212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Method and structure for manufacturing improved yield semiconductor packaged devices
#14402Circuit film with bump, film package using the same, and related fabrication methods
#14403Semiconductor device with wire bond inductor and method
#14404Semiconductor device with magnetically permeable heat sink
#14405Semiconductor package with exposed heat sink and the heat sink thereof
#14406Method of forming semiconductor constructions
#14407Forming buried via hole substrates
#14408Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
#14409Ultra thin dual chip image sensor package structure and method for fabrication
#14410Integrated transistor module and method of fabricating same
#14411High-frequency circuit
#14412Semiconductor constructions
#14413Method for manufacturing a semiconductor device
#14414Methods of forming vias in multilayer substrates
#14415Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
#14416Circuit apparatus provided with asperities on substrate surface
#14417Semiconductor device
#14418Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
#14419Electronic assembly with carbon nanotube contact formations or interconnections
#14420In-situ alloyed solders, articles made thereby, and processes of making same
#14421Die attach area cut-on-fly method and apparatus
#14422Apparatus and method for indexing of substrates and lead frames
#14423Method and apparatus for measuring the size of free air balls on a wire bonder
#14424Capillary for wire bonding
#14425Flange-mounted transducer
#14426Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
#14427Stud bump socket
#14428Method of forming a thin wafer stack for a wafer level package
#14429Semiconductor layer structure and method of making the same
#14430High density bonding of electrical devices
#14431FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF
#14432Method for encapsulating multiple integrated circuits
#14433Heat spreader in integrated circuit package
#14434Selecting groups of dies for wafer testing
#14435Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#14436Semiconductor device module with flip chip devices on a common lead frame
#14437Thermal interposer for thermal management of semiconductor devices
#14438Method for manufacturing wafer level chip stack package
#14439Semiconductor device with base support structure
#14440Semiconductor bonding and layer transfer method
#14441Semiconductor memory device
#14442Interposer containing bypass capacitors for reducing voltage noise in an IC device
#14443Semiconductor die package with internal bypass capacitors
#14444Electronic assembly having an indium wetting layer on a thermally conductive body
#14445Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
#14446Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#14447Ground plane for integrated circuit package
#14448Apparatus for providing capacitive decoupling between on-die power and ground conductors
#14449Memory card with a cap having indented portions
#14450Printed wiring board
#14451Semiconductor device and manufacturing method therefor
#14452Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#14453Co-packaged control circuit, transistor and inverted diode
#14454Semiconductor package having integrated metal parts for thermal enhancement
#14455Semiconductor assembly having substrate with electroplated contact pads
#14456Vertical memory device structures
#14457Wafer bonding method
#14458Semiconductor product having a first and at least one further semiconductor circuit and method
#14459Semiconductor device
#14460Method of forming a lead-free bump and a plating apparatus therefor
#14461Compliant spring contact structures
#14462Machine vision systems for use with programmable material consolidation system and associated methods and structures
#14463Fabrication method of wafer level chip scale packages
#14464Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
#14465Method for fabricating chip structure
#14466Compliant interconnect and method of formation
#14467Microfeature devices and methods for manufacturing microfeature devices
#14468Compound semiconductor device and manufacturing method thereof
#14469Method for forming bump on electrode pad with use of double-layered film
#14470Chip scale package with open substrate
#14471High density flip chip interconnections
#14472Encapsulation for particle entrapment
#14473Heat-decaying materials, transfer sheet using the same, and patterning method
#14474Manufacturing method of semiconductor device
#14475Integrated circuit device with compliant bumps and testing method for testing the integrated circuit device
#14476Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
#14477Capping of metal interconnects in integrated circuit electronic devices
#14478Semiconductor apparatus and method of manufacturing semiconductor apparatus
#14479Lead-free conductive jointing bump
#14480Method of forming a solder bump and the structure thereof
#14481Pre-doped reflow interconnections for copper pads
#14482Package and method for packaging an integrated circuit die
#14483High density multilayer circuit module
#14484Internal package heat dissipator
#14485Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly
#14486High density chip scale leadframe package and method of manufacturing the package
#14487Method and system for improved wire bonding
#14488Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus
#14489Packaged microelectronic imagers and methods of packaging microelectronic imagers
#14490Microelectronic imagers and methods of packaging microelectronic imagers
#14491Separately strained N-channel and P-channel transistors
#14492Compound semiconductor device and manufacturing method thereof
#14493Method and stencil for extruding material on a substrate
#14494Spread spectrum isolator
#14495Circuit device
#14496Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#14497RF isolator for isolating voltage sensing and gate drivers
#14498RF isolator with differential input/output
#14499Transformer isolator for digital power supply
