Techniques for microchannel cooling

Method of removing integrated circuit chip package and detachment jig therefor

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Fabrication method of semiconductor integrated circuit device

Electronic device with high lead density

Process for fabricating chip embedded package structure

Device and method for fabricating double-sided SOI wafer scale package with through via connections

Micro-machined structure production using encapsulation

Component feeding head apparatus, for holding a component arrayed

Hybrid card

Method for mounting an electronic element on a wiring board

Power amplifier module

System-in-package type semiconductor device

Methods and systems for rise-time improvements in differential signal outputs

Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor

Die attach material for TBGA or flexible circuitry

Semiconductor chip capable of implementing wire bonding over active circuits

Flip chip system with organic/inorganic hybrid underfill composition

Socket grid array

Heat sinking structure

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Heater for annealing trapped charge in a semiconductor device

Modular construction component with encapsulation

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Multi-chip package

Carrier for substrate film

Integrated circuit package system with leadframe substrate

Bump formation method and bump forming apparatus for semiconductor wafer

Semiconductor system with fine pitch lead fingers

Liquid metal droplet generator

Adhesion apparatus

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Active area bonding compatible high current structures

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Tolerance bondwire inductors for analog circuitry

Injection molded metal bonding tray for integrated circuit device fabrication

High density direct connect loc assembly

Flip chip underfilling

Wire positioning and mechanical attachment for a radio-frequency indentification device

Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor

Semiconductor device

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

Semiconductor chip capable of implementing wire bonding over active circuits

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Method and structure to reduce risk of gold embrittlement in solder joints

Wafer structure, chip structure and bumping process

Semiconductor wafer with electrically connected contact and test areas

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Chip package with grease heat sink

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Multi chip package

Electronic device package and electronic equipment

IC chip package with isolated vias

Stepped integrated circuit packaging and mounting

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having post-mold nickel/palladium/gold plated leads

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

Microcomputer chip with function capable of supporting emulation

Integrated circuit die with logically equivalent bonding pads

Structured semiconductor element for reducing charging effects

Methods for designing and tuning one or more packaged integrated circuits

Electrical contact and connector and method of manufacture

Neo-wafer device comprised of multiple singulated integrated circuit die

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Bumping process

Bumping process and structure thereof

Integrated circuit die configuration for packaging

Method for reducing semiconductor die warpage

Thermal enhance package and manufacturing method thereof

Die stacking scheme

Method of manufacturing a wafer assembly

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Semiconductor device and method for manufacturing same

Bond pad structure for integrated circuit chip

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Semiconductor device, circuit board, electro-optic device, electronic device

Bond pad structure with stress-buffering layer capping interconnection metal layer

Fine pitch bonding pad layout and method of manufacturing same

Semiconductor package with heat sink and method for fabricating same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor module, process for producing the same, and film interposer

Semiconductor device and a method for manufacturing of the same

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Stacked semiconductor multi-chip package

Flexible leaded stacked semiconductor package

Fan out type wafer level package structure and method of the same

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Low cost power MOSFET with current monitoring

Film circuit substrate having Sn-In alloy layer

Processes for packing memory cards by single mold

Bumping process and structure thereof

Chip package, chip packaging, chip carrier and process thereof

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Using an interposer to facilate capacitive communication between face-to-face chips

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Packaged device and method of forming same

Substrate structure with embedded chip of semiconductor package and method for fabricating the same

Chip-size package structure and method of the same

Bumping process and structure thereof

Molded high density electronic packaging structure for high performance applications

Compliant interconnects for semiconductors and micromachines

Functional coating of the SCFM preform

Multi-layer integrated semiconductor structure having an electrical shielding portion

IC (integrated circuit) card

Thermally enhanced molded package for semiconductors

Stacked multiple integrated circuit die package assembly

System to control effective series resistance of power delivery circuit

IC substrate and manufacturing method thereof and semiconductor element package thereby

Rfid tag

Thermal management of systems having localized regions of elevated heat flux

Semiconductor device having element portion and control circuit portion

Iridium oxide nanowires and method for forming same

Device for bonding a metal on a surface of a substrate

Circuit carrier and production thereof

Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer

Method for making electronic packages

Methods of making microelectronic packages with conductive elastomeric posts

Method for fabricating packaged die

Packaging method for an electronic element

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Structure of polymer-matrix conductive film and method for fabricating the same

Method of forming a bond pad on an I/C chip and resulting structure

Integrated circuit package employing a heat-spreader member

Fabrication of semiconductor dies with micro-pins and structures produced therewith

Electronic part mounting apparatus and method

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Semiconductor HBT MMIC device and semiconductor module

Method and process of contact to a heat softened solder ball array

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Semiconductor device and manufacturing method for the same

Method for manufacturing wafer level chip scale package using redistribution substrate

Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

Method for temporarily engaging electronic component for test

Bonding structure of device packaging

Memory card structure and manufacturing method thereof

Folded substrate with interposer package for integrated circuit devices

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Semiconductor package using flip-chip mounting technique

Post passivation interconnection schemes on top of the IC chips

Non-Circular via holes for bumping pads and related structures

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

3D interconnect with protruding contacts

Memory card structure

Attachment of integrated circuit structures and other substrates to substrates with vias

Die attach paddle for mounting integrated circuit die

Integrated circuit package employing a flexible substrate

Electronic device and method for fabricating the same

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Flip chip bonding tool

Electronic flame-off electrode with ball-shaped tip

Contour structures to highlight inspection regions

Method of forming bump that may reduce possibility of losing contact pad material

Semiconductor electrical connection structure and method of fabricating the same

Fabrication of stacked die and structures formed thereby

Die handling system

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Mold compound interlocking feature to improve semiconductor package strength

Structure and method for fabricating a bond pad structure

Semiconductor device and manufacturing method thereof

Copper interposer for reducing warping of integrated circuit packages and method of making IC packages

Methods to deposit metal alloy barrier layers

Copper interconnect

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Semiconductor package

Semiconductor device

Method of forming a stacked semiconductor package

Semiconducting device that includes wirebonds

Apparatus of antenna with heat slug and its fabricating process

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Film substrate of a semiconductor package and a manufacturing method

Lead frame and light receiving module comprising it

Integrated circuit with at least one bump

Module assembly for multiple die back-illuminated diode

Chip interconnect and packaging deposition methods and structures

Underfill compositions and methods for use thereof

Semiconductor substrate thinning method for manufacturing thinned die

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Post passivation interconnection schemes on top of the IC chips

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Radio frequency module and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Production method of anisotropic conductive sheet

Package stress management

Semiconductor device

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Electronic device

Chip package

COF flexible printed wiring board and method of producing the wiring board

Packaging structure for imaging detectors

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Method and apparatus for depopulating peripheral input/output cells

Top layers of metal for integrated circuits

Post passivation interconnection schemes on top of the IC chips

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

Semiconductor device and method for manufacturing the same

Wafer scale integration packaging and method of making and using the same

Method for attaching a semiconductor die to a substrate and heat spreader

Semiconductor package having a heat slug and manufacturing method thereof

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Method for producing a packaged integrated circuit

Stacked die module and techniques for forming a stacked die module

High performance amine based no-flow underfill materials for flip chip applications

Semiconductor device packaged into chip size and manufacturing method thereof

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Radiant energy heating for die attach

Post passivation interconnection schemes on top of the IC chips

Interconnection structure of integrated circuit chip

Electronic circuit including circuit-connecting material

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Pad structure to prompt excellent bondability for low-k intermetal dielectric layers

Semiconductor device having a switch circuit

Electronic package having a folded package substrate

Chip structure

Semiconductor device

Assembly for stacked BGA packages

Materials, structures and methods for microelectronic packaging

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Bond pad redistribution layer for thru semiconductor vias and probe touchdown

Microelectronic packaging and components

Method of stacking thin substrates by transfer bonding

Semiconductor device and fabrication process thereof

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Wafer level packages and methods of fabrication

Wire bond pads

Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Fabricating method of wafer protection layers

Method of forming a wafer backside interconnecting wire

Method for producing a stack of chips, a stack of chips and method for producing a chip for a multi-chip stack

Method of forming a surface mountable IC and its assembly

Thermally controlled fluidic self-assembly

Power module package having excellent heat sink emission capability and method for manufacturing the same

Flexible device, flexible pressure sensor, and fabrication method thereof

Semiconductor module

Semiconductor package having flash-free contacts and techniques for manufacturing the same

Sensor device having stopper for limitting displacement

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Semiconductor chip with flexible contacts at a face

Semiconductor packages

Method of fabricating a semiconductor die package having improved inductance characteristics

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Bump structure

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Methods of forming semiconductor packages

Packaging with metal studs formed on solder pads

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

Wireless chip and manufacturing method of the same

Robust power semiconductor package

Semiconductor packages

Integrated circuit package with open substrate

Semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

IC card and method of manufacturing the same

Non-contact ID card and the like and method for manufacturing same

Methods for forming conductive bumps and wire loops

Joining apparatus

Top layers of metal for high performance IC's

Module assembly and method for stacked BGA packages

Microprobe tips and methods for making

Electronic assemblies having a low processing temperature

Method for manufacturing electronic component-mounted board

Chip assembly reinforcement

Conductive lithographic polymer and method of making devices using same

Thermally controlled fluidic self-assembly method and support

Electronic apparatus and design method

Integrated antenna type circuit apparatus

Semiconductor package having a partial slot cover for encapsulation process

Method of embedding semiconductor chip in support plate and embedded structure thereof