IC module assembly

Semiconductor device and hybrid integrated circuit device

Semiconductor device in which semiconductor chip is mounted on lead frame

Fan out type wafer level package structure and method of the same

Optical device and method for fabricating the same

Semiconductor device, semiconductor circuit and method for producing semiconductor device

Semiconductor device

Laminate ceramic circuit board and process therefor

Semiconductor integraged circuit device and method of routing interconnections for semiconductor IC device

Compliant interconnect assembly

Method for making an anisotropic conductive film pointed conductive inserts

Method and apparatus for improved power routing

Bump structure for a semiconductor device and method of manufacture

Method for manufacturing semiconductor device having solder layer

Method of manufacturing multi-stack package

Semiconductor device and a method of manufacturing the same

MEMS device wafer-level package

Systems and methods for filling voids and improving properties of porous thin films

Semiconductor device

Semiconductor device

Functional printed circuit board module with an embedded chip

Integrated circuit and method for manufacturing same

Microelectronic assembly having a redistribution conductor over a microelectronic die

Bonding pad structure and method of forming the same

Wafer level chip scale packaging structure and method of fabricating the same

CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE

Semiconductor device, magnetic sensor, and magnetic sensor unit

NANO IC packaging

Semiconductor packages, and methods of forming semiconductor packages

Power semiconductor arrangement

Display device

Chip bonding heater with differential heat transfer

Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module

CHIP PACKAGING STRUCTURE

Semiconductor integrated circuit

LSI package provided with interface module, and transmission line header employed in the package

Semiconductor device

High performance system-on-chip discrete components using post passivation process

Electronic component, mounted structure, electro-optical device, and electronic device

Power semiconductor switching devices and power semiconductor devices

Thin film device, integrated circuit, electrooptic device, and electronic device

Programmable radio transceiver

Small array contact with precision working range

Electronic component mounting method and apparatus and ultrasonic bonding head

Packaging assembly utilizing flip chip and conductive plastic traces

Electronic device and method of manufacture the same

Method for fabricating encapsulated semiconductor components

Packaging method for integrated circuits

Method for manufacturing semiconductor device

Amplification of HIV-1 gag sequences for detection of sequences associated with drug-resistance mutations

Conductive material for integrated circuit fabrication

Adhesive of folded package

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Method for embedding a component in a base

Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits

Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits

Heat curable adhesive composition, article, semiconductor apparatus and method

Method of fabricating electrical connection terminal of embedded chip

Electronic component mounting method and apparatus

Circuit device and method of manufacturing the circuit device

Circuit board, device mounting structure, device mounting method, and electronic apparatus

Wafer level mounting frame for ball grid array packaging, and method of making and using the same

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Integrated circuit package and method having wire-bonded intra-die electrical connections

Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus

Die with discrete spacers and die spacing method

Semiconductor package with heat dissipating structure and method of manufacturing the same

Chip package structure and chip packaging process

Thermal dissipation in integrated circuit systems

Method for maintaining solder thickness in flipchip attach packaging processes

CHIP PACKAGE STRUCTURE

Thermally enhanced component interposer: finger and net structures

System for reducing or eliminating semiconductor device wire sweep

Chip fixed structure

Integrated circuit device having flexible leadframe

Leadless semiconductor package and manufacturing method thereof

Method for bonding wafers to produce stacked integrated circuits

Spacer die structure and method for attaching

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Power semiconductor switching-device and semiconductor power module using the device

Integrated circuit with intergrated capacitor and methods for making same

Semiconductor device for power MOS transistor module

Circuit design for increasing charge device model immunity

Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device

Mounting substrate and mounting method of electronic part

Component mounting substrate and structure

Current sensor

Wafer support and release in wafer processing

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Wafer stacking using interconnect structures of substantially uniform height

Self-coplanarity bumping shape for flip-chip

Method of making chip package with grease heat sink

Circuitry module

Semiconductor integrated circuit device

Capillary underfill channel

Semiconductor device

Semiconductor flip-chip package and method for the fabrication thereof

Self-coplanarity bumping shape for flip chip

Die down semiconductor package

Use of palladium in IC manufacturing with conductive polymer bump

Semiconductor device

Microelectronic assembly having encapsulated wire bonding leads

Interposer including adhesive tape

Semiconductor device of a charge storage type

Semiconductor device with non-overlapping chip mounting sections

Method and semiconductor device having copper interconnect for bonding

Spacer die structure and method for attaching

Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Underfill fluxing curative

Circuit board for connecting an integrated circuit to a support and IC BGA package using same

Fixture and method for uniform electroless metal deposition on integrated circuit bond pads

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Methods of forming bumps using barrier layers as etch masks

METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME

Low fabrication cost, high performance, high reliability chip scale package

Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Method for manufacturing semiconductor device

Land grid array packaged device and method of forming same

Lower profile flexible substrate package for electronic components

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor device assembly method and semiconductor device assembly apparatus

BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE

Switched-capacitor power supply system and method

Sim, sim holder, ic module, ic card and ic card holder

Programmable radio transceiver

Motor driving system having power semiconductor module life detection function

Adhesion by plasma conditioning of semiconductor chip surfaces

Semiconductor device

Stacked die for inclusion in standard package technology

Multichip semiconductor package

Semiconductor device and manufacturing metthod thereof

Under bump metallization layer to enable use of high tin content solder bumps

Chip package and process thereof

Electric wave readable data carrier manufacturing method, substrate, and electronic component module

Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment

Copper interconnect

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Semiconductor device

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit device

Vertically stacked semiconductor device

Multilayer integrated circuit for RF communication and method for assembly thereof

Integrated circuit die and substrate coupling

Semiconductor device and method of manufacturing the same

Lead on chip semiconductor package

Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating

Semiconductor apparatus and method of fabricating the apparatus

Integrated circuit module package and assembly method thereof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Top layers of metal for high performance IC's

Solder bump structure and method for forming a solder bump

Methods for forming electrical connections and resulting devices

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Thin flip-chip method

Manufacturing method of semiconductor device

Clock distribution networks and conductive lines in semiconductor integrated circuits

Embedded power management control circuit

Manufacturing method for semiconductor device and determination method for position of semiconductor element

Marking on underfill

System and method for attenuating electromagnetic interference

Semiconductor device and method of manufacturing the same

Multi-flip chip on lead frame on over molded IC package and method of assembly

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier

Die package with higher useable die contact pad area

Module with integrated active substrate and passive substrate

Method of sensor packaging

Thin semiconductor package including stacked dies

Methods and apparatus for packaging integrated circuit devices

Circuit device and manufacturing method thereof

Semiconductor package having step type die and method for manufacturing the same

Semiconductor chip and display device using the same

Method for processing electrical components, especially semiconductor chips, and device for carrying out the method

Method of fabricating a wire bond with multiple stitch bonds

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Thin-film semiconductor device and method of manufacturing the same

Flip chip packaging process

Manufacturing and testing of electrostatic discharge protection circuits

Semiconductor chip capable of implementing wire bonding over active circuits

Apparatus and method for attaching a heat sink to an integrated circuit module

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Top layers of metal for high performance IC's

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device with increased number of external connection electrodes

Integrated circuit bond pad structures and methods of making

Bump and fabricating process thereof

Package structure with two solder arrays

Semiconductor package

Semiconductor package without bonding wires and fabrication method thereof

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Two solder array structure with two high melting solder joints

Semiconductor element and wafer level chip size package therefor

Semiconductor stack package and memory module with improved heat dissipation

Semiconductor device and manufacturing method thereof

Semiconductor device and electronic device

Semiconductor device with interlocking clip

Electronic component having an integrated passive electronic component and associated production method

Wire bonding apparatus having actuated flame-off wand

Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument

System and method for forming mold caps over integrated circuit devices

Underfill system for die-over-die arrangements

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Semiconductor device and method of manufacturing the same

Apparatuses and methods for forming assemblies

High frequency module board device

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Power amplifier module for wireless communication devices

Integrated circuit package with keep-out zone overlapping undercut zone

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and manufacturing method for the same

Bonding structure and fabrication thereof

Electrical connection materials and electrical connection methods

Integrated circuit with re-route layer and stacked die assembly

Semiconductor device and manufacturing method of the same

Integrated circuit package with chip-side signal connections

Testable electrostatic discharge protection circuits

Semiconductor devices and manufacturing method therefor

Radio frequency arrangement and production method and also use

Electrical contact

Method to prevent passivation layer peeling in a solder bump formation process

Semiconductor packaging techniques for use with non-ceramic packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Via structure of packages for high frequency semiconductor devices

Electronic component, method of manufacturing the electronic component, and electronic apparatus

Test head assembly having paired contact structures

Thermionic vacuum diode device with adjustable electrodes

Semiconductor device assembly process

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor device

Packaged die on PCB with heat sink encapsulant and methods

Semiconductor package with crossing conductor assembly and method of manufacture

Apparatus for encapsulating a multi-chip substrate array

Interconnect system without through-holes

Semiconductor device

Packaging substrates for integrated circuits and soldering methods

Method of surface mounting a semiconductor device

Semiconductor device support structures

Multiple die package

Configurable integrated circuit capacitor array using via mask layers

IC card

Chip package sealing method

Spring biased socket system

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components

Method and apparatus for fabricating self-assembling microstructures

Method of manufacturing semiconductor device

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Intrinsic thermal enhancement for FBGA package

Semiconductor device manufacturing method and manufacturing apparatus

spliced film carrier tape

Apparatus and method for die attachment

Light emitting diodes for high AC voltage operation and general lighting

RF package

Semiconductor package for lowering electromagnetic interference and method for fabricating the same

Semiconductor integrated circuit device

Method and structure for interfacing electronic devices

Daisy chaining of serial I/O interface on stacking devices

Semiconductor device

Optimized power delivery to high speed, high pin-count devices

Electronic component and method for producing the same

Semiconductor device and a memory system including a plurality of IC chips in a common package

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

High density lead arrangement package structure

High performance system-on-chip using post passivation process

ESD protection designs with parallel LC tank for Giga-Hertz RF integrated circuits

Laser cleaning system for a wire bonding machine

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Single mask via method and device

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Semiconductor device and method of manufacturing same

Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Optoelectronic hybrid integrated module and light input/output apparatus having the same as component

Method of producing a digital fingerprint sensor and the corresponding sensor

Electronic circuit module

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Thermal head and bonding connection method therefor

Semiconductor component having stiffener, stacked dice and circuit decals

Semiconductor device with capacitor

Thermally enhanced metal capped BGA package

Method for fabricating semiconductor component with stiffener and circuit decal

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device

Semiconductor memory device and defect remedying method thereof

System semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system

Method for preparing integrated circuit modules for attachment to printed circuit substrates

Adhesive, method of connecting wiring terminals and wiring structure

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same