#14500Methods for making electronic devices with small functional elements supported on a carriers
#14501Electronic devices with small functional elements supported on a carrier
#14502Method of making photolithographically-patterned out-of-plane coil structures
#14503Electrical contact
#14504Optimized driver layout for integrated circuits with staggered bond pads
#14505Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#14506Semiconductor device and method capable of scribing chips with high yield
#14507Semiconductor component and system having thinned, encapsulated dice
#14508Semiconductor device having adhesion increasing film to prevent peeling
#14509Stacked semiconductor package having adhesive/spacer structure and insulation
#14510Ball grid array housing having a cooling foil
#14511Semiconductor package including redistribution pattern and method of manufacturing the same
#14512Carrier for stacked type semiconductor device and method of fabricating the same
#14513Package for sealing an integrated circuit die
#14514Adhesive/spacer island structure for stacking over wire bonded die
#14515Internal package heat dissipator
#14516Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#14517On chip transformer isolator
#14518Flip chip FET device
#14519Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#14520Method and stencil for extruding material on a substrate
#14521Novel aqueous based metal etchant
#14522Wire-bonding method for chips with copper interconnects by introducing a thin layer
#14523Manufacturing method of semiconductor device
#14524Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#14525Module with multiple power amplifiers and power sensors
#14526Integrated circuit packages with reduced stress on die and associated methods
#14527Top layers of metal for high performance IC's
#14528Manufacturing methods for semiconductor structures having stacked semiconductor devices
#14529Encapsulated chip and method of fabrication thereof
#14530Refractory solid, adhesive composition, and device, and associated method
#14531Wiring substrate and method of fabricating the same
#14532ESD protection designs with parallel LC tank for giga-hertz RF integrated circuits
#14533ESD protection designs with parallel LC tank for giga-hertz RF integrated circuits
#14534Semiconductor integrated circuit device and method for fabricating the same
#14535Integrated power amplifier module with power sensor
#14536Circuit device and manufacturing method thereof
#14537Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier
#14538Method for manufacturing circuit device
#14539Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#14540Circuit device and manufacturing method thereof
#14541Chip structure and process for forming the same
#14542Semiconductor device
#14543Integrated circuit assemblies and assembly methods
#14544Integrated circuit package with optimized mold shape
#14545Asymmetric bump structure
#14546Semiconductor device and method of manufacturing the same
#14547Semiconductor device including amplifier and frequency converter
#14548Circuit device and manufacturing method thereof
#14549Method of fabricating a semiconductor device used in a stacked-type semiconductor device
#14550Semiconductor device and manufacturing process therefor
#14551Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
#14552IC chip package
#14553Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#14554Semiconductor device and a method of manufacturing the same
#14555System and method for forming one or more integrated circuit packages using a flexible leadframe structure
#14556Integrated circuit leadframe and fabrication method therefor
#14557Semiconductor device and method for manufacturing the same
#14558Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#14559Circuit device with dummy elements
#14560Fingerprint sensor package
#14561Semiconductor device and manufacturing method thereof
#14562Wire bonding method and apparatus for integrated circuit
#14563Semiconductor device with a floating gate electrode that includes a plurality of particles
#14564Selective packaging of tested semiconductor devices
#14565Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
#14566Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
#14567Method of manufacturing circuit device
#14568Circuit device and manufacturing method thereof
#14569Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
#14570Multi-band tunable resonant circuit
#14571Top layers of metal for high performance IC's
#14572Electronic and optoelectronic component packaging technique
#14573Circuit device, manufacturing method thereof, and sheet-like board member
#14574Method for fabrication of wafer level package incorporating dual compliant layers
#14575Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14576Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14577Integrated ball and via package and formation process
#14578Dual row leadframe and fabrication method
#14579Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#14580Multiple die package with adhesive/spacer structure and insulated die surface
#14581Double density method for wirebond interconnect
#14582Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#14583Chip heat sink device and method
#14584Semiconductor device and manufacturing process thereof
#14585Adhesive/spacer island structure for multiple die package
#14586Semiconductor device and method of manufacturing the same
#14587Packaged integrated circuit with MLP leadframe and method of making same
#14588Image sensor package module with a leadless leadframe between chips
#14589Power composite integrated semiconductor device and manufacturing method thereof
#14590Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool
#14591Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#14592Semiconductor die attachment for high vacuum tubes
#14593Packaging of a microchip device
#14594Method and system for deflashing mold compound
#14595Method of manufacturing semiconductor device
#14596Void free solder arrangement for screen printing semiconductor wafers
