

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Wafer-leveled chip packaging structure and method thereof

Method for the producing an integrated circuit bar arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement

Method for fabricating pad redistribution layer

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method

Magnetic shield for integrated circuit packaging

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Method for forming microelectronic spring structures on a substrate

Active plate-connector device with built-in semiconductor dies

Microelectronic component assemblies with recessed wire bonds and methods of making same

Die and die-package interface metallization and bump design and arrangement

Device having contact pad with a conductive layer and a conductive passivation layer

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Structure and formation method of conductive bumps

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Heterogeneous organic laminate stack ups for high frequency applications

Semiconductor package and method for its manufacture

IC with stably mounted chip

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit

Optical package for a semiconductor sensor

Semiconductor device and power supply unit utilizing the same

Damascene patterning of barrier layer metal for C4 solder bumps

Wirebonding method and apparatus

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Mounting method and mounting device

Vibratable die attachment tool

Encapsulating epoxy resin composition, and electronic parts device using the same

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Methods and apparatuses relating to block configurations and fluidic self-assembly processes

Castellation wafer level packaging of integrated circuit chips

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Methods of forming an integrated circuit package

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Methods of manufacturing microelectronic imaging units with discrete standoffs

Substrate for mounting IC chip

Semiconductor package including rivet for bonding of lead posts

Top layers of metal for high performance IC's

Design of beol patterns to reduce the stresses on structures below chip bondpads

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Connection between a semiconductor chip and a circuit component with a large contact area

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Circuit device with at least partial packaging and method for forming

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Heat dissipation device for integrated circuits

Semiconductor chip assembly with metal containment wall and solder terminal

Integrated circuit die with pedestal

Wafer-level assembly method for semiconductor devices

Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

IMPROVED DECAL SOLDER TRANSFER METHOD

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

RFID tag and method of manufacturing RFID tag

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Stacked semiconductor chips

Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device

Castellation wafer level packaging of integrated circuit chips

Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor

Manufacturing method for magnetic sensor and lead frame therefor

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Stacked structure of integrated circuits

Method of forming a micro solder ball for use in C4 bonding process

BGA package with concave shaped bonding pads

Microelectronic devices

Flip-chip without bumps and polymer for board assembly

Bonding pad and chip structure

Semiconductor component and assembly having female conductive members

Castellation wafer level packaging of integrated circuit chips

Semiconductor component having stacked, encapsulated dice and method of fabrication

Multi-chip package having heat dissipating path

Ultrathin module for semiconductor device and method of fabricating the same

Plastic encapsulated semiconductor device with reliable down bonds

Silicon building block architecture with flex tape

Image sensor package and method of manufacturing the same

Semiconductor integrated circuit device

Under bump metallurgy process on passivation opening

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Highly compliant plate for wafer bonding

Modified chip attach process and apparatus

Stacked package electronic device

Optoelectronic packaging with embedded window

Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other

In-line wire bonding on a package, and method of assembling same

Circuit device and manufacturing method thereof

Electronic assembly having multi-material interconnects

Package stress management

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Chip-to-chip trench circuit structure

Direct connection multi-chip semiconductor element structure

Packaging stacked chips with finger structure

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multi-component integrated circuit contacts

Integrated circuit package including embedded thin-film battery

Electronic package and semiconductor device using the same

Package Structure

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Taped lead frames and methods of making and using the same in semiconductor packaging

Component interconnect with substrate shielding

Semiconductor device, optoelectronic board, and production methods therefor

Semiconductor device with electrostatic discharge protection device near the edge of the chip

Circular wire-bond pad, package made therewith, and method of assembling same

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Method of stacking wafers with anisotropic conductive adhesive

Microelectronic devices and methods for forming interconnects in microelectronic devices

Method for encapsulating lead frame packages

Semiconductor chip package manufacturing method including screen printing process

Electronic device package

Carrier for substrate film

Method and apparatus for mapping a position of a capillary tool tip using a prism

Apparatus of antenna with heat slug and its fabricating process

Pad-limited integrated circuit

Electrostatic discharge (ESD) protection for integrated circuit packages