212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Group III nitride based flip-chip integrated circuit and method for fabricating
#15602Method and apparatus for a dual substrate package
#15603Reinforced bond pad
#15604Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad
#15605Apparatus for connecting an IC terminal to a reference potential
#15606Spacerless die stacking
#15607Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
#15608Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
#15609Fabrication of semiconductor dies with micro-pins and structures produced therewith
#15610Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
#15611Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit
#15612Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device
#15613Semiconductor device and manufacturing method thereof
#15614Fluxes for flip chip assembly using water soluble polymers
#15615Fine pitch electronic flame-off wand electrode
#15616Hybrid integrated circuit device and method of manufacturing the same
#15617Method of manufacturing a module
#15618Circuit carrier and production thereof
#15619Manufacturing method of electronic components embedded substrate
#15620ULTRA-FINE CONTACT ALIGNMENT
#15621System having semiconductor component with encapsulated, bonded, interconnect contacts
#15622Bonding pad structure to minimize IMD cracking
#15623Method for mounting passive components on wafer
#15624Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#15625Integrated circuit die/package interconnect
#15626Microelectronic devices and methods for packaging microelectronic devices
#15627I/C chip suitable for wire bonding
#15628Designs and methods for conductive bumps
#15629Package assembly for electronic device
#15630Single chip and stack-type chip semiconductor package and method of manufacturing the same
#15631Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks
#15632Substrate with terminal pads having respective single solder bumps formed thereon
#15633Integrating chip scale packaging metallization into integrated circuit die structures
#15634Electronically grounded heat spreader
#15635Semiconductor integrated circuit and electronic apparatus having the same
#15636Semiconductor device having heat dissipation layer
#15637Electronic package having a folded flexible substrate and method of manufacturing the same
#15638Reinforced die pad support structure
#15639Semiconductor device and method for fabricating the same
#15640Receptacle for a programmable, electronic processing device
#15641Method of fabrication of semiconductor integrated circuit device
#15642Via placement for layer transitions in flexible circuits with high density ball grid arrays
#15643Method of fixing a sealing object to a base object
#15644Method for the lateral contacting of a semiconductor chip
#15645Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
#15646Method of manufacturing semiconductor device
#15647Semiconductor apparatus and method for fabricating the same
#15648Silicon platform for optical modules
#15649Head assembly, disk unit, and bonding method and apparatus
#15650Semiconductor device capable of detecting an open bonding wire using weak current
#15651Discrete semiconductor component
#15652Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
#15653Electrical circuit assembly with improved shock resistance
#15654Super-thin high speed flip chip package
#15655Semiconductor device
#15656Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof
#15657High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#15658Lead frame with flag support structure
#15659Method of encapsulating interconnecting units in packaged microelectronic devices
#15660Circuit device and manufacturing method of circuit device
#15661Lead frame
#15662Semiconductor package with through-hole
#15663Semiconductor dice with edge cavities
#15664Stress sensitive microchip with premolded-type package
#15665Method of locating conductive spheres utilizing screen and hopper of solder balls
#15666Apparatus for locating conductive spheres utilizing screen and hopper of solder balls
#15667Electronic component and method of manufacturing the same
#15668Thermal interface adhesive
#15669Method for manufacturing a piezoelectric oscillator
#15670Semiconductor device and method of manufacturing the same
#15671Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same
#15672Wire bonding method, semiconductor chip, and semiconductor package
#15673Solder bump structure and method for forming the same
#15674System and method for marking the surface of a semiconductor package
#15675Memory card
#15676Method for producing display device
#15677Display device
#15678Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit
#15679Integrated circuit package
#15680I/O architecture for integrated circuit package
#15681Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#15682Semiconductor device
#15683Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#15684Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
#15685Clock distribution networks and conductive lines in semiconductor integrated circuits
#15686Semiconductor device and method of manufacturing the same
#15687Stacked chip package having upper chip provided with trenches and method of manufacturing the same
#15688Integrated circuit package with leadframe enhancement and method of manufacturing the same
#15689Lead frame, manufacturing method of the same, and semiconductor device using the same
#15690Semiconductor device having transferred integrated circuit
#15691Stress-controlled dielectric integrated circuit
#15692Semiconductor package
#15693Method and system for stud bumping
#15694Coupler resource module
#15695Radiation shielded semiconductor package
#15696Electrical contact and connector and method of manufacture
#15697Electrical contact and connector and method of manufacture
#15698Method for chemical etch control of noble metals in the presence of less noble metals
#15699Bond pad techniques for integrated circuits
#15700Ball film for integrated circuit fabrication and testing