#14597Method and resulting structure for manufacturing semiconductor substrates
#14598Method for assembling semiconductor die packages with standard ball grid array footprint
#14599Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#14600Methods for producing an electronic device having microscopically small contact areas
#14601Microelectronic devices and methods for packaging microelectronic devices
#14602Web fabrication of devices
#14603Method to build robust mechanical structures on substrate surfaces
#14604Multilayer substrate including components therein
#14605Light emitting diodes for high AC voltage operation and general lighting
#14606Method for testing using a universal wafer carrier for wafer level die burn-in
#14607Method for testing using a universal wafer carrier for wafer level die burn-in
#14608Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
#14609Vibration-assisted method for underfilling flip-chip electronic devices
#14610Universal interconnect die
#14611Flip chip package and process of forming the same
#14612Method for integrating pre-fabricated chip structures into functional electronic systems
#14613Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#14614Electronic device package structures
#14615Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#14616Integrated circuit packaging method and structure for redistributing configuration thereof
#14617Integrated passive devices
#14618Package design and method for electrically connecting die to package
#14619Chip embedded package structure
#14620Semiconductor device structure with adhesion-enhanced semiconductor die
#14621Semiconductor die attachment for high vacuum tubes
#14622Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
#14623Method of forming an array of semiconductor packages
#14624Semiconductor device
#14625Large die package structures and fabrication method therefor
#14626Die package
#14627Semiconductor micro device
#14628Microelectronic assembly having a perimeter around a MEMS device
#14629Method of bumping die pads for wafer testing
#14630IC card module
#14631Lead wire bonding method
#14632Wiring board and semiconductor package using the same
#14633RFID label technique
#14634Under bump metallization layer to enable use of high tin content solder bumps
#14635Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#14636Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
#14637Semiconductor device and fabricating method thereof
#14638Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#14639Method and apparatus for shielding integrated circuits
#14640Method of magnetic field assisted self-assembly
#14641Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
#14642Whisker inhibition in tin surfaces of electronic components
#14643Current sensor
#14644Electronic device with high lead density
#14645Chip scale package with heat spreader
#14646Multi-chip package with high-speed serial communications between semiconductor die
#14647Mounting with auxiliary bumps
#14648Embedded chip semiconductor without wire bondings
#14649CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE
#14650Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#14651High data rate chip mounting
#14652Electronic circuit package
#14653Array capacitors in interposers, and methods of using same
#14654Resin-encapsulated semiconductor apparatus and process for its fabrication
#14655Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
#14656Circuit device
#14657Optical surface mount technology package
#14658Leads under chip IC package
#14659Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
#14660Methods of forming conductive through-wafer vias
#14661Selectable decoupling capacitors for integrated circuits and associated methods
#14662Compositions for use in electronics devices
#14663Linear split axis wire bonder
#14664Method of using capacitive bonding in a high frequency integrated circuit
#14665Sealing and protecting integrated circuit bonding pads
#14666Top layers of metal for high performance IC's
#14667Methods of forming solder bumps on exposed metal pads
#14668Single row bond pad arrangement
#14669Semiconductor device and manufacturing method thereof
#14670Package design using thermal linkage from die to printed circuit board
#14671Method for making an interconnect pad
#14672Implementation of protection layer for bond pad protection
#14673Shielded laminated structure with embedded chips
#14674Method and apparatus for synthesizing high-frequency signals for wireless communications
#14675INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
#14676Customizing back end of the line interconnects
#14677Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device
#14678Electrode pad arrangement with open side for waste removal
#14679Semiconductor chip having pads with plural junctions for different assembly methods
#14680Integrated circuit die for wire bonding and flip-chip mounting
#14681Integrated circuit ground system
#14682FCBGA package structure
#14683Semiconductor component having multiple stacked dice
#14684Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#14685Structure of package
#14686LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
#14687Image sensor with a protection layer
#14688Structure of image sensor module and a method for manufacturing of wafer level package
#14689Test circuit under pad
#14690Method for low loop wire bonding
#14691Flip chip bonding tool and ball placement capillary
#14692Method for manufacturing an interconnect
#14693Method of making a semiconductor device using bump material including a liquid
#14694Compliant multi-composition interconnects
#14695Method for producing a BGA chip module and BGA chip module
#14696Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#14697Method for testing using a universal wafer carrier for wafer level die burn-in
#14698Method for testing using a universal wafer carrier for wafer level die burn-in
#14699Method for testing using a universal wafer carrier for wafer level die burn-in
#14700Semiconductor chip having pads with plural junctions for different assembly methods