#15701No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
#15702Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
#15703Microbeam assembly and associated method for integrated circuit interconnection to substrates
#15704Super high density module with integrated wafer level packages
#15705Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit
#15706Direct write™ system
#15707Resin-encapsulated semiconductor apparatus and process for its fabrication
#15708Flip chip stacked package
#15709Flip-chip package
#15710Multi-dice chip scale semiconductor components
#15711Buried solder bumps for AC-coupled microelectronic interconnects
#15712Zero capacitance bondpad utilizing active negative capacitance
#15713Pad structures including insulating layers having a tapered surface
#15714Flip-chip interconnect with increased current-carrying capability
#15715Adhesive sheet for producing a semiconductor device
#15716Electronic devices with small functional elements supported on a carrier
#15717Electronic package with insert conductor array
#15718Array-molded package heat spreader and fabrication method therefor
#15719Leadframe-based mold array package heat spreader and fabrication method therefor
#15720Leadless semiconductor package
#15721Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same
#15722Chip stack package and manufacturing method thereof
#15723Integrated circuit package having inductance loop formed from a bridge interconnect
#15724Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
#15725Integrated circuit package having an inductance loop formed from a multi-loop configuration
#15726Semiconductor device using bumps, method for fabricating same, and method for forming bumps
#15727Thermal conductive material utilizing electrically conductive nanoparticles
#15728IC card
#15729Wafer-level chip scale package
#15730Wirebonding insulated wire and capillary therefor
#15731Circuit board and method of manufacturing the same
#15732Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
#15733Method for forming plating film
#15734Wire bonding for thin semiconductor package
#15735Method of enhancing the adhesion between photoresist layer and substrate and bumping process
#15736Active area bonding compatible high current structures
#15737Fluxless assembly of chip size semiconductor packages
#15738Method for fabricating surface acoustic wave filter packages and package sheet used therein
#15739Semiconductor device and method for production thereof
#15740Process for making contact with and housing integrated circuits
#15741Methods for processing semiconductor devices in a singulated form
#15742Phase change thermal interface materials including polyester resin
#15743Boron nitride agglomerated powder
#15744High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#15745Electric circuit substrate
#15746Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
#15747Flip chip die bond pads, die bond pad placement and routing optimization
#15748Semiconductor integrated circuit device
#15749Semiconductor integrated circuit device
#15750Near hermetic power chip on board device and manufacturing method therefor
#15751[CHIP STRUCTURE]
#15752Package module for an IC device and method of forming the same
#15753High-frequency semiconductor device
#15754Heat dissipation apparatus for package device
#15755Semiconductor package with improved chip attachment and manufacturing method thereof
#15756Circuit device
#15757Semiconductor device
#15758Area array type package stack and manufacturing method thereof
#15759Semiconductor device including a semiconductor chip mounted on a metal base
#15760Interconnections
#15761Wirebonded assemblage method and apparatus
#15762Aqueous based metal etchant
#15763Method of metal sputtering for integrated circuit metal routing
#15764High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
#15765Apparatus and method for force mounting semiconductor packages to printed circuit boards
#15766Singulation method used in leadless packaging process
#15767Semiconductor device using bumps, method for fabricating same, and method for forming bumps
#15768Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same
#15769Flip chip on lead frame
#15770Process for producing a semiconductor device
#15771Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion
#15772Method for manufacturing semiconductor devices
#15773Semiconductor packaging structure and method for forming the same
#15774Method for manufacturing high-frequency module device
#15775Electrochemical cell and fabrication method of the same
#15776Semiconductor electronic device and method of manufacturing thereof
#15777Wire bonding method for copper interconnects in semiconductor devices
#15778Die-up ball grid array package including a substrate having an opening and method for making the same
#15779Semiconductor chip with bumps and method for manufacturing the same
#15780Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
#15781Semiconductor package having light sensitive chips
#15782Probe card assembly
#15783Apparatus and methods for coverlay removal and adhesive application
#15784Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
#15785Asymmetric plating
#15786Method of creating a photonic via using deposition
#15787Method for reducing defects in post passivation interconnect process
#15788Low fabrication cost, fine pitch and high reliability solder bump
#15789Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation
#15790Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#15791Fabrication method of semiconductor device
#15792Structure and method for fine pitch flip chip substrate
#15793PROBE TIP DESIGN APPLIED IN A FLIP CHIP PACKAGING PROCESS
#15794Method for creating adhesion during fabrication of electronic devices
#15795Electronic circuit device
#15796High frequency circuit module
#15797Semiconductor device
#15798Semiconductor device and wire bonding apparatus
#15799Under bump metallurgic layer
#15800Tin/indium lead-free solders for low stress chip attachment
#15801Apparatus and method for packaging circuits
#15802Multi-functional solder and articles made therewith, such as microelectronic components
#15803Semiconductor device structural body and electronic device
#15804Enhanced die-up ball grid array and method for making the same
#15805Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts
#15806Integrated circuit package with overlapping bond fingers
#15807Semiconductor device and an electronic device
#15808Stacked mass storage flash memory package
#15809Multi-chip package and manufacturing method thereof
#15810Module with embedded semiconductor IC and method of fabricating the module
#15811Semiconductor device and method of manufacturing thereof
#15812Lead-frame-based semiconductor package and fabrication method thereof
#15813Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
#15814Topless semiconductor package
#15815Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus
#15816Semiconductor module and DC-DC converter
#15817Protection circuit device using MOSFETs and a method of manufacturing the same
#15818Molded stiffener for thin substrates
#15819Multi-functional solder and articles made therewith, such as microelectronic components
#15820Wire bonders and methods of wire-bonding
#15821Circuit board
#15822Multi-functional solder and articles made therewith, such as microelectronic components
#15823Integrated underfill process for bumped chip assembly
#15824Enhanced stress metal spring contactor
#15825Semiconductor processing methods
#15826Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates
#15827ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER
#15828Fabrication of stacked microelectronic devices
#15829Bonding structure with pillar and cap
#15830Semiconductor integrated circuit device
#15831Fabrication of stacked microelectronic devices
#15832Ultrathin leadframe BGA circuit package
#15833Conductive block mounting process for electrical connection
#15834Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#15835Manufacturing method of semiconductor device
#15836Packaged microelectronic components
#15837Method of bonding semiconductor devices
#15838Power supply device
#15839Voltage protection device
#15840Electronic component protected against electrostatic discharges
#15841Millimeter wave (MMW) radio frequency transceiver module and method of forming same
#15842High frequency circuit using high output amplifier cell block and low output amplifier cell block
#15843Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
#15844Pad over active circuit system and method with meshed support structure
#15845Nickel bonding cap over copper metalized bondpads
#15846High reliability chip scale package
#15847Semiconductor device with strain relieving bump design
#15848Method for assembling a ball grid array package with multiple interposers
#15849Multi-chips module package and manufacturing method thereof
#15850Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#15851Curable encapsulant compositions
#15852Techniques for packaging a multiple device component
#15853Semiconductor device and its manufacturing method
#15854Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane
#15855Stacked chip-packaging structure
#15856Method for fabricating semiconductor component with chip on board leadframe
#15857Semiconductor component having chip on board leadframe
#15858Electronic device package
#15859Semiconductor chip with fuse unit
#15860Standoffs for centralizing internals in packaging process
#15861Mount for semiconductor light emitting device
#15862Semiconductor device and manufacturing method thereof
#15863Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps
#15864Printed wiring board and manufacturing method therefor
#15865Printed circuit board with a heat dissipation element and package comprising the printed circuit board
#15866Method of making a semiconductor device having an opening in a solder mask
#15867Nickel bonding cap over copper metalized bondpads
#15868Stable electroless fine pitch interconnect plating
#15869Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#15870Method for forming bump protective collars on a bumped wafer
#15871Bumping process
#15872Methods of forming conductive structures including titanium-tungsten base layers and related structures
#15873Semiconductor integrated circuit device and process for manufacturing the same
#15874Method for making electronic devices including silicon and LTCC and devices produced thereby
#15875Charge coupled device package
#15876Semiconductor package having semiconductor constructing body and method of manufacturing the same
#15877Fabrication method of semiconductor integrated circuit device
#15878Nucleation of diamond films using higher diamondoids
#15879Computer system including at least one stress balanced semiconductor package
#15880Memory package
#15881Methods and devices for providing bias to a monolithic microwave integrated circuit
#15882Module part
#15883Method and apparatus for processing semiconductor devices in a singulated form
#15884IC chip with improved pillar bumps
#15885Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same
#15886Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#15887Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
#15888Wirebond pad for semiconductor chip or wafer
#15889Semiconductor component having conductors with wire bondable metalization layers
#15890Semiconductor device with connections for bump electrodes
#15891Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
#15892Structure of multi-tier wire bonding for high frequency integrated circuit
#15893Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#15894Interconnecting component
#15895Ball grid array structures having tape-based circuitry
#15896Interposer and method of making same
#15897Method for forming a chip package
#15898Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it
#15899Process for fabricating a semiconductor package and semiconductor package with leadframe
#15900[PROCESS FOR FABRICATING BUMPS]